Contact wafer
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Description
Claims
The ornamental design for contact wafer, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
7404740 | July 29, 2008 | Chen |
D768089 | October 4, 2016 | Liu |
20080280491 | November 13, 2008 | Chen |
20140273651 | September 18, 2014 | Pao |
20180097326 | April 5, 2018 | Guetig |
- Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
Patent History
Patent number: D823814
Type: Grant
Filed: Jul 24, 2017
Date of Patent: Jul 24, 2018
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Daniel Bui
Application Number: 29/611,655
Type: Grant
Filed: Jul 24, 2017
Date of Patent: Jul 24, 2018
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Daniel Bui
Application Number: 29/611,655
Classifications
Current U.S. Class:
Element Or Attachment (D13/154)