Patents Issued in March 6, 2003
  • Publication number: 20030045114
    Abstract: A semiconductor manufacturing process wherein high aspect ratio deep openings are plasma etched in a dielectric layer using an etchant gas which includes a fluorocarbon, a sulfur-containing gas, an oxygen-containing gas and an optional carrier gas. The etchant gas can include CxFyHz such as C4F8, SO2, O2 and Ar. The combination of the sulfur-containing gas and the oxygen-containing gas provides profile control of the deep openings.
    Type: Application
    Filed: June 19, 2001
    Publication date: March 6, 2003
    Inventors: Tuqiang Ni, Lumin Li
  • Publication number: 20030045115
    Abstract: A method for cleaning a semiconductor interconnect structure formed in an organic ILD using an anisotropic organic dielectric etch in combination with a sputter clean process. Organic material displaced from the sidewalls to the bottom of the structure by the sputter clean is removed by the ion enhanced organic etch. Interconnect resistance shift is reduced and reliability of the interconnect structure is improved by removing contaminates at the interface of the via/contact, and by increasing adhesion of the liner or plug to the underlying conductive layer.
    Type: Application
    Filed: August 28, 2001
    Publication date: March 6, 2003
    Inventor: Sunfei Fang
  • Publication number: 20030045116
    Abstract: A dielectric plasma etch method particularly useful for assuring that residue does not form in large open pad areas used for monitoring etching of narrow via and contact holes. The main dielectric etch of the via and contact holes uses a highly polymerizing chemistry, preferably of a low-F/C fluorocarbon such as C4F6 in conjunction with O2 and Ar. A short flash step precedes the main plasma etch using a plasma of a gas less polymerizing than the gas of the main etch, and the plasma is not extinguished between the flash and main steps. The flash step may be used to remove an anti-reflection coating (ARC) covering the dielectric layer and use a lean fluorocarbon, such as CF4, perhaps together with O2 and Ar. In the absence of ARC, an argon flash may be used.
    Type: Application
    Filed: June 5, 2002
    Publication date: March 6, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Zhuxu Wang, Jingbao Liu, Claes H. Bjorkman, Bryan Pu
  • Publication number: 20030045117
    Abstract: A composition which includes liquid or supercritical carbon dioxide and an acid having a pKa of less than about 4. The composition is employed in a process of removing residue from a precision surface, such as a semiconductor sample, in which the precision surface is contacted with the composition under thermodynamic conditions consistent with the retention of the liquid or supercritical carbon dioxide in the liquid or supercritical state.
    Type: Application
    Filed: September 4, 2001
    Publication date: March 6, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John Michael Cotte, Dario L. Goldfarb, Pamela Jones, Kenneth John McCullough, Wayne Martin Moreau, Keith R. Pope, John P. Simons, Charles J. Taft
  • Publication number: 20030045118
    Abstract: First of all, a semiconductor substrate that has a gate dielectric layer thereon is provided. Then a polysilicon layer is formed on the gate dielectric layer. Next, a dielectric layer having a first thickness is formed on the polysilicon layer. Afterward, form and define a photoresist layer on the dielectric layer. The dielectric layer is then etched by way of using the photoresist layer as an etching mask and a mixing gas that comprises a C2F6 and a CH2F2 as an etchant until the polysilicon layer is over etched to consume a second thickness, so as to form a hard mask with a trapezoid profile, wherein the second thickness is about half of the first thickness. After removing the photoresist layer, the polysilicon layer is etched by way of using the hard mask as an etching mask to form a poly-gate.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 6, 2003
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yann-Pyng Wu, Yueh-Feng Ho
  • Publication number: 20030045119
    Abstract: The present invention provides a method for forming a bottle-shaped trench in a semiconductor substrate. The method shields the circumferential wall of the section of a first depth of a trench with a collar, and expands the cross sectional area of the section of a second depth of the trench by using a wet etchant. A bottle-shaped trench in a semiconductor substrate is then formed.
