Handheld semiconductor wafer handling tool

Info

Patent number: D911986
Type: Grant
Filed: May 3, 2019
Date of Patent: Mar 2, 2021
Assignee: Raytheon Company (Waltham, MA)
Inventors: Heather D. Leifeste (Santa Barbara, CA), Ron C. Stevens (Santa Barbara, CA)
Primary Examiner: Philip S Hyder
Application Number: 29/690,034

Description

Description

FIG. 1 is a top front perspective view of a handheld semiconductor wafer handling tool with a movable clip in a first position;

FIG. 2 is a front end view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 3 is a back end view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 4 is a right side view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 5 is a left side view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 6 is a top view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 7 is a bottom view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 8 is a bottom rear perspective view of the handheld semiconductor wafer handling tool of FIG. 1;

FIG. 9 is a top front perspective view of the handheld semiconductor wafer handling tool of FIG. 1 with the movable clip in a second position; and,

FIG. 10 is a perspective view of the handheld semiconductor wafer handling tool of FIG. 1 with a semiconductor wafer.

The broken line portions of the semiconductor wafer handling tool in FIGS. 1 through 10 are not considered part of the claimed design. Additional broken lines in FIG. 10 are provided for purposes of environment and form no part of the claimed design.

Claims

The ornamental design for a handheld semiconductor wafer handling tool, as shown and described.