Oven
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
Description
The dashed broken lines in the figures depict portions of the oven that form no part of the claimed design.
Claims
The ornamental design for an oven, as shown and described.
Referenced Cited
U.S. Patent Documents
D688518 | August 27, 2013 | Baek |
D690994 | October 8, 2013 | Baek |
D724889 | March 24, 2015 | Borjesson |
D728300 | May 5, 2015 | Borjesson |
D741104 | October 20, 2015 | Funnell, II |
D750413 | March 1, 2016 | Funnell, II |
D754476 | April 26, 2016 | Crookshanks |
D762086 | July 26, 2016 | Kim |
D762415 | August 2, 2016 | Chung |
D763617 | August 16, 2016 | Kim |
D764230 | August 23, 2016 | Shoemaker |
D764854 | August 30, 2016 | Kim |
D766030 | September 13, 2016 | Chung |
20140070685 | March 13, 2014 | Yantis |
Patent History
Patent number: D781097
Type: Grant
Filed: Feb 12, 2016
Date of Patent: Mar 14, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Taikyung Kim (Seoul), Jaejun Kim (Seoul), Hyeongju Seo (Seoul)
Primary Examiner: Robin V Webster
Assistant Examiner: James Thorn, Sr.
Application Number: 29/554,604
Type: Grant
Filed: Feb 12, 2016
Date of Patent: Mar 14, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Taikyung Kim (Seoul), Jaejun Kim (Seoul), Hyeongju Seo (Seoul)
Primary Examiner: Robin V Webster
Assistant Examiner: James Thorn, Sr.
Application Number: 29/554,604
Classifications
Current U.S. Class:
D7/348;
D7/349