USB (universal serial bus) memory device
Latest Samsung Electronics Patents:
- Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor
- Semiconductor device
- Image processing device and operating method thereof
- Multilayer capacitor with a dielectric including an aluminum nitride based compound
- Multilayered capacitor
Description
The evenly dashed broken lines in the figures depict environmental subject matter and form no part of the claimed design.
Claims
The ornamental design for a USB (universal serial bus) memory device, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
| D724600 | March 17, 2015 | Hsieh |
| D736702 | August 18, 2015 | Ovadia |
| D759028 | June 14, 2016 | Emami |
| D771636 | November 15, 2016 | Shim |
| D783629 | April 11, 2017 | Shim |
| D785001 | April 25, 2017 | Shim |
| D786264 | May 9, 2017 | Lin |
| D797113 | September 12, 2017 | Wu |
| D836647 | December 25, 2018 | Wei |
| D842307 | March 5, 2019 | Lin |
| D862482 | October 8, 2019 | Shim |
| D862484 | October 8, 2019 | Shim |
| D864975 | October 29, 2019 | Shim |
| D870119 | December 17, 2019 | Jun |
| 304228228 | August 2017 | CN |
| 305236381 | June 2019 | CN |
| 30-0837847 | February 2016 | KR |
| 30-0967951 | August 2018 | KR |
Patent History
Patent number: D975718
Type: Grant
Filed: Nov 2, 2020
Date of Patent: Jan 17, 2023
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Hyung-Sup Shim (Suwon-si)
Primary Examiner: Angela J Lee
Application Number: 29/756,967
Type: Grant
Filed: Nov 2, 2020
Date of Patent: Jan 17, 2023
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Hyung-Sup Shim (Suwon-si)
Primary Examiner: Angela J Lee
Application Number: 29/756,967
Classifications
Current U.S. Class:
Flash Drive Type (D14/480.1)