Abstract: A DC-DC converter of synchronous rectification type is provided which comprises: a current detector (51) for discerning electric current (IQ1, IQ2) flowing through a primary side circuit; first and second DC biasing power supplies (53, 54) for producing a bias voltage (VBS1, VBS2) higher than voltage corresponding to excitation current through transformer (4); and first and second comparators (55, 57) for activating first and second rectifying MOS-FET (7, 8) when current detector (51) produces the detection voltage (VDT) over bias voltage (VBS1, VBS2) of first and second DC biasing power supplies (53, 54). As each of first and second rectifying MOS-FETs (7, 8) in secondary side circuit is driven synchronously with electric current (IQ1, IQ2) flowing through the primary side circuit except excitation current component through transformer (4), the converter can minimize switching loss in each rectifying MOS-FET (7, 8) in secondary side circuit to improve conversion efficiency.

Abstract: A method and circuitry for alleviating the adverse effect of variable read decode propagation delays and variable output circuitry propagation delays on the read latency, and specifically for generating output enable signals at an appropriate time in light of such variable delays, is disclosed. In one embodiment, a first time domain as specified by an internal clock is delayed by the propagation delay of the read decoder block plus the propagation delay of the output circuitry via a model to create a second time domain which lags the first time domain. Processing in the second time domain associates the internal read command with a particular external clock cycle, and accounts for the specified read latency of the device. The output of such second time domain processing is a signal indicative of which external cycle should be used to enable the outputs. This signal is then converted back into the first timing domain by latches which lead the second timing domain.

Abstract: A CAM system comprising a plurality of CAM devices connected in a serial cascade arrangement, the CAMs in the cascade being connected to an adjacent CAM by a respective forwarding bus, with at most a first CAM in the cascade being connected to a receive data signals from a host controller and at most a last CAM devices being coupled to forward results back to the host controller; and a send signal generation means for supplying a SEND signal to the last CAM; the SEND signal for coordinating transfer of the search result from the last CAM to the host controller, the serial cascade arrangement minimizing the number of CAMs being connected to a common forwarding bus.

Abstract: A TCAM (ternary content addressable memory) cell array is provided with a search input node into which one bit of search data is inputted, a plurality of data input nodes into which a bit corresponding to one bit of search data is inputted, and a plurality of memory cells arranged in rows and columns. Each of the plurality of memory cells further includes a first cell storing one bit of said storage data, and a logical operation cell determining whether or not said search data and storage data match. A gate of a transistor forming each of a plurality of memory cells extends along the direction of said rows. Each of a plurality of wells in the region where the memory array is formed is formed so as to continue to a corresponding well of an adjacent memory cell in the direction of said columns.

Abstract: An architecture, and its method of formation and operation, containing a high density memory array of semi-volatile or non-volatile memory elements, including, but not limited to, programmable conductive access memory elements. The architecture in one exemplary embodiment has a pair of semi-volatile or non-volatile memory elements which selectively share a bit line through respective first electrodes and access transistors controlled by respective word lines. The memory elements each have a respective second electrode coupled thereto which in cooperation with the bit line access transistors and first electrode, serves to apply read, write and erase signals to the memory element.

Abstract: A giant magnetoresistance (GMR) sensor with side longitudinal bias (LB) stacks is proposed for magnetic recording at ultrahigh densities. The GMR sensor extends from a read region into two side regions. The side LB stacks overlies the GMR sensor in the two side regions, rigidly pinning sense layers through antiparallel coupling across an antiparallel coupling spacer layer. Magnetostatic interactions occur in the sense layers between the read and side regions, thereby stabilizing the sense layers in the read region.

Abstract: A memory module comprises of a plurality of memory chips arranged in a rank and configured to input and output data in response to at least one of a command signal and an address signal. The memory module also comprises of a plurality of chip select pin terminals configured to transfer a plurality of chip select signals provided from an external device to the plurality of memory chips.

Abstract: A circuit is proposed which has a memory to which input data can be written at different write addresses with a first clock rate and from which output data can be read at different read addresses with a second clock rate. The memory can be fed a write reset pulse that resets the write address to an initial value. In addition, the memory can be fed a read reset pulse by means of which the data are output in a fixed temporal relationship. Finally, the circuit proposed is provided with switching means in order to derive the read reset pulse from the write reset pulse. This ensures that the two reset pulses cannot occur simultaneously.

