Abstract: A neutralization apparatus 1 according to the present invention is a DC gas injection type neutralization apparatus which efficiently neutralizes a large subject to be neutralized at high speed without generating reverse electrification. Gas injection ports 60 are formed between plus electrodes 20 and minus electrodes 30. The plus electrodes 20 and the minus electrodes 30 respectively emit plus ions and minus ions toward gas flows from the gas injection ports 60, and the plus ions and minus ions reach the subject to be neutralized at high speed and neutralize the same.

Abstract: The electrostatic chuck comprises a chuck base for supporting a wafer, a dielectric film mounted on the chuck base, the dielectric film having an electrode for supplying direct current voltage to provide an electrostatic force to fix the wafer, the electrode disposed in the dielectric film, and a cooling channel for supplying refrigerant to the dielectric film to control the temperature of the wafer.

Abstract: An electrostatic chuck apparatus for holding a workpiece such as a semiconductor wafer or glass substrate comprises a support substrate, an electrode formed on one surface of the support substrate, and an insulating layer covering the electrode and having a bearing surface for the workpiece. The insulating layer comprises pyrolytic boron nitride containing carbon and at least one element selected from silicon, aluminum, yttrium, and titanium, and has a Vickers hardness Hv of 50 to 1000.

Abstract: A first internal electrode includes a main electrode portion whose longer-side direction agrees with a longer-side direction of first and second principal faces, and a lead portion extending from an end of the main electrode portion on the first end face side toward a first side face and connected to a first terminal electrode. A second internal electrode includes a main electrode portion whose longer-side direction agrees with the longer-side direction of the first and second principal faces, and a lead portion extending from an end of the main electrode portion on the first end face side toward a second side face and connected to a second terminal electrode. A third internal electrode includes a main electrode portion whose longer-side direction agrees with the longer-side direction of the first and second principal faces, and a lead portion extending from an end of the main electrode portion on the second end face side toward the first side face and connected to the first terminal electrode.

Abstract: Provided are a binder for an electric double layer capacitor electrode which gives an electrode having a high electrode density and a high binding force and which comprises a polymer that can give a polymer film having a tensile stress of 2 MPa or less when the film is elongated at the ratio of 100% and having the elongation at break of 450% or more; a binder composition for an electric double layer capacitor electrode and a slurry composition for an electric double layer capacitor electrode which each comprises the binder; an electrode produced by use of the slurry composition; and an electric double layer capacitor which has the electrode so as to exhibit a large electrostatic capacity and a small internal resistance.

Abstract: The present invention provides an electric double layer capacitor that has less chance for internal resistance increase. For this objective, in this electric double layer capacitor, an electric double layer capacitor element sandwiches a separator between a cathode and an anode, arranged inside a container comprising a lid and a concave shaped containing portion. On the inner bottom face in the containing portion, an insulating layer having a first conductive layer connected to a connecting terminal, and an opening portion penetrates to the first conductive layer are formed, wherein a second conductive layer fills inside the opening portion. Onto the insulating layer and the second conductive layer, a third conductive layer which laminates a first layer comprised of aluminum and a second layer comprised of carbon, is formed and connected to the cathode. The fourth conductive layer is connected to the anode, and also connected to the connecting terminal.

Abstract: A capacitor includes a container, a positive electrode, a negative electrode, and a fluid electrolyte. The positive electrode comprises a metal substrate and an active material provided in contact with the metal substrate, the active material comprising at least one of poly (ethylene 3,4-dioxythiophene) and a titanate.

Abstract: A solid electrolytic capacitor includes a capacitor element, an anode-side lead terminal connected to an anode of the capacitor element, a cathode-side lead terminal connected to a cathode of the capacitor element, and an armor covering the capacitor element and having an electrical insulating property. The armor has two principal faces opposed to each other, and two side faces connecting the two principal faces and opposed to each other. The anode-side lead terminal has at least a first terminal portion exposed in one of the principal faces. The cathode-side lead terminal has at least a first terminal portion exposed in the one of the principal faces, and a second terminal portion exposed in the one of the principal faces and extending from the first terminal portion so as to be exposed in either of the two side faces. The solid electrolytic capacitor satisfies the following relation: W/G?1.

Abstract: A housing can be used for high-power components, especially high-power capacitors. A housing has a carrier platform made from a suitable electrically insulating material and a preferably metallic cover, wherein the thermal expansion coefficients of the platform and of the cover are matched to each other. This matching is achieved according to the invention by adjusting the glass-fiber coefficient of a fiber-composite material.

