Electronic component heatsink assembly

- ADDA CORP.
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Description

FIG. 1 is a perspective view of an electronic component heatsink assembly showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines showing of an electronic component, fins and push pins in the drawings depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for an electronic component heatsink assembly, as shown and described.

Referenced Cited
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Other references
  • Alpha heatsinks, “Announcment of new push pin heat sink series”, Posted Dec. 26, 2013, Accessed Jun. 29, 2017. (https://www.micforg.co.jp/en/nw130509e.html).
  • Frosty Tech, “Cooler Master Hyper Z600 Passive Heatsink Review Cooler Master Hyper Z600 Passive Heatsink Review”, Posted May 8, 2008, Accessed Jun. 29, 2017. (http://www.frostytech.com/articleview.cfm?articleid=2273&page=1).
Patent History
Patent number: D804434
Type: Grant
Filed: Jun 15, 2016
Date of Patent: Dec 5, 2017
Assignee: ADDA CORP. (Kaohsiung)
Inventors: Sheng-Hsiung Lu (Kaohsiung), Yung-Chang Chen (Kaoshiung)
Primary Examiner: Jennifer Rivard
Assistant Examiner: April Rivas
Application Number: 29/568,075
Classifications
Current U.S. Class: Heat Sink (D13/179)