Package

- Samsung Electronics
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Description

FIG. 1 is a perspective view of a package, consisting of an inner and outer case, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a side view thereof;

FIG. 5 is another side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of the inner case of the package, shown separately for ease of illustration, with the cover open;

FIG. 9 is a top plan view of an outer case of the package in a flat, blank configuration;

FIG. 10 is a top plan view of an inner case of the package in a flat, blank configuration; and,

FIG. 11 is another perspective view showing a state in which the inner case of the package is slightly pulled out of the outer case of the package.

The broken lines illustrating portions of the package form no part of the claimed design.

Claims

The ornamental design for a package, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D785452
Type: Grant
Filed: Mar 22, 2016
Date of Patent: May 2, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Gyeonggi-Do)
Inventors: Sanghyun Lee (Seoul), Sunghoon Chung (Seoul), Seolhee Yoon (Seoul)
Primary Examiner: Vy Koenig
Assistant Examiner: Omeed Agilee
Application Number: 29/558,837
Classifications
Current U.S. Class: D9/432