Abstract: A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer.

Abstract: A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.

Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air.

Abstract: An electrode structure including two parallel electrical paths. A plurality of electrode layers, generally tabular in form is formed in a stack, the outermost layers providing electrical contacts, and defining a first electrical current path through the stack. Two sidewall conductor layers are formed to abut either end of the electrode layer stack, two sidewall conductor layers defining a second electrical current path. The ends of the sidewall conduction layers lie in the same planes as the electrode layer electrical contacts, such that electrode structure electrical contacts are each formed from one set of sidewall layer ends and an electrode layer electrical contact.

Abstract: A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and the traces are disposed on a top of the core layer. The solder resist is formed over the top of the core layer to cover the traces with the connecting pads partially or completely exposed. Furthermore, the traces have I-shaped cross sections to enhance the tensile strength of the traces.

Abstract: A conductive pattern is provided in the vicinity of a bonding pad and connection is made therebetween using pillar-shaped leading interconnections. By providing an insulating film, in addition to the pillar-shaped leading interconnections, between the conductive pattern and the bonding pad, the impact at the time of bonding is weakened to thereby suppress offset of the conductive pattern. According to the pad structure of this invention, it becomes possible to reduce the pattern design standard around the bonding pad and thus a small-chip-size semiconductor integrated circuit is obtained.

Abstract: A computer automated design system includes a subject routing module configured to set a first grid area and a first diagonal grid area and route a first wire in the first grid area and a first diagonal wire extending diagonally to a longitudinal direction of the first wire and a next routing module configured to set a second grid area and a second diagonal grid area and route a second wire in the second grid area and a second diagonal wire extending diagonally to a longitudinal direction of the second wire.

Abstract: A method for removing a damaged low dielectric constant material following an etch process, an ashing process, or a wet cleaning process is described. A dry, non-plasma removal process is implemented to remove a thin layer of damaged material on a feature following formation of the feature. The dry, non-plasma removal process comprises a chemical treatment of the damaged material, followed by a thermal treatment of the chemically treated surface layer. The two steps, chemical and thermal treatment, can be repeated.

Abstract: In one aspect of the present invention, A method for manufacturing a semiconductor device may include forming a first wiring in a first insulating layer on a base member, forming a second insulating layer on the first insulating layer, forming a first hole in the second insulating layer so as to reach the first wiring in the first insulating layer and a second hole in the second insulating layer so as to reach the first insulating layer, forming a via contact in the first hole, and forming a third insulating layer on the second insulating layer so as to shut the second hole.

Abstract: A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.

Abstract: Embodiments of the invention include a device with stacked substrates. Conducting interconnecting structures of one substrate are bonded to conducting interconnecting structures of another substrate. A passivating layer may be on the conducting interconnecting structures between the substrates and may be formed by an atomic layer deposition process or a with a Langmuir-Blodgett technique.

Abstract: A semiconductor device whose semiconductor device components have particularly reliable adhesion to a plastic housing composition surrounding them is intended to be produced by a simplest possible method. An adhesion promoting solution is introduced into the interspace between the front side of the flip-chips and the top side of the substrate and the solvent the adhesion promoting solution is evaporated with formation of an adhesion promoting coating on the front sides of the semiconductor chips and the top side of the substrate. The semiconductor chip and the top side of the substrate are subsequently embedded into a plastic housing composition.

Abstract: It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.

Abstract: A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.

Abstract: An integrated circuit and method for fabrication includes first and second structures, each including a set of sub-lithographic lines, and contact landing segments connected to at least one of the sub-lithographic lines at an end portion. The first and second structures are nested such that the sub-lithographic lines are disposed in a parallel manner within a width, and the contact landing segments of the first structure are disposed on an opposite side of a length of the sub-lithographic lines relative to the contact landing segments of the second structure. The contact landing segments for the first and second structures are included within the width dimension, wherein the width includes a dimension four times a minimum feature size achievable by lithography.

