Conductive clip for a semiconductor package

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a conductive clip according to our design;

FIG. 2 is another perspective view of a conductive clip according to our design, the broken lines being included for illustrative purposes and forming no part of the claimed design;

FIG. 3 is a top plan view of a conductive clip according to our design;

FIG. 4 is a bottom plan view of a conductive clip according to our design, the broken lines being included for illustration purposes and forming no part of the claimed design;

FIG. 5 is a side elevational view of a conductive clip according to our design; and,

FIG. 6 is a side elevational view of a conductive clip according to our design.

Claims

The ornamental design for a conductive clip for a semiconductor package, as shown and described.

Referenced Cited
U.S. Patent Documents
4864470 September 5, 1989 Nishio
5047833 September 10, 1991 Gould
5235496 August 10, 1993 Chomette et al.
5451544 September 19, 1995 Gould
D379350 May 20, 1997 Kerklaan
5814884 September 29, 1998 Davis et al.
5818699 October 6, 1998 Fukuoka
D407382 March 30, 1999 Acciaioli et al.
5904499 May 18, 1999 Pace
6107680 August 22, 2000 Hodges
6137158 October 24, 2000 Cohen et al.
Patent History
Patent number: D503691
Type: Grant
Filed: Aug 22, 2003
Date of Patent: Apr 5, 2005
Assignee: International Rectifier Corporation (El Segundo, CA)
Inventors: Martin Standing (Tonbridge), Hazel Deborah Schofield (Tonbridge)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney: Ostrolenk, Faber, Gerb & Soffen, LLP
Application Number: 29/188,754