Supporting assembly for electronic device

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Description

FIG. 1 is a perspective view of a first component of a supporting assembly for electronic device showing my design, the first component shown separately for clarity of illustration in a first position.

FIG. 2 is a front elevational view of the first component illustrated in FIG. 1.

FIG. 3 is a rear elevational view of the first component illustrated in FIG. 1.

FIG. 4 is a left-side elevational view of the first component illustrated in FIG. 1.

FIG. 5 is a right-side elevational view of the first component illustrated in FIG. 1.

FIG. 6 is a top plan view of the first component illustrated in FIG. 1.

FIG. 7 is a bottom plan view of the first component illustrated in FIG. 1.

FIG. 8 is a perspective view of a second component of a supporting assembly for electronic device showing my design, the second component shown separately for clarity of illustration.

FIG. 9 is a front elevational view of the second component illustrated in FIG. 8.

FIG. 10 is a rear elevational view of the second component illustrated in FIG. 8.

FIG. 11 is a left-side elevational view of the second component illustrated in FIG. 8.

FIG. 12 is a right-side elevational view of the second component illustrated in FIG. 8.

FIG. 13 is a top plan view of the second component illustrated in FIG. 8.

FIG. 14 is a bottom plan view of the second component illustrated in FIG. 8.

FIG. 15 is a perspective view of a first component of a supporting assembly for electronic device showing my design, the first component shown separately for clarity of illustration in a second position.

FIG. 16 is a front elevational view of the first component illustrated in FIG. 15.

FIG. 17 is a rear elevational view of the first component illustrated in FIG. 15.

FIG. 18 is a left-side elevational view of the first component illustrated in FIG. 15.

FIG. 19 is a right-side elevational view of the first component illustrated in FIG. 15.

FIG. 20 is a top plan view of the first component illustrated in FIG. 15.

FIG. 21 is a bottom plan view of the first component illustrated in FIG. 15.

FIG. 22 is a perspective view of the second component illustrated in FIG. 8 attached to the first component illustrated in FIG. 15, the first component shown in the second position.

FIG. 23 is a front elevational view of the second component attached to the first component shown in FIG. 22.

FIG. 24 is a rear elevational view of the second component shown attached to the first component shown in FIG. 22.

FIG. 25 is a left-side elevational view the second component shown attached to the first component shown in FIG. 22.

FIG. 26 is a right-side elevational view of the second component shown attached to the first component shown in FIG. 22.

FIG. 27 is a top plan view of the second component shown attached to the first component shown in FIG. 22.

FIG. 28 is a bottom plan view of the second component shown attached to the first component shown in FIG. 22.

FIG. 29 is a perspective view of the first component illustrated in FIG. 1 attached to a car seat, the first component shown in the first position; and,

FIG. 30 is a perspective view of the first component with a second component attached to a car seat, the first component and the second component shown in the second position.

The broken lines shown in the drawings represent portions of the supporting assembly for electronic device which form no part of the claimed design.

Claims

The ornamental design for a supporting assembly for electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D457506 May 21, 2002 Scribner
D670295 November 6, 2012 Prescott et al.
D688253 August 20, 2013 Cho et al.
D692439 October 29, 2013 Muhlenberg
D692897 November 5, 2013 Luijben
D697516 January 14, 2014 Feldstein et al.
D709511 July 22, 2014 Sparks et al.
D712394 September 2, 2014 Booth et al.
20060092127 May 4, 2006 Chen
20060104014 May 18, 2006 Cherone et al.
20060109388 May 25, 2006 Sanders et al.
20130193174 August 1, 2013 Ackeret et al.
20140346167 November 27, 2014 De Angelis
Patent History
Patent number: D732046
Type: Grant
Filed: Jan 22, 2014
Date of Patent: Jun 16, 2015
Assignee: HON HAI PRECISION INDUSTRY CO., LTD. (New Taipei)
Inventors: Chia-Yen Lee (New Taipei), Chia-Chieh Cheng (New Taipei), Wei-Che Chen (New Taipei)
Primary Examiner: Angela J Lee
Application Number: 29/480,040
Classifications
Current U.S. Class: Support Or Base (D14/447)