Abstract: Four memory cells each obtained by connecting a ferroelectric capacitor in parallel to a transistor are connected in series with each other to constitute a cell block. A sense amplifier circuit is arranged on a one-end side in a column direction every four cell blocks sequentially adjacent to each other in a row direction. One ends of the four cell blocks are connected to four different plate lines, respectively, and the other ends of the four cell blocks are connected to four different bit lines through four block selection transistors, respectively. Of the four bit lines, two bit lines constitute a first bit line pair, and the two remaining bit lines constitute a second bit line pair. Any one of the first and second bit line pairs is connected to the sense amplifier circuit and the other bit line pair is connected at a constant voltage.

Abstract: A ferroelectric storage device includes a ferroelectric capacitor C1, a bit line BL, a first switching element 103 selectively connecting the ferroelectric capacitor C1 and the bit line BL, a first transistor 203 connected to the bit line BL and to a reference potential, a reference ferroelectric capacitor CR1, a reference bit line Lref, a reference switching element 105 selectively connecting the reference ferroelectric capacitor CR1 and the reference bit line Lref, a second transistor 201 connected to the reference bit line Lref and to the reference potential, potential control circuits 110 and 200 controlling a potential of the bit line BL and a potential of the reference bit line Lref, and a timing control circuit 210 controlling a detection timing for detecting data on the bit line.

Abstract: A ferroelectric memory device being short in the bit line direction. The ferroelectric memory device is structured including a first word line extending in the first direction; a plurality of element regions arrayed in the first direction on both sides of the first word line; a plurality of ferroelectric capacitors connected to the respective element regions and driven by the first word line. Each of the element regions preferably has a stair-like shape when seen in a plane view and the first word line is preferably arranged bent between the element regions.

Abstract: A method of erasing a chalcogenide variable resistance memory cell is provided. The chalcogenide variable resistance memory cell includes a p-doped substrate with an n-well and a chalcogenide variable resistance memory element. The method includes the step of applying to the variable resistance memory element a voltage that is less than a fixed voltage of the substrate. The applied voltage induces an erase current to flow from the p-doped substrate through the n-well and through the variable resistance memory element.

Abstract: Disclosed is a phase-changeable memory device and method of programming the same. The phase-changeable memory device includes memory cells each having multiple states, and a program pulse generator providing current pulses to the memory cells. The program pulse generator initializes a memory cell to a reset or set state by applying a first pulse thereto and thereafter provides a second pulse to program the memory cell to one of the multiple states. According to the invention, as a memory cell is programmed after being initialized to a reset or set state, it is possible to correctly program the memory cell without influence from the previous state of the memory cell.

Abstract: The present invention provides a storage device including a storage element, a circuit element, and write control means. The storage element has a characteristic exhibiting a resistance changing from a large value to a small value due to application of an electrical signal at least equal to a first threshold signal but changing from a small value to a large value due to application of an electrical signal at least equal to a second threshold signal. The circuit element is connected in series to the storage element. The write control means is configured to carry out a first write operation, detect a resistance by the storage element after an n-th write operation, where n?1, compare the detected resistance with the set value, and carry out a (n+1)-th write operation.

Abstract: A memory device includes a memory array, an I/O circuit for accessing the memory array, and a tracking circuit. The tracking circuit includes a dummy bit line, a first tracking cell including a first NMOS transistor, the first tracking cell being coupled to receive a control signal and also coupled to the dummy bit line through the first NMOS transistor, and a second tracking cell including a second NMOS transistor, the second tracking cell being coupled to receive the control signal and also coupled to the dummy bit line through the second NMOS transistor, a gate of the second NMOS transistor being coupled to the dummy bit line. The memory device also includes a control circuit coupled to the dummy bit line for generating a clock signal for the I/O circuit.

Abstract: Normal memory cells are arranged in rows and columns, and dummy memory cells are arranged to form dummy memory cell rows by sharing memory celf columns with the normal memory cells. When there is at least one defect in the normal memory cells and/or the dummy memory cells, replacement/repair is carried out using a redundant column in a unit of memory cell column. The redundant column includes not only spare memory cells for repair of the normal memory cells but also spare dummy memory cells for repair of the dummy memory cells.

