Stamp
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Description
The broken lines illustrating portions of the stamp are for environmental purposes only and form no part of the claimed design.
Claims
We claim, the ornamental design for a stamp, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D247261 | February 14, 1978 | Hormann |
D280643 | September 17, 1985 | Ichikawa |
D280644 | September 17, 1985 | Ichikawa |
4996921 | March 5, 1991 | Hong |
D399245 | October 6, 1998 | Harden |
6634288 | October 21, 2003 | Imamaki |
D506775 | June 28, 2005 | Kida |
6935231 | August 30, 2005 | Naritomi |
D585932 | February 3, 2009 | Kida |
D614688 | April 27, 2010 | Wilflingseder |
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7765924 | August 3, 2010 | Suda |
D679317 | April 2, 2013 | Ono |
3465718 | August 2005 | CN |
302081811 | September 2012 | CN |
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2040895 | December 1994 | GB |
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300414571.0000 | May 2006 | KR |
Patent History
Patent number: D750157
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Feb 23, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Hyo-In Ahn (Seoul), Eun-Kyung Yoo (Seoul), Ji-Su Jung (Yongin-si), Dong-Goo Kang (Seoul), Say Jang (Yonginsi)
Primary Examiner: Bridget L Eland
Assistant Examiner: Lauren McVey
Application Number: 29/482,214
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Feb 23, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Hyo-In Ahn (Seoul), Eun-Kyung Yoo (Seoul), Ji-Su Jung (Yongin-si), Dong-Goo Kang (Seoul), Say Jang (Yonginsi)
Primary Examiner: Bridget L Eland
Assistant Examiner: Lauren McVey
Application Number: 29/482,214
Classifications
Current U.S. Class:
Stamp, Seal Imprinter, Or Stamp Pad (D18/15)