Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line showings form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D852777
Type: Grant
Filed: Aug 30, 2017
Date of Patent: Jul 2, 2019
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Sunghoon Park (Shanghai), Chenxi Lu (Hong Kong)
Primary Examiner: Paula Allen Greene
Application Number: 29/615,688
Classifications