Abstract: A rewriteable nonvolatile memory cell is taught comprising a thin film transistor and a switchable resistor memory element in series. The switchable resistor element decreases resistance when subjected to a set voltage magnitude applied in a first direction, and increases resistance when subjected to a reset voltage magnitude applied in a second direction opposite the first. In preferred embodiments the memory cell is formed in an array, preferably a monolithic three dimensional memory array in which multiple memory levels are formed above a single substrate. In preferred embodiments a thin film transistor and a switchable resistor memory element are electrically disposed between a data line and a reference line which are parallel. Preferably a select line extending perpendicular to the data line and reference line controls the transistor.

Abstract: A phase change memory device and a method of fabricating the same. The phase change memory device may include a lower electrode which is electrically connected to a transistor formed on a semiconductor substrate, a first insulation layer which covers the lower electrode and the substrate and has a first hole exposing the lower electrode, a conductive contact formed in the first hole, a second insulation layer which is formed on the first insulation layer has a second hole corresponding to the conductive contact, a phase change material layer which fills the second hole, and an upper electrode which covers an upper surface of the phase change material layer.

Abstract: The present invention is related to semiconductor memories, and in particular, to a nonvolatile or flash memory and method that reduces the effect of or is tolerant of over-erased memory cells. When a memory cell is read, a read voltage is applied to at least one target memory cell, and a negative bias voltage that is lower than a threshold voltage of an over-erased memory cell is also applied to at least one other selected memory cell that is in the same row as the target memory cell. Applying a negative bias voltage to adjacent or proximate memory cells shuts off nearby cells to isolate current that may come from over-erased memory cells during a read, program, or erase operation.

Abstract: A shadow RAM or “non-volatile SRAM” memory cell is implemented in a much smaller area by building the cell upward rather than outward. By stacking non-volatile storage devices above or below an SRAM cell, a smaller cell can be provided and result in a lower cost memory device. In certain embodiments, such a memory cell includes a pair of cross-coupled devices disposed on a first device layer and defining a pair of internal cross-coupled nodes, and a pair of non-volatile storage devices disposed on a second device layer above or below the pair of cross-coupled devices and coupled to the cross-coupled nodes.

Abstract: A non-volatile memory is described. The non-volatile memory includes a first source/drain region, a second source/drain region, a charge-trapping layer and a gate layer. The first source/drain region is disposed beside the top sidewall of a trench in a substrate. The second source/drain region is disposed in the substrate at the bottom of the trench. The gate layer is disposed in the trench and on the substrate. The charge-trapping layer is disposed between the gate layer and the substrate. A plurality of assisted charges is stored in one of the sides of the charge-trapping layer.

Abstract: Methods and apparatus on charges injection using piezo-ballistic-charges injection mechanism are provided for semiconductor device and nonvolatile memory device. The device comprises a strain source, an injection filter, a first conductive region, a second conductive region, and a third conductive region. The strain source permits piezo-effect in ballistic charges transport to enable the piezo-ballistic-charges injection mechanism in device operations. The injection filter permits transporting of charge carriers of one polarity type from the first conductive region, through the filter, and through the second conductive region to the third conductive region while blocking the transport of charge carriers of an opposite polarity from the second conductive region to the first conductive region.

Abstract: A semiconductor memory device, comprising: a memory cell array of a plurality of memory cell units, each memory cell unit including a plurality of serially connected memory cells formed on the same well region, each memory cell having a floating gate and a control gate stacked, said serially connected memory cells having one end serially connected to a first selection gate transistor, said serially connected memory cells having the other end connected to a common source line via a second selection gate transistor; a sense amp connected to one end of said first selection gate transistor via a bit line and operative to read data out of said memory cell array; and wherein a voltage applied to said well region and said source line varies to cancel a change of threshold of said memory cells depending on the temperature.

Abstract: A word line driving circuit, which may include a read voltage generator and a word line driver. The read voltage generator may precharge a clamp capacitor with a power supply voltage to stably generate a read voltage in response to a read command. A capacitance of the clamp capacitor may be varied to compensate for a fluctuation of a power supply voltage level. The word line driver may distribute electric charges precharged in the clamp capacitor to a word line in response to a word line selecting signal. Therefore, the word line driving circuit may reduce unnecessary power consumption in a standby mode by operating the word line rapidly with charge sharing in a read mode.