Abstract: According to one embodiment, a polymer coating is disposed on a surface of a package substrate. The polymer coating comprises a material capable of inhibiting the flow of an underfill material into a keep-out zone (KOZ). In a further embodiment, a die is disposed on the substrate and a layer of the underfill material is disposed between the die and substrate, and the polymer coating inhibits the flow of the underfill into the KOZ. Other embodiments are described and may be claimed.

Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: A zero-order overlay target comprises a first zero-order line array fabricated on a first layer of a semiconductor structure, the first zero-order line array having a first pitch, and a second zero-order line array fabricated on a second layer of the semiconductor structure, the second zero-order line array having a second pitch. The second pitch may be different from the first pitch, and a portion of the second zero-order line array may be positioned to become optically coupled to a portion of the first zero-order line array when subject to an overlay measurement. Further, the second pitch may be variable. For example, the variable pitch may comprise a first set of features having a pitch approximately equal to the first pitch, a second set of features having a pitch different from the first pitch, and a third set of features having a pitch approximately equal to the first pitch.

Abstract: A system and method for carbonizing a liquid, such as tap water with CO2, are disclosed. The liquid is carbonized inside a pump housing, thereby obviating the need for a separate high-pressure carbonator tank and a separate feed pump. The pump housing has an inlet for receiving in combination the liquid and CO2 at a first pressure, and an outlet for transporting the liquid carbonized with CO2 from the pump housing into an outlet line at a second pressure higher than the first pressure. A constriction is disposed in the outlet line for producing said higher pressure with the pump. The system and method can be employed in closed-loop carbonizing systems in the beverage industry.

Abstract: Provided is a submersible floating aerator, comprising a submersible hollow shaft motor (1) comprising a hollow shaft (2), a bottom shaft extension (4), a first motor flange (15), a second motor flange (16), a first flange (24) and a second flange (25), a gas-ring compressor (17), a base (21) having a gas inlet hole (22), a gas inlet tube (23), a dome (26), a propeller assembly (60) and an air outlet opening (18); wherein the base (21) is fixed on the top of the gas inlet tube (23), the gas-ring compressor (17) is fixed on the base (21) via a bracket (19); the air outlet opening (18) is connected to the gas-inlet hole (22) via a pipe (20); the gas inlet tube (23) is fixed to the first motor flange (15) via a first flange (24); the second motor flange (16) is fixed to the dome (26) via the second flange (25); the bottom shaft extension (4) is coaxially connected to the propeller assembly (60); and the hollow shaft (2) rotates along with the propeller assembly (60).

Abstract: A conduit system for a lithographic apparatus is disclosed, the conduit system including a conduit configured to guide a liquid or liquid-gas mixture, and a gas injection nozzle configured to introduce a gas in the liquid or liquid-gas mixture to at least partially absorb pressure peaks or waves in the liquid or liquid-gas mixture. In an embodiment, the gas injection nozzle may be arranged in a pump of the conduit system. The pump further includes a pump inlet, a pump outlet and a pump chamber between the pump inlet and the pump outlet arranged for compression of the liquid or liquid-gas mixture.

Abstract: The present invention is a bubbler having a diptube inlet ending in a bubble size reducing outlet and at least one baffle disc positioned between the outlet of the diptube and the outlet of the bubbler to provide a narrow annular space between the baffle disc and the wall of the bubbler to prevent liquid droplets from entering the outlet to the bubbler. The bubble size reducing outlet is an elongated cylindrical porous metal frit situated in a sump of approximately the same dimensions. A metal frit is placed at the inlet of the outlet of the bubbler. The present invention is also a process of delivering a chemical precursor from a bubbler vessel having the above structure.

Abstract: The present invention provides inks and methods for making colored silicone hydrogel contact lenses. The ink of the invention comprises an actinically-curable binder copolymer comprising fluorine-containing segments and is characterized by having capability to be cured actinically or thermally to form a colored film on a molding surface of a mold or a silicone hydrogel contact lens and by having an increased durability in a solvated state in a silicone-hydrogel lens formulation in relation to a control colored film obtained from a control ink including an actinically-curable fluorine-free binder copolymer. The invention also provides methods for making colored silicone hydrogel contact lenses based on print-on-mold processes for producing colored contact lenses.

