Headphone
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The broken lines in the figures depict portions of the headphone that form no part of the claimed design.
Claims
The ornamental design for a headphone, as shown and described.
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Type: Grant
Filed: Jan 3, 2020
Date of Patent: Jul 12, 2022
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventor: Pohsun Lee (Shenzhen)
Primary Examiner: Messina L Smith
Application Number: 29/719,410