Return nozzle
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
- Method of forming film, method of manufacturing semiconductor device, film forming apparatus, and recording medium
- Semiconductor device
- SUBSTRATE PROCESSING APPARATUS, SWITCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
- METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, FILM FORMATION APPARATUS, AND RECORDING MEDIUM
Claims
We claim the ornamental design for a return nozzle, as shown (and described).
Type: Grant
Filed: Oct 12, 2017
Date of Patent: Apr 30, 2019
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Hidenari Yoshida (Toyama), Takafumi Sasaki (Toyama), Shuhei Saido (Toyama)
Primary Examiner: Robin V Webster
Application Number: 29/621,948