    Type: Application
    Filed: September 6, 2001
    Publication date: March 6, 2003
    Inventors: Hsiao-Lei Wang, Chao-Hsi Chung, Hung-Kwei Liao, Chao-Chueh Wu
  • Publication number: 20030045120
    Abstract: Photoelectrochemical (PEC) etching is restricted to a group III nitride semiconductor-barrier interface to laterally etch or undercut the target group III nitride. The barrier interface is provided by the transparent sapphire substrate on which the target group III nitride is epitaxially grown or by a layer of material in intimate contact with the target group III nitride material and having a bandgap sufficiently high to make it resistant to PEC etching. Due to the first orientation in which this effect was first observed, it has been named backside-Illuminated photoelectrochemical (BIPEC) etching. It refers to a preferential etching at the semiconductor-barrier layer interface. The assembly can be exposed to light from any direction to effectuate bandgap-selective PEC etching. An opaque mask can be applied to limit the lateral extent of the photoelectrochemical etching.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 6, 2003
    Inventors: Evelyn L. Hu, Andreas R. Stonas
  • Publication number: 20030045121
    Abstract: In a semiconductor device fabrication method, a first low dielectric constant film having a specific dielectric constant of k less than 3 (k<3) is formed over a wafer so that an edge position of the first low dielectric constant film aligns with a first position along the circumference of the wafer. Then, a first protection layer having a gas permeability lower than that of the first low dielectric constant film is formed over the first low dielectric constant film and the wafer so that an edge of the first protection layer aligns with a second position that is located outside the first position.
    Type: Application
    Filed: March 19, 2002
    Publication date: March 6, 2003
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kazuyuki Higashi
  • Publication number: 20030045122
    Abstract: This invention relates to nano-lithography with &pgr;-conjugated azo dyes and azo-metal complexes represented by formula 1 or formula 2(Korea Pat. Appln. Nos. 2001-6879˜6880), which has both electron-donating and electron-accepting groups in the molecular structures, as a resist on Si substrate by using an AFM anodization. lithography. Developing optimum conditions of scan speed, bias voltage, and resist materials are key issues for achieving a high resolution patterning on various substrates. We accomplished nanometer-scale patterning in approximately 35 nm dimensions.
    Type: Application
    Filed: August 8, 2002
    Publication date: March 6, 2003
    Applicant: Hanyang Hakwon Co., Ltd.
    Inventors: Haiwon Lee, Hyeyoung Park
  • Publication number: 20030045123
    Abstract: A method for fabricating a silicon dioxide/silicon nitride/silicon dioxide (ONO) stacked composite having a thin silicon nitride layer for providing a high capacitance interpoly dielectric structure. In the formation of the ONO composite, a bottom silicon dioxide layer is formed on a substrate such as polysilicon. A silicon nitride layer is formed on the silicon dioxide layer and is thinned by oxidation. The oxidation of the silicon nitride film consumes some of the silicon nitride by a reaction that produces a silicon dioxide layer. This silicon dioxide layer is removed with a hydrofluoric acid dilution. The silicon nitride layer is again thinned by re-oxidization as a top silicon dioxide layer is formed on the silicon nitride layer. A second layer of polysilicon is deposited over the silicon nitride, forming an interpoly dielectric.
    Type: Application
    Filed: October 9, 2002
    Publication date: March 6, 2003
    Inventors: Mark A. Good, Amit S. Kelkar
  • Publication number: 20030045124
    Abstract: A method is presented for forming a protective oxide liner including providing an insulating layer over a conductive layer; providing an anti-reflectance layer over the insulating layer; providing an etching stop layer over the anti-reflectance layer; photolithographically defining a pattern on a surface of the etching stop layer for etching; anisotropically etching at least one etch opening extending at least partially through a thickness of the insulating layer; depositing an oxide liner such that the sidewalls of the at least one etch opening and said surface are covered by the oxide liner; and, removing the oxide liner from said surface.
    Type: Application
    Filed: September 6, 2001
    Publication date: March 6, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsu Shih, Yung-Cheng Lu, Lih Ping Li, Tien-I Bao, Chung Chi Ko
  • Publication number: 20030045125
    Abstract: Within a method for forming a nitrogenated silicon carbide layer there is treated a non-nitrogenated silicon carbide layer with a nitrogen containing plasma. By treating the non-nitrogenated silicon carbide layer with the nitrogen containing plasma, there may be avoided nitrogen containing plasma induced damage to a substrate layer, and in particular a low dielectric constant dielectric material substrate layer, upon which is formed the nitrogenated silicon carbide layer.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 6, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-I Bao, Lain-Jong Li, Syun-Ming Jang
  • Publication number: 20030045127
    Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventors: John T. Davlin, Greg Montanino
  • Publication number: 20030045128
    Abstract: A wafer transfer method, by which, when a wafer is loaded into a system, heat shock applied to the wafer can be relieved, the frequency of occurrence of crystal dislocation such as slip can be decreased, and productivity can be improved due to saving of energy and time required for heating and cooling of the system, and there is also provided a wafer support member used for this method. In this method, a step for transferring wafers so as to replace a wafer, which finishes its thin film growth process, with a following wafer, which is to be subjected to its thin film growth process, is carried out under the temperature being higher than the room temperature, while the wafer 1 is transferred integrally with a wafer support member 2 used for the thin film growth process.
