Instrument module

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Description

FIG. 1 is a front perspective view of an instrument module in accordance with an embodiment;

FIG. 2 is a rear perspective view of an instrument module in accordance with an embodiment;

FIG. 3 is a front elevational view of an instrument module in accordance with an embodiment;

FIG. 4 is a rear elevational view of an instrument module in accordance with an embodiment;

FIG. 5 is a left side elevational view of an instrument module in accordance with an embodiment;

FIG. 6 is a right side elevational view of an instrument module in accordance with an embodiment;

FIG. 7 is a top view of an instrument module in accordance with an embodiment;

FIG. 8 is a bottom view of an instrument module in accordance with an embodiment; and,

FIG. 9 is a front elevational view of an instrument module in accordance with an embodiment showing additional environmental information.

The broken lines shown in the figures represent portions of the instrument module that form no part of the claimed design.

Claims

The ornamental design for an instrument module, as shown and described.

Referenced Cited
U.S. Patent Documents
D645367 September 20, 2011 Hayashi
D669189 October 16, 2012 Liu
D676143 February 12, 2013 Liu
D676568 February 19, 2013 Liu
D685483 July 2, 2013 LiCalzi
D735878 August 4, 2015 Chang
D738243 September 8, 2015 Selberg
Patent History
Patent number: D806259
Type: Grant
Filed: Jun 27, 2016
Date of Patent: Dec 26, 2017
Assignee: Siemens Healthcare Diagnostics Inc. (Tarrytown, NY)
Inventors: Daniel LiCalzi (New York, NY), Youngsang Lee (Flushing, NY)
Primary Examiner: Wan Laymon
Assistant Examiner: Mark Booker
Application Number: 29/569,384
Classifications