Wire bonding ceramic capillary

- CoorsTek, Inc.
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Description

FIG. 1 depicts a first perspective view of a wire bonding ceramic capillary.

FIG. 2 depicts a second perspective view thereof;

FIG. 3 depicts a top plan view thereof;

FIG. 4 depicts a side elevation view thereof; and,

FIG. 5 depicts a bottom plan view thereof.

The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.

Claims

The ornamental design for a wire bonding ceramic capillary, as shown and described.

Referenced Cited
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Patent History
Patent number: D771168
Type: Grant
Filed: Oct 31, 2014
Date of Patent: Nov 8, 2016
Assignee: CoorsTek, Inc. (Golden, CO)
Inventor: Russell Bell (Ventura, CA)
Primary Examiner: David Muller
Application Number: 29/507,914
Classifications
Current U.S. Class: Heat Treatment, Welding Or Brazing (D15/144)