    Type: Application
    Filed: April 19, 2002
    Publication date: March 6, 2003
    Applicant: TOSHIBA KIKAI KABUSHIKI KAISHA
    Inventors: Shyuji Tobashi, Tadashi Ohashi, Katsuyuki Iwata, Shinichi Mitani, Hideki Arai, Hideki Ito
  • Publication number: 20030045129
    Abstract: The invention includes a method of treating a predominantly inorganic dielectric material on a semiconductor wafer. A laser is utilized to generate activated oxygen species. Such activated oxygen species react with a component of the dielectric material to increase an oxygen content of the dielectric material. The invention also includes a method of forming a capacitor construction. A first capacitor electrode is formed to be supported by a semiconductor substrate. A dielectric material is formed over the first capacitor electrode. A precursor is provided at a location proximate the dielectric material, and a laser beam is focused at such location. The laser beam generates an activated oxygen species from the precursor. The activated oxygen species contacts the dielectric material. Subsequently, a second capacitor electrode is formed over the dielectric material.
    Type: Application
    Filed: August 15, 2002
    Publication date: March 6, 2003
    Inventors: Gurtej S. Sandhu, Trung Tri Doan
  • Publication number: 20030045130
    Abstract: The invention includes a method of treating a predominantly inorganic dielectric material on a semiconductor wafer. A laser is utilized to generate activated oxygen species. Such activated oxygen species react with a component of the dielectric material to increase an oxygen content of the dielectric material. The invention also includes a method of forming a capacitor construction. A first capacitor electrode is formed to be supported by a semiconductor substrate. A dielectric material is formed over the first capacitor electrode. A precursor is provided at a location proximate the dielectric material, and a laser beam is focused at such location. The laser beam generates an activated oxygen species from the precursor. The activated oxygen species contacts the dielectric material. Subsequently, a second capacitor electrode is formed over the dielectric material.
    Type: Application
    Filed: August 23, 2002
    Publication date: March 6, 2003
    Inventors: Gurtej S. Sandhu, Trung Tri Doan
  • Publication number: 20030045131
    Abstract: A method of a single wafer wet/dry cleaning apparatus comprising:
    Type: Application
    Filed: August 27, 2002
    Publication date: March 6, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Steven Verha Verbeke, J. Kelly Truman, Christopher T. Lane, Sasson R. Somekh
  • Publication number: 20030045132
    Abstract: An apparatus for connecting an electronic device to a communications system to provide access via the device to a user in a seat on a mobile platform. A jack is pivotally attached to one end of a gooseneck assembly and receives a connector of the electronic device. Another end of the gooseneck assembly is pivotally attached to a pivot for an armrest of the seat. An interface cable extends through the gooseneck assembly and electrically connects the jack with a system connector near the seat. The gooseneck assembly is easily accessible and visible to passengers.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 6, 2003
    Inventor: Donald B. Lee
  • Publication number: 20030045133
    Abstract: A steering column module for a motor vehicle includes functional units such as steering angle sensors and torque sensors adjacently arranged on a steering column. The functional units deliver respective output signals and requiring respective control signals. An electronics unit is connected with an onboard power supply of a motor vehicle for receiving power. The electronics unit is operable for processing the output signals of the functional units and operable for generating control signals for the functional units. A first one of the functional units is connected to the electronics unit via electrical plug-in connector parts with correspondingly arranged counter electrical plug-in connector parts situated on the electronics unit. A second one of the functional units is combined with the electronics unit to form an inseparable assembly.
