Polyhedron sensor enclosure
- Intel
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Description
The broken lines represent environment and form no part of the claim.
Claims
The ornamental design for a polyhedron sensor enclosure, as shown and described.
Referenced Cited
U.S. Patent Documents
562777 | June 1896 | Low et al. |
3722153 | March 1973 | Baer |
4621467 | November 11, 1986 | Golden |
4723382 | February 9, 1988 | Lalvani |
5603188 | February 18, 1997 | Robbin |
7694463 | April 13, 2010 | Lanahan |
8480449 | July 9, 2013 | Cheng |
8959845 | February 24, 2015 | Hauptman |
D755795 | May 10, 2016 | Kulovany |
9340967 | May 17, 2016 | Daenen |
9443444 | September 13, 2016 | Moriyasu |
9458867 | October 4, 2016 | Maunder |
Patent History
Patent number: D787519
Type: Grant
Filed: Dec 24, 2015
Date of Patent: May 23, 2017
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Keith Nolan (Mullingar), Gabriel Mullarkey (Dublin), Mark Kelly (Dublin)
Primary Examiner: Cynthia Underwood
Application Number: 29/505,641
Type: Grant
Filed: Dec 24, 2015
Date of Patent: May 23, 2017
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Keith Nolan (Mullingar), Gabriel Mullarkey (Dublin), Mark Kelly (Dublin)
Primary Examiner: Cynthia Underwood
Application Number: 29/505,641
Classifications
Current U.S. Class:
Cover (D14/440)