Audio-visual display device
Latest Intel Patents:
- COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT AND BACK SIDES OF AN INTERPOSER
- FRACTIONAL-BIT QUANTIZATION AND DEPLOYMENT OF CONVOLUTIONAL NEURAL NETWORK MODELS
- APPARATUSES USED IN WIRELESS LOCAL AREA NETWORK
- NANORIBBON STACKS WITHOUT DIELECTRIC PROTECTION CAPS FOR TOP NANORIBBONS
- HYBRID BONDING WITH PHOTONIC INTEGRATED CIRCUITS FOR HIGH BANDWIDTH RETICLE STITCHING OF RETICLE SIZED INTEGRATED CIRCUIT DIES
The features shown in broken lines form no part of the claimed design.
Claims
The ornamental design for an “audio-visual display device,” as shown and described in FIGS. 1-24.
| D596173 | July 14, 2009 | Arfin |
| D640252 | June 21, 2011 | Kuroda |
| D646269 | October 4, 2011 | Crick, Jr. |
| D653835 | February 7, 2012 | Strempack |
| D669464 | October 23, 2012 | Birgeoglu |
| D690293 | September 24, 2013 | Wilson |
| D691141 | October 8, 2013 | Cruz |
| D692885 | November 5, 2013 | Cruz |
| D697062 | January 7, 2014 | Nagai |
| D711870 | August 26, 2014 | Johnson |
| D721695 | January 27, 2015 | Birgeoglu |
| D734314 | July 14, 2015 | Swaine |
| D751061 | March 8, 2016 | Berini |
| D762635 | August 2, 2016 | Szeredi |
| D763247 | August 9, 2016 | Yepez |
| D782466 | March 28, 2017 | Yepez |
| D806698 | January 2, 2018 | Thompson |
| D816077 | April 24, 2018 | Benic |
| D824895 | August 7, 2018 | Tivnon |
| D829704 | October 2, 2018 | Oross |
| D831639 | October 23, 2018 | Terry |
| D842296 | March 5, 2019 | Oross |
Type: Grant
Filed: Aug 22, 2017
Date of Patent: Aug 20, 2019
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Maria L. Pitallano (Santa Clara, CA), Christine Kim (San Jose, CA), Yen-Ning Chang (Hillsboro, OR), Andrew Hooper (Santa Clara, CA)
Primary Examiner: Austin Murphy
Application Number: 29/614,745