    Type: Application
    Filed: September 20, 2002
    Publication date: March 6, 2003
    Applicant: Leopold Kostal GmbH & Co. KG
    Inventors: Klaus Hirschfeld, Holger Lettmann, Markus Adam
  • Publication number: 20030045134
    Abstract: The present invention 10 discloses a modular jack system that utilizes magnetic attraction to draw a plug 16 into a jack 18 and then maintain it therein. The present invention 10 discloses a magnetic modular jack system wherein the plug 16 and the jack 18 have at least one pair of cooperating magnets 30, 32 polarized so that the magnets on the plug 16 are drawn to the magnets on the jack 18 thereby pulling the plug 16 into the proper connected position and maintaining it therein. Installation of the plug 16 into the jack 18 is simplified because the magnets will guide the plug 16 into the jack 18 once in the proximity thereof. The present invention 10 could also be adapted for use with other similar applications such as coaxial cable 44 connections to replace the threaded and slip-on types of connections known in the prior art.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventor: Eric Downing
  • Publication number: 20030045135
    Abstract: A switch assembly includes a base with a frame mounted thereto and a circuit board is supported on a flange of the frame. The circuit board has bosses which extend through apertures in the flange and contact the springs are which connected to L-shaped members in the base. An activation member extends through the circuit board and is positioned by a cap. A see-saw switch is connected to the activation member.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Hsun-Wan Yei, Yu-Wen Hwang
  • Publication number: 20030045136
    Abstract: The present invention provides an IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on an insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.
    Type: Application
    Filed: September 4, 2002
    Publication date: March 6, 2003
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Katsumi Suzuki, Takehiro Ito
  • Publication number: 20030045137
    Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.
    Type: Application
    Filed: October 22, 2002
    Publication date: March 6, 2003
    Applicant: Autonetworks Technologies, Ltd.
    Inventors: Shigeki Yamane, Takahiro Onizuka, Isao Isshiki
  • Publication number: 20030045138
    Abstract: A connector having a relatively high terminal density is provide for reducing the requirement of the electric currents in one signal terminal and increase the conducting efficiency. The connector includes plural first conducting components each having a first terminal and extended laterally, plural second conducting components each having at least two second terminals and extended laterally, and an insulating housing having plural slots for mounting the plural first conducting components and the plural second conducting components, wherein each first conducting component and each corresponding second conducting component are mounted in the respective slot, so as to contain a contact pad having plural pins.
    Type: Application
    Filed: August 20, 2002
    Publication date: March 6, 2003
    Applicant: Delta Electronics, Inc.
    Inventors: Bay Shao-Ru Su, Chen Yu Timothy Yu, Kun-Feng Chen, Szu-Lu Huang
  • Publication number: 20030045139
    Abstract: A receptacle having a base and an electrical component mounted on the base is provided. At least two tubular connectors pass through the base. Each of the at least two tubular connectors is connected to the electrical component. Each of the at least two tubular connectors is for receiving a pin and is adapted to make electrical contact with the pin to electrically connect the electrical component to the pin.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Applicant: ADC Telecommunications, Inc
    Inventor: Jeffrey W. Hanson
  • Publication number: 20030045140
    Abstract: A shielded cable assembly contains a hardpoint that resists damage arising from possible collapse of the shielded cable assembly under strong compressional forces that are exerted by a clamp assembly in the form of a separable block having first and second opposed members. The hardpoint contains a conduit that protects a data transfer line or cable bundle by compressing electromagnetic shielding between the conduit and the clamp assembly.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Farrukh S. Syed, Brent A. Boudreaux, Eric C. Peterson, Richard Schumacher, Martha G. Peterson, J. Michael Andrewartha, Jeffrey Todd Haselby, Kirankumar Chhaganlal Patel
  • Publication number: 20030045141
    Abstract: The invention provides EMI cable shield termination apparatus. The apparatus includes (a) a cable exit panel coupled to a first electronic system and (b) one or more clamps coupled to the exit panel. The exit panel serves as an interface for one or more cables coupled to the first electronic system; the clamps provide mechanical coupling, and EMI shielding, for the cables to that interface. The exit panel couples to electrical ground such as through connection to the chassis of the first electronic system. The clamps also couple to ground through connection with the exit panel. Preferably, one end of the cables attaches to the clamps, at the interface formed by the exit panel, and the other end of the cables attach to respective ferrules coupled to a second electronics system. Beneficially, the apparatus reduces EMI effects generated from the first electronic system and coupled into the second electronic system.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Farrukh S. Syed, Eric C. Peterson, Richard Schumacher, Brent Boudreaux, J. Michael Andrewartha, Martha G. Peterson
  • Publication number: 20030045142
    Abstract: A coupling element (K) for mounting to a shielded electrical cable (1), and a method for mounting the it. The cable (1) has plural insulated electrical conductors, a surrounding metallic shield, and an outer insulating jacket. The shield is fixed to a sleeve-like metallic adapter into which conductors of the cable (1) project. The adapter is surrounded by an insulating protective part (2), and for removal of the coupling element the adapter has a hollow space that is free from the insulating material of the protective part (2). An internally-threaded metallic sleeve (7) is freely rotatable about its axis and is captively attached to the adapter at its end facing away from the cable (1) and encompasses the adapter. A connector body (8) having a threaded fitting and enclosing the contact carrier is screwed into the sleeve so that it abuts the adapter with a moisture-tight fit.
