Accessory module for headset
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The shade lines show surface contour and not surface ornamentation.
The broken line showing of internal components of the accessory module illustrates environmental structure, and the broken lines form no part of the claimed design.
Claims
The ornamental design for an accessory module for headset, as shown and described.
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Type: Grant
Filed: Dec 21, 2016
Date of Patent: Dec 26, 2017
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Atsuo Kuwahara (Portland, OR), Glen Stevens (Portland, OR), Jared L. Rue (Hillsboro, OR), Reese Bowes (Portland, OR), Manish A. Hiranandani (Fremont, CA)
Primary Examiner: Austin Murphy
Application Number: 29/588,567