Bracket for fixing communication equipment
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The broken lines are for environmental purpose only and form no part of the claimed design.
The jagged uneven broken lines indicate an omission boundary and form no part of the claimed design.
Claims
The ornamental design for a bracket for fixing communication equipment, as shown and described.
Referenced Cited
U.S. Patent Documents
D357400 | April 18, 1995 | Sachs |
D409079 | May 4, 1999 | Sobczynski |
D557117 | December 11, 2007 | Cannaverde |
D573008 | July 15, 2008 | Sipe |
D625581 | October 19, 2010 | Crostic, Jr. |
D663190 | July 10, 2012 | Mota |
8782832 | July 22, 2014 | Blyakher |
D731296 | June 9, 2015 | Nelson |
D742721 | November 10, 2015 | Cosby |
9192537 | November 24, 2015 | Schlegel |
D746125 | December 29, 2015 | Miller |
D746661 | January 5, 2016 | Shetti |
Patent History
Patent number: D757522
Type: Grant
Filed: Feb 3, 2015
Date of Patent: May 31, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Kyu-Cheol Kim (Seoul), Gi-Chun Nam (Suwon-si), Eun-Uae Lee (Seoul), Joon-Taek Lee (Yonginsi), Tai-Hyung Ju (Seoul), Dong-Ju Choi (Suwon-si)
Primary Examiner: Cynthia Underwood
Application Number: 29/516,486
Type: Grant
Filed: Feb 3, 2015
Date of Patent: May 31, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Kyu-Cheol Kim (Seoul), Gi-Chun Nam (Suwon-si), Eun-Uae Lee (Seoul), Joon-Taek Lee (Yonginsi), Tai-Hyung Ju (Seoul), Dong-Ju Choi (Suwon-si)
Primary Examiner: Cynthia Underwood
Application Number: 29/516,486
Classifications
Current U.S. Class:
D8/356