    Type: Application
    Filed: August 6, 2002
    Publication date: March 6, 2003
    Applicant: NEXANS
    Inventors: Friedrich Schauer, Martin Czeschka
  • Publication number: 20030045143
    Abstract: A rotable plug for connecting to an electronic receptacle is disclosed. The rotable plug applied in an electronic equipment includes a plug for plugging into the electronic receptacle and fixing and electrically connecting to at least two conductive wires, a rotary case for disposing the plug, a top cover having a circle opening and an annular frame, wherein the annular frame is disposed around the opening for accommodating the rotary case therein to rotate and the plug is carried to rotate when the rotary case is rotated, and a restricting mechanism for limiting the rotary case to rotate in a particular rotating range.
    Type: Application
    Filed: January 10, 2002
    Publication date: March 6, 2003
    Inventor: Chen-Chun Chen
  • Publication number: 20030045144
    Abstract: An electrical connector system (30) for transmitting electrical signals from a GBIC module inserted in a guide rail (10) mounted a distance above a printed circuit board (50) includes a substrate (70) having upper and lower surfaces (72, 74), a first connector (60) mounted on the upper surface of the substrate, and a second connector (80) mounted on the lower surface of the substrate and electrically connecting with the first connector. The substrate and the second connector together define a receiving space (90) for receiving another electrical element therein. The second connector comprises a base (82), a plurality of pins (84) secured to the base, an insulative extension (86), and a metal shell (88) enclosing the base. Each pin has a first end (842) connecting to the substrate and a second end (844) connecting to the printed circuit board.
    Type: Application
    Filed: September 4, 2001
    Publication date: March 6, 2003
    Inventor: Jenq-Yih Hwang
  • Publication number: 20030045145
    Abstract: An electrical receptacle, including a power source and a contact for making an electrical connection between the power source and a prong of an electrical plug. At least one switch is in series between the contact and the power source, and a smooth member covers at least a portion of the at least one switch. The switch is normally in the closed position and moves in a direction from the closed position to the open position due to a force applied to the smooth member covering at least a portion of the at least one switch by the prong of the electrical plug when the prong of the electrical plug is inserted into the electrical receptacle and contacts the resilient, smooth member.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Applicant: Hubbell Incorporated
    Inventors: Sorin I. Mortun, Thomas J. Vigorito
  • Publication number: 20030045146
    Abstract: In a cable reel, a movable inner sleeve is rotatably coupled to a stationary outer sleeve and a flat cable is contained in an annular chamber defined between the sleeves. An end of the flat cable is connected through bus bars to wires of an external circuit. A connection member holds intermediate portions of the bus bars. A distal end of the flat cable abuts a lower stopper wall of the connection member and comes into contact with the bottom surfaces of the bus bars. Distal ends of the external circuit wires abut an upper stopper wall of the connection member and come into contact with top surfaces of the bus bars. The connection members are stacked to form an air insulation layer between the stacked members by providing lower walls on the bottom of an upper level connection member and upper partitions on the top of a lower level connection member.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 6, 2003
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Shoichi Sugata
  • Publication number: 20030045147
    Abstract: A safe connecting end structure for a multi-wire and multi-loop flexible lamp pipe, wherein a transparent flexible pipe of the lamp pipe is provided therein with a plurality of lamp strings and related conductors, the two ends of the pipe are provided with a male insertion end and a female insertion end respectively, the ends of the conductors are provided with male and female metallic conducting members respectively connectable by insertion to each other; high temperature durable inner sleeves are formed at the junctions of the ends of the conductors and the metallic conducting members, and male and female external sleeves are formed about the inner sleeves at the male and female insertion ends.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 6, 2003
    Applicant: Shining Blick Enterprises Co., Ltd.
