Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The evenly spaced broken lines illustrate portions of the headphone that form no part of the claimed design. The dash-dot broken lines define boundaries of the claimed design and form no part thereof.

The shading is provided merely to represent contours of the design and does not connote the character of the surfaces such as any specific texture, material, gloss, translucence, transparency, surface treatment, or surface decoration.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D942970
Type: Grant
Filed: Aug 27, 2019
Date of Patent: Feb 8, 2022
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Chenxi Lu (Shenzhen), Anna Grace Meyer (Hannibal, MO), Weijia Lu (Shenzhen)
Primary Examiner: Dana K Weiland
Assistant Examiner: Messina L Smith
Application Number: 29/703,423
Classifications
Current U.S. Class: Headphone (D14/223)