Abstract: A method of and system for molding optical components uses a thermo-curable composition, which has unconventional low shrinkage and can be heated to high temperature so that it can be cured at unconventional fast rate with relative simple means. This allows fast production of optical components at low cost both in small quantities and in large quantities.

Abstract: The present invention relates to a method of producing carbon fiber reinforced ceramic matrix composites, the method of producing carbon fiber reinforced ceramic matrix composites according to the present invention is characterized in that the method comprises the steps of: producing a carbon fiber reinforced resin composite that is molded with a mixture in which carbon fibers and polymer precursors containing carbon are mixed; producing a carbon fiber reinforced carbon composite by depositing pyrolytic carbon during a rapid thermal gradient chemical vapor infiltration process while increasing the deposition speed in a direction from the inside to the outside by performing a thermal treatment on said carbon fiber reinforced resin composite at high temperature; and infiltrating liquid-phase silicon into the pores of said carbon fiber reinforced carbon composite.

Abstract: An injection rate (cm3/sec) of a screw feeder at the time of starting an injection is the largest and the injection rate (cm3/sec) thereof gradually or sequentially decreases until an end of injection so that a temperature of a melted resin reaching the end portion of a cavity decreases within a range where the melted resin is not solidified.

Abstract: The invention relates to a method for producing a support web (10) that is made of a predefined amount of plastic material by means of a plurality of molding elements (16, 17) which are formed in hollow spaces (12) of a mold (5), the plastic material being fed to the mold (5) via at least one extruder nozzle (1) of an extruder apparatus (18). In order to be able to lower the processing temperature while the plastic material obtains a very good molding behavior into the respective hollow spaces of a mold, the plastic material is intrinsically provided with at least one additive in such a way that the melt flow index (MFI) of the plastic material remains constant or preferably increases.

Abstract: A molding apparatus includes a die set having a chamber, a vacuum pump communicated to the chamber, and a feeding mechanism suited for supplying a molding material to the chamber of the die set with simultaneous extraction of gas out of the chamber by the vacuum pump.

Abstract: A bicomponent fiber wherein (a) the first component comprises from about 90 to 100 wt. % poly(trimethylene terephthalate) and (b) the second component is a polymer composition comprising (i) poly(trimethylene terephthalate) and (ii) polymer containing polyalkylene ether repeating units. Yarn, fiber, fabrics and carpets comprising the bicomponent fiber, as well as the process of making the bicomponent fiber, yarn, fabric, and carpet.

Abstract: A coating composition that improves fiber dispersion and mechanical properties in reinforced composite articles is provided. The coating composition includes a chemical compound that acts as an emulsifier, a surfactant, and a melt viscosity reducer. In at least one exemplary embodiment, the chemical compound is an ethoxylated fatty acid or an ethoxylated fatty alcohol compound. The coating composition may be applied to the reinforcing fiber strand after a conventional sizing composition has been applied to the reinforcing fiber and prior to wire coating the fiber with a thermoplastic resin. The coated/sized fiber strands may be chopped to form chopped strand segments and then densified or compacted to form a densified reinforcing fiber product, such as pellets. These pellets, in turn, may be used to form polymer reinforced composite articles. In alternative embodiments, the coating composition may be applied directly to the reinforcement fibers directly after fiber formation under the bushing.

Abstract: Extruded, stretched, sintered tubular PTPE materials are produced which are suited for use in the medical field as liners and covers for expandable stents. The PTFE materials have an unusually low REC (Radial Expansion Coefficient) and RER (Radial Expansion Ratio).

Abstract: Polymer film having at least two regions of differing translucency. The at least two regions of differing translucency can be obtained by selectively compressing regions of the polymer film. Laminate comprising textile material and such a polymer film. The laminates can be breathable and/or waterproof. Suitable uses for the laminate include, for example, garments, tents, and sleeping bags.