Abstract: A method for repairing an electrical circuit of a circuit board is proposed. The method includes providing a circuit board having a patterned circuit layer, wherein the patterned circuit layer includes an electrical circuit having at least one defect formed therein; and providing a microelectrode for performing a micro-electroplating process at a position corresponding to the defect of the electrical circuit to form a circuit material, so as to repair the electrical circuit of the circuit board. Alternatively, the micro-electroplating process may be replaced with a micro-deposition process by using a micro-droplet to form the circuit material at the aforementioned position.

Abstract: An electronic device with a slideable lens cover is provided. The electronic device includes a casing, a bracket and a lens cover. The casing has an opening. The bracket is mounted inside the casing and faces the opening. There is a track existing between the bracket and the casing. The lens cover is disposed between the casing and the bracket. The lens cover has a plurality of slideable components movably disposed on the track.

Abstract: An electronic module designed to be incorporated in a tire, comprising a functional device, a support and at least one device for electrically connecting a wire and a device for mechanically fixing the wire, separate from the electrical connection device, for mechanically fixing the wire to the support.

Abstract: A case coupling and reinforcing structure is provided on an inner surface of a first and a second case of an apparatus. The first and the second case are primarily assembled and locked to each other using a plurality of screws. The case coupling and reinforcing structure includes a plurality of perpendicular rib reinforcements spaced along an inner side of a peripheral edge of the first case, and a plurality of cuts provided on a peripheral edge of the second case at positions corresponding to the rib reinforcements, such that the rib reinforcements are tightly received in and engaged with the cuts when the first and the second case are assembled to each other, giving the assembled cases a reinforced structural strength to enable a reduced number of screws being used and a reduced material thickness of the casing, and accordingly, reduced material and manufacturing costs of the casing.

Abstract: A flash-memory drive replaces a hard-disk drive using an integrated device electronics (IDE) interface. The flash drive has a printed-circuit board assembly (PCBA) with a circuit board with flash-memory chips and a controller chip. The controller chip includes an input/output interface circuit to an external computer over the IDE interface, and a processing unit to read blocks of data from the flash-memory chips. The PCBA is encased inside an upper case and a lower case, with an IDE connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Center lines formed on the inside of the cases fit between rows of flash-memory chips to improve case rigidity. The connector has two rows of pins that straddle the center line of the circuit board for a balanced design.

Abstract: A drawer-type memory card adapter especially to integrate memory cards of different sizes and specifications in connecting, the adapter comprises a housing, an electric circuit board, at least a pin rank and a drawer, a memory card placed in the drawer can be electrically connected with the drawer-type memory card adapter to get the object of connecting. In other words, the present invention adopts the drawer-type design that is different from the designs of those conventional insertion type and lifting type adapter structures, it can provide an effect of connecting for multiple cards.

Abstract: A disk device includes a frame defining a tray housing and a rail housing communicating with the tray housing; a tray releasably received in the tray housing in the frame; and a rail movably incorporated in the rail housing. The rail includes a slide for drawing the tray out of the frame, and a latching member for detachably engaging with the tray. The slide is movable along a first direction that exposes from the rail housing, the latching member is movable along a second direction substantially perpendicular to the first direction between a first position where the latching member is engaged with the tray and a second position where the latching member is disengaged with the tray.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradually smaller in diameter from the main body to the reservoir. The shaft connects to the motor, extends into the adaptor tube and has multiple fan blades corresponding to the inside diameter of the adaptor tube. The fan blades blow the air through the adaptor tube into the reservoir to pressurize the air. The pressurized air flows through the delivery tube to contact the electronic component and equalizes to correspond to the atmosphere. The equalizing process of the pressurized air absorbs heat from the electronic component as it expands to cool the electronic component.

Abstract: A heat dissipating device includes a heat sink, and an air guide member. The heat sink includes a base, and a plurality of fins formed on a top surface of the base. The air guide member is detachably mounted to a side facing an airflow-generating source of the base. The air guide member includes an air guide plane which guides a part of airflow of the airflow-generating source originally flowing toward the side of the base to pass through the fins.

Abstract: An embedded computer chassis may include a midplane having a first side and second side substantially opposite each other, where the midplane is suitably adapted to receive at least one computer card in each of the first side and the second side. Embedded computer chassis may further include a cooling region suitably adapted to cool the at least one computer card, where at least a portion of the cooling region is suitably adapted to receive a first fan tray and a second fan tray, where the first fan tray is suitably adapted to couple to the first side of the midplane, and where the second fan tray is suitably adapted to couple to the second side of the midplane. The first fan tray and the second fan tray are substantially redundant for removing the heat generated by the at least one computer card.