Abstract: Using charges accumulated in a capacitance element connected to a drain side node of a memory cell, data is written in accordance with source side injection method. The capacitance value of the capacitance element is changed in accordance with the value of write data. A non-volatile semiconductor memory device allowing writing of multi-valued data at high speed with high precision is achieved.

Abstract: A method of programming a memory cell in a non-volatile memory device includes applying a first voltage to a control gate associated with the memory cell and applying a second voltage to a drain region associated with the memory cell. The method also includes applying a positive bias to a source region associated with the memory cell and/or applying a negative bias to a substrate region associated with the memory cell.

Abstract: A memory device verify system determines a state of memory cells in a memory. The memory includes a memory array having a plurality of memory cells coupled to bit lines. A verify circuit is coupled to the bit lines to determine if memory cells have a erase level that is within predetermined upper and lower limits. The verify circuit can include first and second comparators. In one embodiment, the first comparator is used to compare a bit line current with an upper first reference current. The second comparator is used to compare a bit line current with a lower second reference current. The comparator circuit is not limited to reference currents, but can use reference voltages to compare to a bit line voltage. The verify circuit, therefore, eliminates the need for separate bit line leakage testing to identify over-erased memory cells.

Abstract: A data bus circuit for an integrated circuit memory includes a 4-bit bus per I/O pad that is used to connect the memory with an I/O block, but only two bits per I/O are utilized for writing. Four bits per I/O pad are used for reading. At every falling edge of an input data strobe, the last two bits are transmitted over the bus, which eliminates the need for the precise counting of input data strobe pulses. The data bus circuit is compatible with both DDR1 and DDR2 operating modes.

Abstract: A non-volatile memory cell includes a switchable resistor memory element in series with a switch device. An array of such cells may be programmed using only positive voltages. A method for programming such cells also supports a direct write of both 0 and 1 data states without requirement of a block erase operation, and is scalable for use with relatively low voltage power supplies. A method for reading such cells reduces read disturb of a selected memory cell by impressing a read bias voltage having a polarity opposite that of a set voltage employed to change the switchable resistor memory element to a low resistance state. Such programming and read methods are well suited for use in a three-dimensional memory array formed on multiple levels above a substrate, particularly those having extremely compact array line drivers on very tight layout pitch.

Abstract: A non-volatile memory cell includes a switchable resistor memory element in series with a switch device. An array of such cells may be programmed using only positive voltages. A method for programming such cells also supports a direct write of both 0 and 1 data states without requirement of a block erase operation, and is scalable for use with relatively low voltage power supplies. A method for reading such cells reduces read disturb of a selected memory cell by impressing a read bias voltage having a polarity opposite that of a set voltage employed to change the switchable resistor memory element to a low resistance state. Such programming and read methods are well suited for use in a three-dimensional memory array formed on multiple levels above a substrate, particularly those having extremely compact array line drivers on very tight layout pitch.

Abstract: An output circuit and method thereof. In an example, the output circuit may include an output buffer configured to buffer output data and to transfer the buffered output data to an output node, the output buffer initializing the output node in response to a triggering signal. In another example, the method may include buffering output data in response to an output buffer enabling signal, transferring the buffered output data to an output node and initializing the output node of an output buffer in response to a triggering signal.

Abstract: A system and method to operate an electronic device, such as a memory chip, with a data driver circuit that is configured to reduce data pin (DQ) capacitance is disclosed. In a driver circuit that is comprised of a set of ODT (On-Die Termination) legs and a set of non-ODT legs, a methodology according to the present disclosure allows selective activation and deactivation of tuning transistors in the ODT and non-ODT legs. During a default operational state of the electronic device (e.g., when no data read operation is taking place), the tuning transistors in the non-ODT legs may be maintained “turned off” or “disabled” to reduce DQ pin capacitance contributed by these tuning transistors had they been active during this default state. These non-ODT leg tuning transistors may be turned on, for example, when a data read operation is to be performed. Similarly, the tuning transistors in the ODT legs also may be selectively enabled/disabled to further control or reduce DQ pin capacitance as desired.