    Inventor: Peter K. H. Huang
  • Publication number: 20030045148
    Abstract: A socket for electrical parts includes: a socket body on which the electrical part having a plurality of terminals is accommodated; a plurality of contact pins arranged to the socket body and adapted to electrically contact with the terminals of the electrical part; and a latch member attached to the socket body and adapted to press the electrical part, the latch member including an arm member attached to be movable to the socket body and a pressing member attached to be movable to the arm member and adapted to press the electrical part, the pressing member being made retractable into a retraction position from a pressing position where the pressing member presses said electrical part, by moving said arm member and said pressing member in relation to said arm member, said electrical part being able to be accommodated on or taken out from the socket body at a time the pressing member is in the retraction position.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 6, 2003
    Applicant: Enplas Corporation of Kawaguchi, Japan
    Inventor: Tsuyoshi Watanabe
  • Publication number: 20030045149
    Abstract: A manual variable optical attenuator (10) includes a base (2), a cover (3), an optical module (4), a shifting device (5), and an optical fiber retainer (6). The optical module comprises a mirror (41), a frame (42), a dual optical fiber collimator (43), a stopper (44), a graded transmittance filter (45), and a filter carrier (46). The shifting device comprises a screw pole (51), a first holder (52), and a second holder (53). The screw pole comprises a terminal portion (511) rotatably received in the first holder, a first annular groove (512) accommodating the second holder, a second annular groove (513) receiving a gasket (514), an adjusting slot (515), and a screw thread (516). T he gasket protrudes from a circumferential surface of the screw pole and seals a gap between the screw pole and a sidewall (36) of the cover. External harmful contamination cannot penetrate into the attenuator.
    Type: Application
    Filed: December 24, 2001
    Publication date: March 6, 2003
    Inventor: Yao-Hao Chang
  • Publication number: 20030045150
    Abstract: A socket for a plug connection comprises a socket housing that has a contact chamber in which a plurality of socket contacts is arranged, a protective seal being provided which can be moved between a covering position in which it closes the contact chamber so as to be essentially flush towards outside, and a contact position in which the socket contacts are able to be accessed, the protective seal being able to be transferred from the covering position into the contact position by means of a complementary plug. There is further proposed a plug connection including such socket and a plug.
    Type: Application
    Filed: August 16, 2002
    Publication date: March 6, 2003
    Applicant: HARTING Automotive GmbH & Co. KG.
    Inventor: Jens Krause
  • Publication number: 20030045151
    Abstract: The invention proposes an arrangement (10) for the electrical connection of a lamp (12), of the type in which the lamp (12) is fitted in a support (14) and it is connected electrically to an electrical power-supply harness (107) by having the fixed terminals (24, 26, 28) coming into contact with connecting terminals (65) carried by a terminal block (36). The fixed terminals (24, 26, 28) of the lamp (12) extend laterally overall outwards along directions which are each contained in a substantially transverse plane. The terminal block (36) is fitted movable with respect to the support (14) between a locked position in which the connecting terminals (65) are in electrical contact with the associated fixed terminals (24, 26, 28), and an unlocked position in which the connecting terminals (65) are spaced away from the fixed terminals (24, 26, 28).
    Type: Application
    Filed: August 28, 2002
    Publication date: March 6, 2003
    Inventors: Daniel Josquin, Alexandre Mensales
  • Publication number: 20030045152
    Abstract: A ZIF socket (1) comprises a base (10), a sliding cover (20) and an actuating lever (30). The actuating lever is substantially L-shaped and includes a handle (34) and a driving arm (32) extending perpendicularly from a joining portion (35) of the handle. The driving arm comprises an elongate pivot (321), a cam portion (33) extending forwardly from the pivot and a large-dimensioned portion (36) formed at one end of the pivot proximate to the joining portion. The joining portion has enough strength for resisting breakage and damage. When an excessive force is exerted on the handle of the actuating lever, or even after repeated actuation of the actuating lever, the joining portion of the actuating lever will not be damaged. Thus, the actuating lever may have a longer life than the conventional design and makes the ZIF socket work more reliably.
