Housing for electronic device

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Description

FIG. 1 is perspective view of a housing for electronic device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; the left side elevational view being a mirror image thereof;

FIG. 7 is an enlarged perspective view of a front handle shown for clarity; and,

FIG. 8 is another alternate top view thereof.

The broken lines illustrate unclaimed portions and form no part of the claimed design.

Claims

The design for a housing for electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D347837 June 14, 1994 Gerlach
D348060 June 21, 1994 Savio
5918089 June 29, 1999 Malinich
D510094 September 27, 2005 Bolton
D555632 November 20, 2007 Iikura
D558817 January 1, 2008 Katayama
D577710 September 30, 2008 Joseph
Other references
  • European Patent Office, “Office Action from EP Application No. 003531466, dated Jan. 9, 2017”, “From Foreign Counterpart of U.S. Appl. No. 29/568,959”, Jan. 9, 2017, pp. 1-3, Published in: EP.
Patent History
Patent number: D809564
Type: Grant
Filed: Jun 22, 2016
Date of Patent: Feb 6, 2018
Assignee: Honeywell International Inc. (Morris Plains, NJ)
Inventors: Kelly L. Boren (Gilbert, AZ), Rebecca Sidelinger (Chandler, AZ), Mark Goodman (Ottawa), Paul Marchand (Ottawa), David J. Popelka (Alpharetta, GA)
Primary Examiner: Prabhakar G Deshmukh
Application Number: 29/568,959