Package
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The broken lines illustrating portions of the package form no part of the claimed design.
Claims
The ornamental design for a package, as shown and described.
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Type: Grant
Filed: Mar 22, 2016
Date of Patent: May 2, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Gyeonggi-Do)
Inventors: Sanghyun Lee (Seoul), Sunghoon Chung (Seoul), Seolhee Yoon (Seoul)
Primary Examiner: Vy Koenig
Assistant Examiner: Omeed Agilee
Application Number: 29/558,837