    Type: Application
    Filed: September 18, 2001
    Publication date: March 6, 2003
    Inventor: Fang-Chu Liao
  • Publication number: 20030045153
    Abstract: A locking arm 27 if supported by a fulcrum 31 attached to a body 28 and a pair of coupling portions 33, 34. When an operation portion 30 is pressed down, an engaging portion 29 located between the fulcrum 31 and the coupling portions 33, 34 is shifted vertically to a direction of coupling a connector 10 with a complementary connector 38. The coupling portions 33, 34 are made in parallel to the direction of coupling the connector 10 with the complementary connector 38. The pair of coupling portions 33 and 34 are formed as a pair of legs. A sliding groove 35 is formed between the pair of legs 33 and 34 so as to correspond to an engaging portion 44 of the complementary connector 38. The engaging portion 44 will be slid into the sliding groove 35. In such a configuration, the locking mechanism can remove backlash between a female connector and a male connector to provide high coupling accuracy.
    Type: Application
    Filed: July 31, 2002
    Publication date: March 6, 2003
    Inventor: Takanori Yamawaki
  • Publication number: 20030045154
    Abstract: Interface devices for use in a computer system are provided. A representative interface device includes an interface connector and an interface adapter. The interface connector is configured to mate with the connector of a computing device. The interface adapter engages the interface connector and defines a first alignment surface. The first alignment surface is configured to engage a first protrusion of the computing device as the interface connector is moved toward mating engagement with the connector of the computing device. So configured, the interface connector can be aligned with the connector of the computing device prior engagement of the interface connector with the connector of the computing device. Other systems also are provided.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 6, 2003
    Inventors: Raymond L. Ayers, Dean Richtsmeier
  • Publication number: 20030045155
    Abstract: A printed circuit board assembly which is capable of being inserted and removed from the system to which it is electrically connected, even when fully populated with connected printed circuit cards, comprises a multilayer structure. A middle layer printed board is sandwiched between a nonconductive base on the bottom and a stiffener disposed on the top. The stiffener is preferably electrically conductive to provide an EMI (electromagnetic interference) shielding function. The base support and stiffener together support a mechanism for insertion and removal of the entire board via an edge connector disposed along a back edge of the board.
    Type: Application
    Filed: August 29, 2001
    Publication date: March 6, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dennis R. Barringer, Harold M. Toffler
  • Publication number: 20030045156
    Abstract: An end aligning mechanism of a wire insulation displacement connection apparatus including an applicator for holding a connector and having a vertical surface, a press-contacting device such as a stuffer, and a fixed wire guide. The stuffer moves along the vertical surface of the applicator and presses wires into the connector while unaligned tips of the wires abut the vertical surface. As the tips of the wires are pressed by the stuffer, excess lengths of the wires are moved upstream through the fixed wire guide. When the wires are at an appropriate length, they are press-contacted and connected to the connector.
    Type: Application
    Filed: August 23, 2002
    Publication date: March 6, 2003
    Inventor: Satoshi Suzuki
  • Publication number: 20030045157
    Abstract: Wire insulation displacement connection apparatus including a wire supply portion, a first press-contacting portion arranged downstream from the wire supply portion, and a second press-contacting portion arranged downstream of the first press-containing portion. A pitch converting comb blade is arranged between the second press-contacting portion and a measuring clamp, which pulls out a first connector press-contacted to front tips of the wires. The pitch converting comb blade has pitch conversion grooves which increase the spacing between the wires. The comb blade is arranged such that the pitch of the wires in the region of the second press-contacting portion, where a second connector is press-contacted to the wires, is the same as the pitch of the terminals of the second connector.
    Type: Application
    Filed: August 23, 2002
    Publication date: March 6, 2003
    Inventor: Satoshi Suzuki
  • Publication number: 20030045158
    Abstract: A connector includes first wire-holding portions (3) for holding power-supplying wires (2) in a juxtaposed manner, a second wire-holding portion (6) for alternately holding earth wires (4) and signal-purpose or power-receiving wires (5) for auxiliary equipments in a juxtaposed manner in a direction substantially perpendicular to a longitudinal direction of the wires (2) held by the first wire holding portions (3), a plurality of press-contacting joint terminals (8), each including a second press-contacting terminal (18) for connection to the corresponding signal-purpose or power-receiving wire (5) and a first press-contacting terminal (17) which is connected to the second press-contacting terminal (18), and can be connected to the corresponding wire (2) held by the first wire-holding portions (3), and an earth terminal (9) which can be connected to the earth wires (4) and can be connected to an earth side.
