Electrical cable connector

- SAMTEC, INC.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top, front, right perspective view of an electrical cable connector according to our new design;

FIG. 2 is a bottom, rear, left perspective view thereof;

FIG. 3 is another front, top, right perspective view thereof;

FIG. 4 is an enlarged front, top, right perspective view of a portion thereof, as indicated at region FIG. 4 of FIG. 3;

FIG. 5 is another bottom, rear, left perspective view thereof;

FIG. 6 is an enlarged bottom, rear, left perspective view of a portion thereof, as indicated at region FIG. 6 of FIG. 5;

FIG. 7 is a top elevation view thereof;

FIG. 8 is a bottom elevation view thereof;

FIG. 9 is a left side elevation view thereof;

FIG. 10 is a right side elevation view thereof;

FIG. 11 is a front plan view thereof; and,

FIG. 12 is a rear plan view thereof.

The broken line portion of the figure drawings is included to show unclaimed subject matter only for the purpose of illustrating environment and forms no part of the claimed design. In addition, the surfaces in the views between the claimed solid line edges and the broken lines form no part of the claimed design.

Claims

The ornamental design for an electrical cable connector, as shown and described.

Referenced Cited
U.S. Patent Documents
3329926 July 1967 Beeck
D328590 August 11, 1992 Tanaka
D435245 December 19, 2000 Hwang
D435831 January 2, 2001 Ko
D449276 October 16, 2001 Hwang
D459702 July 2, 2002 Watanabe
6462957 October 8, 2002 Kwong et al.
6652318 November 25, 2003 Winings et al.
D485532 January 20, 2004 Lai
D490377 May 25, 2004 Sato
7083459 August 1, 2006 Wu et al.
D562246 February 19, 2008 Matsuzaki
D601506 October 6, 2009 Fukazawa
D605602 December 8, 2009 Mase
7837522 November 23, 2010 Hoover
D640638 June 28, 2011 Ngo
D649518 November 29, 2011 Zhu
8398429 March 19, 2013 Costello
8506323 August 13, 2013 Costello
D699683 February 18, 2014 Yoshisuji
D706724 June 10, 2014 McCartin
8998645 April 7, 2015 Vanaleck et al.
D745852 December 22, 2015 Harper, Jr.
D748589 February 2, 2016 Endo
9257778 February 9, 2016 Buck et al.
D768089 October 4, 2016 Liu
D772168 November 22, 2016 Harper, Jr.
9608348 March 28, 2017 Wanha et al.
D801283 October 31, 2017 Walsh
D816044 April 24, 2018 Zerebilov
9985367 May 29, 2018 Wahna et al.
D823814 July 24, 2018 Buck et al.
D835046 December 4, 2018 Bingham
D877084 March 3, 2020 Buck
20030143886 July 31, 2003 Nemoto
20050101176 May 12, 2005 Kachlic
20050148219 July 7, 2005 Myer et al.
20070281543 December 6, 2007 Boegelein et al.
20080166090 July 10, 2008 Kiani et al.
20080305690 December 11, 2008 Zhang et al.
20090201658 August 13, 2009 Lemke et al.
20090215309 August 27, 2009 Mongold
20090233492 September 17, 2009 Mizukami et al.
20100178779 July 15, 2010 Davis et al.
20100255731 October 7, 2010 Oyake et al.
20120058665 March 8, 2012 Zerebilov et al.
20130115815 May 9, 2013 Lim et al.
20140220795 August 7, 2014 Bai et al.
20140242817 August 28, 2014 Mongold
20160006150 January 7, 2016 Bachmutsky
20160233598 August 11, 2016 Wittig
20170077621 March 16, 2017 Liao
20180054012 February 22, 2018 Zhu
20180131144 May 10, 2018 Xing
20190013619 January 10, 2019 Obata
20190097357 March 28, 2019 Mongold
Foreign Patent Documents
5940898 October 1984 JP
0985825 December 1995 JP
1206569 April 2004 JP
2009-218119 September 2009 JP
D130799 October 2008 TW
D132453 December 2009 TW
D163315 September 2013 TW
D172197 April 2014 TW
D168325 June 2015 TW
2015/116407 August 2015 WO
2018/231896 December 2018 WO
2019/018728 January 2019 WO
2019/084110 May 2019 WO
Other references
  • Mongold et al., “Overmolded Lead Frame Providing Contact Support and Impedance Matching Properties ”, U.S. Appl. No. 15/566,504, filed Oct. 13, 2017.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/611,028, filed Jul. 18, 2017.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/610,936, filed Jul. 17, 2017.
  • Buck et al., “Contact Wafers”, U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
  • “Cable Assemblies/BiPass I/O/High-Speed Solutions”, Molex, LLC., © 2018, 3 pages.
  • “Credo demonstrates 112 G PAM4 SR, 56G PAM4 LR, and 56G NRZ Serdes Technology at DesignCon”, Credo Semiconductor, Jan. 30, 2017, 6 pages.
Patent History
Patent number: D896183
Type: Grant
Filed: Jan 8, 2018
Date of Patent: Sep 15, 2020
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Randall Eugene Musser (Enola, PA), Jonathan Earl Buck (Hershey, PA), John Mongold (Todd, PA)
Primary Examiner: Bridget L Eland
Application Number: 29/632,520