Electric contact
Latest KABUSHIKI KAISHA NIHON MICRONICS Patents:
This article is an electric contact for testing and inspecting the electric characteristics of semiconductor devices such as semiconductor chips, etc.
Claims
The ornamental design for an electric contact, as shown and described.
D380670 | July 8, 1997 | Blocker |
D385189 | October 21, 1997 | Weller |
D386682 | November 25, 1997 | Richardson |
D447947 | September 18, 2001 | Nakagawa |
D483668 | December 16, 2003 | Le Roux |
D515418 | February 21, 2006 | Sandler |
D520362 | May 9, 2006 | Powell |
D544792 | June 19, 2007 | Camarella |
D595130 | June 30, 2009 | Bizzell |
D852755 | July 2, 2019 | Wang |
D852756 | July 2, 2019 | Huang |
D852757 | July 2, 2019 | Huang |
D853335 | July 9, 2019 | Huang |
D886066 | June 2, 2020 | Williams Barnett |
300517445 | January 2009 | KR |
- Micronics Japan. Package Probe (Test Socket). No date specified, https://www.mjc.co.jp/en/products/semiconductor/package_probe.html (Year: 0).
Type: Grant
Filed: Jul 23, 2019
Date of Patent: May 4, 2021
Assignee: KABUSHIKI KAISHA NIHON MICRONICS (Musashino)
Inventor: Eichi Osato (Musashino)
Primary Examiner: Darcey E Gottschalk
Application Number: 29/699,208