    Type: Application
    Filed: August 29, 2002
    Publication date: March 6, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Kaoru Suzuki, Nobuhiro Takada, Koji Toka
  • Publication number: 20030045159
    Abstract: A cable bundle clamp to provides a tie-down for large cable bundles. The clamp includes a T-shaped element and a base. The T-shaped element rotates about a pivot point supported by the base. The cables of the cable bundle are split equally to pass on either side and underneath the T-shaped element. On one side of the T-shaped element, the cables of the bundle are “tie wrapped” together. The tie wrap pushes the T-shaped element when the bundle moves and prevents cable slippage past the T-shaped element due to movement of the connected electronic system. When pushed, the T-shaped element rotates and clamps down on the bundle to stop slippage therethrough. The clamp helps maintain a service loop distance for cabling attached to the electronics.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventor: Brent A. Boudreaux
  • Publication number: 20030045160
    Abstract: A connector that may indicate an edition of a connecting interface of a computer, includes a host controller, and an indicator electrically connected to the host controller. The host controller includes a judging device used to judge a transmitting velocity between the host of the computer and the peripheral device. Thus, the indicator may be adapted to indicate the edition of the connecting interface according to the transmitting velocity between the host of the computer and the peripheral device.
    Type: Application
    Filed: June 20, 2002
    Publication date: March 6, 2003
    Inventor: Yu-Guang Chen
  • Publication number: 20030045161
    Abstract: In a half-fitting prevention connector (11) of the invention, a female connector (20) includes a housing body (22), and a flexible lock arm (21) formed on an upper surface of the housing body (22). A projecting portion (21c) is formed at a front end of the flexible lock arm (21), and a lock arm guide groove (21c) is formed in a lower surface of the projecting portion (21b) . A flexible lock arm-guide portion (30c) for fitting in the lock arm guide groove (21c) is formed on one side portion of an upper surface of a housing body (30b) of a male connector housing (30). A flexible lock arm-holding portion (41c) is formed on an upper portion of one inner side surface of a detection member body (41), and projects horizontally therefrom.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 6, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Tomomi Endo, Naoto Taguchi
  • Publication number: 20030045162
    Abstract: Hence, according to the present invention a cable connector assembly for being connected to a flat ribbon cable including a plurality of conductors and electrical insulation about said conductors maintaining the latter electrically insulated from each other. The cable connector assembly comprises a plurality of electrical contacts, each including terminal means being configured to connect at least one of said conductors directly through said electrical insulation to form an electrical junction, and contacting means on each of said electrical contacts being configured to electrically connect each of said electrical contacts to an external member. It further comprises a housing for holding said contacting means arranged in a first row and a second row forming an orthogonal grid.
    Type: Application
    Filed: July 11, 2002
    Publication date: March 6, 2003
    Applicant: International Business Machines Corporation
    Inventors: Willi Recktenwald, Klaus Thumm
  • Publication number: 20030045163
    Abstract: A power cord securing device is installed within a housing of an electrical appliance for securing a power cord. The power cord securing device includes a rotatable plate having a first part for being wound by the power cord, and a resilience element having a first terminal and a second terminal respectively connected to a second part and a third part of the rotatable plate. When the power cord is stretched, the rotatable plate is forced to rotate in a first direction and allow the resilience element to result in an counterforce, and when the counterforce is relieved, the rotatable plate rotates in a second direction opposite to the first direction.
    Type: Application
    Filed: February 28, 2002
    Publication date: March 6, 2003
    Inventors: Wen-Hsuan Lee, Chia-Fu Liu
  • Publication number: 20030045164
    Abstract: The present invention provides a nonwoven fabric material prepared from short fibers including thermal-resistant synthetic fibers bound with an inorganic binder, a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.
    Type: Application
    Filed: February 17, 2000
    Publication date: March 6, 2003
    Inventors: Fumio Echigo, Yoshihiro Kawakita