Abstract: A heat dissipation module is suitable for being assembled on a circuit board to dissipate the heat source on the circuit board. The heat dissipation module includes a holding unit, a fan and a cover unit. The holding unit is formed by a holder base and multiple first support posts extending from the holder base downwards, each of the first support posts has an elastic snap sleeve to be snapped in a snap hole and the elastic snap sleeve has an accommodation space. The fan is assembled on the holder base and the cover unit covers the fan and is assembled on the holding unit, and an end of each second support post of the fan has a snap tenon plugged in the accommodation space.

Abstract: A method of accelerating heat dissipation for a compact electronic device has steps of defining a heat dissipation opening as an airflow emission opening on a compact electronic device; defining connection port and slot as intake openings on the compact electronic; and extracting air from the airflow emission opening to make cold air effectively enter the intake openings. Therefore, the cold air thoroughly passes multiple heating elements and then to go out via the airflow emission opening. In this way, to force convection is achieved, so as to enhance cooling efficiency.

Abstract: A power module that fits to the top of a storage chest or cabinet is connected to electrical power and routes the electrical power to drawers and/or cavities within the chest or cabinet. The electrical power is continuously available while the power module is connected to electrical power so that the drawers or cavities have a continuous source of power whether or not the drawers or cabinet doors are open or closed. The chest or cabinet may include receptacles having a standard configuration that connects to a variety of devices including, for example, lights, heaters, and battery chargers. The chest or cabinet may include electrically powered features, such as, for example, lights, clocks, audio/visual equipment, computers, tool chargers, air compressors, refrigerators, wireless communications devices, and heaters. The chest or cabinet may also include one or more exterior lights.

Abstract: Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.

Abstract: The invention relates to a cooling device (1) for an electronic component (3), especially for a microprocessor, with a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). According to the invention, the heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9).

Abstract: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

Abstract: A card slot apparatus having a simplified structure capable of reducing resistances in inserting and ejecting operations of a card and an electronic machine having the same. The card slot apparatus includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart from the card and a second position contacting the card. A moving unit moves the heat radiating unit to the second position while moving in an opposite direction to an inserting direction of the card in combination with an inserting operation of the card into the slot body. An elastic unit elastically urges the moving unit in a moving direction thereof. The heat radiating unit includes a heat sink, and an elastic member to press the heat sink when the heat sink is moved to the second position. The elastic unit elastically urges the moving unit in the moving direction thereof when the heat sink is moved to the second position.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.

Abstract: A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.

Abstract: The protruding tail of the fin on the upper side of the heat sink is formed as a cone, hence the blowing-in airflow follows the lead to the bottom resulting in better performance of ejection. There is a tooling hole on the side plate of the underside in the heat sink for the convenience of separating the adjacency heat sinks and separators in suitable space. There is also a corresponding retaining hole above the separator. This will force the two rivets pass through the fixed body in order. The thin cone heat sink could increase the space of the separators and double the area of the heat radiation, help the airflow absorb the heat following the surrounding air and simultaneously increase the heat ejection performance so as to achieve the main usages for the industry of cooling down the chip rapidly.

Abstract: A heat-dissipating backlighting module includes a heat-dissipating plate to combine with a back light unit. The heat-dissipating plate has an assembling space provided on a first side, and a vertically extended air-cooling structure provided on a second side. The vertically extended air-cooling structure includes a plurality of vertically extended fins and a plurality of vertically extended air-circulating channels. In assembling, the assembling space of the heat-dissipating plate receives the heat back light unit having a light source that projects light on a flat panel display. The vertically extended fins and vertically extended air-circulating channels can guide airflows running upwardly in a vertical direction so as to dissipate heats from the vertically extended fins and the vertically extended air-circulating channels.

Abstract: In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component disposed adjacent the top surface of the PCB, having a base portion with a plurality of legs extending therefrom; and at least one mechanism to generate a clamping force between the at least one wiffle tree and the top surface of the PCB, and between the bottom surface of the PCB and the heat sink. There is disclosed a method of attaching a printed circuit board (PCB) to a heat sink. In an embodiment, the method includes providing at least one wiffle tree component; disposing one of the at least one wiffle tree component adjacent to the PCB; and securing the one of the at least one wiffle tree component with a fastener. Other embodiments are also disclosed.

Abstract: In one embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.

Abstract: The present invention relates to a foolproof interlock apparatus, adapted to enable a first device to interlock with a second device, which comprises: at least a hook, composed of an extending part and a engaging part; and at least a lip having a recess; wherein, the engaging part is disposed at a free end of the extending part while an end of the extending part is fitted to the first device; and the recess of the lip fitted to the second device is used to receive the engaging part for enabling the recess and the engaging part to abut against each other and thus maintain a specific engagement. Therefore, by adjusting the engagement between the hook and the lip, the tightness of the engagement between the first and the second device can be controlled.

