Cover for data relay device
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Description
The broken lines in the figures show portions of the cover for data relay device which form no part of the claimed design.
Claims
The ornamental design for a cover for data relay device, as shown and described.
Referenced Cited
U.S. Patent Documents
D369149 | April 23, 1996 | Chang et al. |
5521793 | May 28, 1996 | Dalgleish et al. |
D392644 | March 24, 1998 | McGugan |
D429238 | August 8, 2000 | Kolinen |
D438532 | March 6, 2001 | Gargani et al. |
D438533 | March 6, 2001 | Arpe |
D455420 | April 9, 2002 | Arpe |
D485551 | January 20, 2004 | Mikkola et al. |
D491941 | June 22, 2004 | Chen |
D528537 | September 19, 2006 | Wang |
D535646 | January 23, 2007 | Allen et al. |
D574360 | August 5, 2008 | Matsuoka |
D695281 | December 10, 2013 | Petersen et al. |
Patent History
Patent number: D755762
Type: Grant
Filed: Sep 4, 2014
Date of Patent: May 10, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/501,502
Type: Grant
Filed: Sep 4, 2014
Date of Patent: May 10, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/501,502
Classifications
Current U.S. Class:
Acoustic Coupler Or Modem (22) (D14/242)