Pattern for package

- Samsung Electronics
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Description

The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograph(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a pattern for package showing our new design; and,

FIG. 2 is a front perspective view of FIG. 1, in which a packaging box is provided in broken lines to illustrate an example environment.

The broken lines in the figures show portions of the packaging box which form no part of the claimed design.

The dot-dash broken lines in the figures represent an unclaimed boundary line and form no part of the claimed design.

Claims

We claim the ornamental design for a pattern for package, as shown and described.

Referenced Cited
U.S. Patent Documents
D81676 July 1930 Webber
D552996 October 16, 2007 Koskinen
D655156 March 6, 2012 Schrimpf
Patent History
Patent number: D760594
Type: Grant
Filed: Aug 1, 2014
Date of Patent: Jul 5, 2016
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Nu-Ri Choi (Suwon-Si), Seok-Young Kang (Hwaseong-Si), Seong-Wook Jeong (Seoul)
Primary Examiner: Sandra Morris
Application Number: 29/498,249
Classifications
Current U.S. Class: D9/649; D9/432