Abstract: A surface mountable device includes a ceramic substrate including a first principal surface, a second principal surface, and a side surface connecting the first principal surface to the second principal surface, a terminal electrode disposed on the first principal surface, and a first conductor for appearance inspection extending continuously from the terminal electrode to the side surface and having a width smaller than the width of the terminal electrode.

Abstract: A circuit assembly comprises a circuit board, at least one circuit component connected to the circuit board by wire bonding, and a base plate, on which the circuit board is fixed. A gap between the base plate and the circuit board fixed to it is filled at least locally by a filling body made of a material hardened in the gap.

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract: In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.

Abstract: An apparatus for shielding of electromagnetic interference of a memory module comprises a heat spreader covering at least partially said memory module, wherein said heat spreader is connected to at least one floating gate which is provided between first plates of matched integrated capacitors, wherein second plates of said matched integrated capacitors each comprise a constant potential.

Abstract: In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.

Abstract: A connection module arrangeable on a connection side of a main casing of a power switch comprises a plurality of connection spaces limited by a removable covering cap and by lateral separation walls. When said connection module is mounted, connection bars provided with a through hole and arranged in the main casing are projected into the connection spaces, which are provided with lateral guiding elements formed in the separation walls for frame terminals surrounding the connection bars and for guiding elements on bottom side for screw plates placed under the connection bars. A cylindrical reception area coaxially extends with respect to the associated through hole from each connection space bottom and is closed on a bottom side by a breakable wall part and receives a connection sleeve through the broken wall part in such a way that said connection sleeve is at least indirectly connected to the associated connection bar.

Abstract: The invention relates to a slide control for an audio mixer, whereby a slide can be displaced along a defined path in a slit-shaped opening in a front plate. The aim of the invention is to create one such slide control that clearly indicates the function it is carrying out or the parameters it can influence by its position. To this end, an illuminable element is provided, said element extending along the opening.

Abstract: A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.

Abstract: The invention is directed towards a backlight module including a light box and a plurality of lamps in the light box. The light box includes a bottom plate and an opening above the bottom plate. The lamp is disposed at an angle to the bottom plate of the light box. The present invention further provides a liquid crystal display including the above backlight module and a liquid crystal panel. The backlight module provides the plane light source for display. By using the backlight module of this invention, uniform plane light source is provided and display quality of the liquid display panel is enhanced.

Abstract: A water sealing structure used in a lamp using a crank handle-operated dynamo to generate electricity is disclosed to have a flexible rubber packing strip fastened to the housing of the lamp to seal the gap between top and bottom cover shells of the housing, a flexible rubber covering affixed to the housing and covered on a lampshade at the housing to seal the gap between the lampshade and the housing, a flexible rubber button covered on the power switch of the lamp to seal the gap between the power switch and the top cover shell of the housing, and a water sealing cap fastened to the bottom cover shell of the housing around the crank handle to seal the gap between the crank handle and the bottom cover shell.

Abstract: A solar rechargeable lantern that utilizes light emitting diodes (LEDs) as the light source. The lantern comprises a base member having a rechargeable battery positioned therein, a light emitting portion, a solar panel connected to the battery and a printed circuit board mounted in the light emitting portion and having a plurality of LED arrays mounted thereto, the battery in turn being connected to the LED arrays. A controller is provided to control the charge applied to the battery by the solar panel and to monitor the charge status of the battery. The LED array comprises twelve parallel rows of LEDs, each row having a plurality of serially connected LEDs.

Abstract: An elongated perimeter light comprising an array of light sources that are illuminated by electric power. An elongated tube is included having a lumen along its length, with the tube being substantially solid except for the lumen. A blocking element covers a lower portion of the tube along its length, with the blocking element blocking light emission from the lower portion. The array of light sources is arranged within the lumen and transmits light through the tube and from an upper surface of the tube. The tube disperses the light from the array giving the appearance that the array of light sources is a continuous light source. The array of light sources is cuttable at intervals to shorten the array while allowing the remaining light sources in the resulting cut pieces to emit light. The tube and blocking element are cuttable to match the length of the array.

Abstract: An illumination system for imaging illumination having at least one compact light source. The illumination system comprises a reflector having a reflector contour, the light source being accommodated in the vicinity of the reflector contour. A compact diffusing medium is accommodated at the focal point of the reflector, the light from the light sources being directed substantially onto the diffusing medium and, from there, being diffused onto the reflector contour, with the result that the light leaving the reflector is emitted homogeneously.