Pattern for package

- Samsung Electronics
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Description

The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograph(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a pattern for package showing our new design; and,

FIG. 2 is a front perspective view of FIG. 1, in which a packaging box is provided in broken lines to illustrate an example environment.

The broken lines in the figures show portions of the packaging box which form no part of the claimed design.

The dot-dash broken lines in the figures represent an unclaimed boundary line and form no part of the claimed design.

Claims

We claim the ornamental design for a pattern for package, as shown and described.

Referenced Cited
U.S. Patent Documents
D70553 July 1926 Gibson
D151433 October 1948 Cruze et al.
D419434 January 25, 2000 Yoon
D526572 August 15, 2006 Lemaire
D579702 November 4, 2008 McArdle
D659012 May 8, 2012 Subler
D674705 January 22, 2013 Thompson
D686505 July 23, 2013 Uemura
Patent History
Patent number: D760595
Type: Grant
Filed: Aug 1, 2014
Date of Patent: Jul 5, 2016
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Nu-Ri Choi (Suwon-Si), Seok-Young Kang (Hwaseong-Si), Seong-Wook Jeong (Seoul)
Primary Examiner: Sandra Morris
Application Number: 29/498,244
Classifications
Current U.S. Class: D9/661; D9/432