Cover for data relay device
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Description
The broken lines in the figures show portions of the cover for data relay device which form no part of the claimed design.
Claims
The ornamental design for a cover for data relay device, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D755762
Type: Grant
Filed: Sep 4, 2014
Date of Patent: May 10, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/501,502
Type: Grant
Filed: Sep 4, 2014
Date of Patent: May 10, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/501,502
Classifications
Current U.S. Class:
Acoustic Coupler Or Modem (22) (D14/242)