Heat sink assembly

- Oculus VR, LLC
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Description

FIG. 1 is a perspective view of a heat sink assembly, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Claims

The ornamental design for a heat sink assembly, as shown and described.

Referenced Cited
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Other references
  • eBay, “New Genuine Toshiba CPU Heatsink C670 C675 C675D Series”, first sold on Jul. 1, 2017. (https://www.ebay.com/itm/H000026370-13N0-Y3A0W02-NEW-GENUINE-TOSHIBA-CPU-HEATSINK-C670-C675-C675D-SERIES/142315100462).
  • eBay, “HP EliteBook 11.6″ 2170p Genuine Laptop CPU Cooling Heatsink 693307-001 GLP*”, Accessed Jun. 4, 2018. (https://www.ebay.com/itm/HP-EliteBook-11-6-2170p-Genuine-Laptop-CPU-Cooling-Heatsink-693307-001-GLP/282691921487).
Patent History
Patent number: D825498
Type: Grant
Filed: Jul 17, 2017
Date of Patent: Aug 14, 2018
Assignee: Oculus VR, LLC (Menlo Park, CA)
Inventors: Boyd Drew Allin (Seattle, WA), Jeffrey Taylor Stellman (Seattle, WA)
Primary Examiner: Jennifer Rivard
Assistant Examiner: April Rivas
Application Number: 29/610,923
Classifications
Current U.S. Class: Heat Sink (D13/179)