Case for a circuit board
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Description
The broken lines are for environmental purposes only and form no part of the claimed design.
Claims
The ornamental design for a case for a circuit board, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
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- Communication dated Nov. 26, 2019, from the Japanese Patent Office in counterpart application No. 2019-004032.
Patent History
Patent number: D888675
Type: Grant
Filed: Feb 26, 2019
Date of Patent: Jun 30, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Janice Hallmark
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/681,527
Type: Grant
Filed: Feb 26, 2019
Date of Patent: Jun 30, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Janice Hallmark
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/681,527
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)