Headphone assembly

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Description

FIG. 1 is a front perspective view of a headphone assembly according to our design shown in a first configuration thereof;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a back elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top elevation view thereof;

FIG. 7 is a bottom elevation view thereof;

FIG. 8 is a rear perspective view of the headphone assembly of FIG. 1, shown in a second configuration thereof;

FIG. 9 is a front elevation view thereof;

FIG. 10 is a back elevation view thereof;

FIG. 11 is a right side elevation view thereof;

FIG. 12 is a left side elevation view thereof;

FIG. 13 is a top elevation view thereof; and,

FIG. 14 is a bottom elevation view thereof.

Broken lines are environmental only and form no part of the claimed design.

Claims

The ornamental design for a headphone assembly, as shown and described.

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Patent History
Patent number: D742356
Type: Grant
Filed: May 15, 2014
Date of Patent: Nov 3, 2015
Assignee: Google Inc. (Mountain View, CA)
Inventors: Haley Toelle (San Francisco, CA), Jianchun Dong (Palo Alto, CA), Michael Kai Morishita (Belmont, CA), Eliot Kim (Cupertino, CA)
Primary Examiner: Paula Greene
Application Number: 29/490,945
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)