Diaphragm pump
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- Bonding apparatus and bonding method
Description
1. Diaphragm pump
Claims
The ornamental design for a diaphragm pump, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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| D503034 | May 1954 | JP |
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- Japanese Decision to Grant Design Registration for Japanese Application No. 2019-028262, dated May 19, 2020, with an English translation.
- Japanese Notifications for Japanese Application No. 2019-028262, dated May 19, 2020, with an English translation.
Patent History
Patent number: D952692
Type: Grant
Filed: Jun 17, 2020
Date of Patent: May 24, 2022
Assignee: YAMADA CORPORATION (Tokyo)
Inventors: Daisuke Iwai (Tokyo), Kotaro Yamada (Tokyo)
Primary Examiner: Richard E Chilcot
Application Number: 35/510,957
Type: Grant
Filed: Jun 17, 2020
Date of Patent: May 24, 2022
Assignee: YAMADA CORPORATION (Tokyo)
Inventors: Daisuke Iwai (Tokyo), Kotaro Yamada (Tokyo)
Primary Examiner: Richard E Chilcot
Application Number: 35/510,957
Classifications
Current U.S. Class:
Pump Or Compressor (D15/7)
