Contact wafer

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Description

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a top, back, and left side perspective view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a back elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for contact wafer, as shown and described.

Referenced Cited
U.S. Patent Documents
7404740 July 29, 2008 Chen
D768089 October 4, 2016 Liu
20080280491 November 13, 2008 Chen
20140273651 September 18, 2014 Pao
20180097326 April 5, 2018 Guetig
Other references
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
Patent History
Patent number: D823814
Type: Grant
Filed: Jul 24, 2017
Date of Patent: Jul 24, 2018
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Daniel Bui
Application Number: 29/611,655
Classifications
Current U.S. Class: Element Or Attachment (D13/154)