Coil for wireless charger
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The broken lines in the figures are for environmental purposes only and form no part of the claimed design.
Claims
We claim, The ornamental design for a coil for wireless charger, as shown and described.
Referenced Cited
Patent History
Patent number: D747268
Type: Grant
Filed: Apr 22, 2014
Date of Patent: Jan 12, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Do-Won Kim (Suwon-si), Kyu-Sub Kwak (Seoul), Sung-Bum Park (Suwon-si), Keum-Su Song (Seoul), Kyung-Woo Lee (Seoul)
Primary Examiner: Derrick Holland
Application Number: 29/488,639
Type: Grant
Filed: Apr 22, 2014
Date of Patent: Jan 12, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Do-Won Kim (Suwon-si), Kyu-Sub Kwak (Seoul), Sung-Bum Park (Suwon-si), Keum-Su Song (Seoul), Kyung-Woo Lee (Seoul)
Primary Examiner: Derrick Holland
Application Number: 29/488,639
Classifications
Current U.S. Class:
Inductor (e.g., Coil, Etc.) (D13/117)