Case for a circuit board
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Description
The broken lines are for environmental purposes only and form no part of the claimed design.
Claims
The ornamental design for a case for a circuit board, as shown and described.
Referenced Cited
U.S. Patent Documents
| 5377080 | December 27, 1994 | Lin |
| 8174847 | May 8, 2012 | Ohtsuji |
| 8269116 | September 18, 2012 | Ambo |
| 8503191 | August 6, 2013 | Nagata |
| 8981240 | March 17, 2015 | Chitaka |
| 9526186 | December 20, 2016 | Lin |
| D827594 | September 4, 2018 | Shim |
| D828358 | September 11, 2018 | Lim |
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| D847813 | May 7, 2019 | Jun |
| D848418 | May 14, 2019 | Jun |
| D848419 | May 14, 2019 | Jun |
| D866558 | November 12, 2019 | Shim |
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| 20140256164 | September 11, 2014 | Lin |
Patent History
Patent number: D888676
Type: Grant
Filed: Feb 27, 2019
Date of Patent: Jun 30, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Janice Hallmark
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/681,619
Type: Grant
Filed: Feb 27, 2019
Date of Patent: Jun 30, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Janice Hallmark
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/681,619
Classifications
Current U.S. Class:
Casing Or Enclosure Not Elsewhere Specified (D13/184)