Liquid discharge nozzle for semiconductor substrate processing apparatus
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Description
Claims
The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.
Referenced Cited
U.S. Patent Documents
Other references
D341418 | November 16, 1993 | Akimoto |
D636845 | April 26, 2011 | Suzuki |
D637267 | May 3, 2011 | Suzuki |
D823906 | July 24, 2018 | Kaminski |
D824966 | August 7, 2018 | Kaminski |
D903836 | December 1, 2020 | Pak |
D906485 | December 29, 2020 | Fowler |
D907744 | January 12, 2021 | Roehl |
- Liquid Paste Filling Machine Filling Nozzle Head, Dec. 10, 2020, Amazon.com, May 5, 2021.URL: https://www.amazon.com/WINUS-Filling-Nozzle-1000ml-Machine/dp/B08G8KPF43 (Year: 2020).
Patent History
Patent number: D929534
Type: Grant
Filed: Oct 23, 2019
Date of Patent: Aug 31, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventors: Yoshifumi Amano (Kumamoto), Kazuhiro Aiura (Kumamoto)
Primary Examiner: Jack Reickel
Assistant Examiner: Keith J Wilson
Application Number: 29/710,426
Type: Grant
Filed: Oct 23, 2019
Date of Patent: Aug 31, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventors: Yoshifumi Amano (Kumamoto), Kazuhiro Aiura (Kumamoto)
Primary Examiner: Jack Reickel
Assistant Examiner: Keith J Wilson
Application Number: 29/710,426
Classifications