Abstract: A power-down mode exit control circuit enables a memory device to exit from an initially set power-down mode state using a clock enable signal. Specifically, although a clock enable signal is inputted in an unstable state at an initial operation indicating that a supply of a supply voltage is started, the present invention provides the power-down mode exit control circuit which is capable of escaping from the power-down mode at an internally set correct time. For this, the present invention comprises: a clock enable signal sensor for sensing an activation or deactivation state of a clock enable signal; and a power-down mode exit signal generator for activating and outputting a power-down mode exit signal in accordance with the activation state of the clock enable signal sensed by the sensor, after storing information related to the deactivation state of the clock enable signal sensed by the sensor.

Abstract: A laminated panel for use as a display panel has a polystyrene plastic core and a cellulosic surface on each face of the core. The surface layers are impregnated with a resin formulation containing an optical brightener, and optionally a dye, and then pressed onto each face of the core to form the laminate. The finished panel is found to have outstanding brightness, and can be imprinted using a flat bed digital printed to produce signage for a variety of consumer applications.

Abstract: A method for calibrating a data valid window including the steps of: (A) setting a base delay of one or more datapaths to a predetermined value, (B) determining an optimum offset delay value for each of the one or more datapaths based upon actual memory accesses and (C) delaying a read data strobe signal based upon the base delay and the optimum offset delay value for each of the one or more datapaths.

Abstract: A circuit for adjusting a signal length is adapted for a memory device. The circuit adjusts a signal length of an ATD signal. The circuit includes a timing module, an encoding module and a logical control unit. Wherein, the timing module generates a plurality of timing signals according a pulse generated by the ATD signal. The encoding module is coupled to one of the data lines of the memory device. The timing signals are registered and encoded to generate a time value according to the status of the data output from the memory device. In addition, the logic control unit compares the present time value and the previous time value to generate a comparison result. The signal length of the ATD signal is adjusted according to the comparison result.

Abstract: Disclosed is an apparatus for detecting power supply dependency and process dependency of a delay circuit to enable control of the delay of the delay circuit and operation acceleration/deceleration. The apparatus includes a first delay circuit receiving a first signal and delaying the first signal received by a preset delay time to output the so delayed signal, a second delay circuit receiving the first signal in common with the first delay circuit and outputting signals of different delay amounts from plural output ends thereof, and a plural number of comparator circuits provided in association with the plural outputs of the second delay circuit, each configured to receive an output of the first delay circuit and a corresponding output of the second delay circuit and to compare the signals received. The delay of the control signal is varied by a variable delay circuit, based on plural outputs of the plural comparator circuits, in order to variably control e.g.

Abstract: A 256 Meg dynamic random access memory is comprised of a plurality of cells organized into individual arrays, with the arrays being organized into 32 Meg array blocks, which are organized into 64 Meg quadrants. Sense amplifiers are positioned between adjacent rows in the individual arrays while row decoders are positioned between adjacent columns in the individual arrays. In certain of the gap cells, multiplexers are provided to transfer signals from I/O lines to datalines. A data path is provided which, in addition to the foregoing, includes array I/O blocks, responsive to the datalines from each quadrant to output data to a data read mux, data buffers, and data driver pads. The write data path includes a data in buffer and data write muxes for providing data to the array I/O blocks. A power bus is provided which minimizes routing of externally supplied voltages, completely rings each of the array blocks, and provides gridded power distribution within each of the array blocks.

Abstract: A current limit circuit comprising: a current limit element for limiting an output current level to within a predetermined range of a limiting current and including a first PMOS transistor having a source to which a predetermined voltage is applied and a drain through which the output current is supplied; and a gate voltage generating circuit for generating a gate voltage by a feedback control such that a difference between the predetermined voltage and a gate voltage of the first PMOS transistor coincides with a threshold voltage of a second PMOS transistor having approximately the same characteristic as that of the first PMOS transistor in a state in which a predetermined current is flowing through the second PMOS transistor.

Abstract: A method and a device for regulating the threshold voltage of a transistor is disclosed. The device includes a circuit configured for modifying a voltage applied at a bulk connection of the transistor such that the threshold voltage of the transistor is substantially temperature-independent at least in a first temperature range. In one embodiment, the device includes a memory device, and the transistor is a transistor of a sense amplifier of the memory device.

Abstract: A data input and data output control device and method in which a plurality of write or read data composed of m (2n+k) bits (where m, n, and k are all integers) may be accessed within one clock of external input clock.

Abstract: A self-refresh module includes an oscillator configured to provide a first signal having a first frequency, a trimming divider configured to trim the first signal to provide a second signal having a second frequency, and a temperature sensor configured to sense a temperature of the memory device and provide a temperature signal. The self-refresh module includes a temperature look-up table configured to receive the temperature signal and provide a third signal based on the temperature signal, and a temperature divider configured to provide a self-refresh pulse signal based on the second signal and the third signal.

Abstract: In a semiconductor device, an internally-generated power supply voltage VPP is monitored. If the internally-generated power supply voltage VPP is lower than a lower limit voltage, serial refresh is selected as a double refresh operation mode. In the serial refresh, double refresh for a pair address is inserted in a next refresh cycle. By the serial refresh, decrease of the internally-generated power supply voltage VPP is suppressed.

Abstract: In one embodiment, an antifuse cell includes a select transistor, a blocking transistor, and an antifuse. The select transistor allows for selection of the antifuse cell among an array of antifuse cells, while the blocking transistor limits the amount of voltage that may be directly applied to the select transistor. The antifuse may comprise a capacitor. The capacitor may include a gate over a gate oxide and an n-well under the gate oxide. The n-well may have two n+ regions used as contact points for the n-well. Upon programming, an electrically conductive path (e.g. a short) is permanently burned through the gate oxide. The antifuse cell occupies a relatively small area while providing a relatively tight read current distribution.

Abstract: A memory card and a control chip capable of supporting various voltage supplies and a method of supporting voltages thereof are provided. The memory card comprises a flash memory and a control chip for controlling the flash memory, and the control chip has a voltage regulator, a pad power supplier, a core controller and an output circuit. The voltage regulator transforms an external working voltage into a working voltage. The pad power supplier receives the external working voltage and adjusts a level of the external working voltage to output a pad working voltage according to an operating mode. The core controller receives the working voltage to work and generates a control signal. The output circuit receives the control signal and outputs a memory control signal according to a level of the pad working voltage. The control chip controls a flash memory with the memory control signal.

Abstract: Provided is a DRAM having reduced current consumption and a communication terminal including the same. The DRAM includes a plurality of memory banks capable of being independently supplied with power, and a DPD controller for selectively causing some of the plurality of memory banks to enter a DPD mode.

Abstract: A semiconductor device of this invention includes an initialization circuit for initializing a predetermined circuit in accordance with the level of a power source voltage, and a status setting unit for setting the status. of the semiconductor device to “busy” during a period in which the initialization circuit performs initialization.

Abstract: A method and system is disclosed for a wordline driver circuit used for a memory device. It has a logic stage operating between a ground voltage and a first supply voltage and generating a logic stage output signal swinging between the ground voltage and the first supply voltage. It also has a mid voltage stage, operating between a raised ground voltage and a second supply voltage during the programming process, and generating a mid voltage stage output that swings between the second supply voltage and the raised ground voltage. It then has a high voltage stage, operating between the raised ground voltage and a third supply voltage, and generating a wordline driver output swinging between the third supply voltage and the raised ground voltage based on the received mid voltage stage output.

Abstract: A word line driving circuit may include a first word line driver, a second word line driver and a pass transistor. In response to a word line selecting signal, the first word line driver may drive a word line using a first word line driving voltage signal in a first operation mode or the second word line driver may drive the word line using a second word line driving voltage signal. The pass transistor coupled between the first word line driver and the word line may transmit the first word line driving voltage signal to the word line in response to a control voltage signal, which is self-boosted at an initial stage of the first operation mode and is maintained at a stable voltage level after a time period.

Abstract: Provided is a word line decoder suitable to a low operating voltage of a flash memory device. The word line decoder generates a block word line driving signal of a high voltage in response to a block selection signal. The word line decoder includes a first inverter receiving the block selection signal, a second inverter receiving an output of the first inverter, and first and second serially connected transistors receiving an output of the second inverter and outputting the block word line driving signal. The gates of the first and second transistors are connected to a supply voltage terminal.