Abstract: A processable polypropylene composition comprising a mixture of a major amount of a syndiotactic polypropylene and a minor amount of polyethylene wax. The syndiotactic polypropylene has a designated recrystallization temperature, an original minor melting peak and a higher original melting peak. The polyethylene wax provides a recrystallization temperature of the mixture that is greater than the recrystallization temperature of the syndiotactic polypropylene alone and also provides for a minor melting peak and a major melting peak of the mixture, which has a temperature difference which is lower than the difference between the original minor melting peak and the original major melting peak of the syndiotactic polypropylene alone. A process for the production of polypropylene product employing a polyethylene-syndiotactic polypropylene composition as described which is heated to provide a plastic mass of the syndiotactic polypropylene and polyethylene which is processed to provide the product.

Abstract: This invention relates to a method of making flat sheet asymmetric membranes, including cellulose diacetate/cellulose triacetate blended membranes, polyimide membranes, and polyimide/polyethersulfone blended membranes by formulating the polymer or the blended polymers dopes in a dual solvent mixture containing 1,3 dioxolane and a second solvent, such as N,N?-methylpyrrolidinone (NMP). The dopes are tailored to be closed to the point of phase separation with or without suitable non-solvent additives such as methanol, acetone, decane or a mixture of these non-solvents. The flat sheet asymmetric membranes are cast by the phase inversion processes using water as the coagulation bath and annealing bath. The dried membranes are coated with UV curable silicone rubber. The resulting asymmetric membranes exhibit excellent permeability and selectivity compared to the intrinsic dense film performances.

Abstract: A mold having a sub-micro, or even nano, structure is fabricated. The mold is a porous mold. With the mold, a sub-micro pattern is easily imprinted on a large surface of a substrate or a LED. No expansive equipment is necessary. The fabricating process is fast and cheap; and thus meets producer's needs.

Abstract: A film feeding machine includes a drawing device to draw a continuous film out of a film base to a predetermined position. The film is held by a feeding device and cut off by a cutting device to have a film piece. The film piece is fed to external equipment by the feeding device. The film feeding machine of the present invention is incorporated in a molding process having advantages of lower cost, lower defective ratio and high production efficiency.

Abstract: A method for the manufacture of plastic products in a mold (2), provided with at least one label, comprising the steps of: feeding a strip of film comprising at least one label; feeding-through the strip of film (34) over a joining surface of the mold in open condition such that said label (36) is positioned between two parts (47, 48) of a mold cavity of the mold; closing the mold such that said label is stored in said mold cavity; moving a moveable wall part (8) of the mold cavity within the mold cavity such that said label is pressed from said strip of film; injecting plastic into the mold cavity for forming a product therein such that the label is attached to or on the product.

Abstract: There is disclosed a process for the preparation of a poured cosmetic product with a superficial relief. There are provided a first step of dosing a liquid state mixture of said cosmetic product within a shaped mould, a second step of solidifying the mixture within the mould, a third step of extracting the cosmetic product from the mould by exerting perpendicular forces on the bottom surface of the cosmetic product, a fourth step of overturning the cosmetic product within a final container.

Abstract: The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n?1- RELEASE-M(X)n?m?1 Qm, Or RELEASE-M(OR)n?1-, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is a halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; M is the number Q represents R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and N is the valence ?1 of M, and n?m?1 is at least 1 provides good release properties.

Abstract: There is provided a mold which contains at least two electroforming layers, wherein the mold has a concavo-convex pattern on a surface thereof, and the electroforming layers include at least two adjacent layers having the same crystal orientation.

Abstract: The invention relates to a method for finely polishing/structuring thermosensitive dielectric materials, in particular materials exhibiting a low thermal expansion coefficient, by a laser beam consisting in directing an intensive ultrashort laser beam to a processable material surface, in adjusting the action time within a range from 10-13 s to 10-11 s and a laser pulse energy in such a way that it is less than an ablation threshold but sufficient for provoking a Coulomb explosion. The inventive method makes it possible to carry out a material removal within a nanometer range by means of laser ultrashort pulses ranging between picoseconds and subpicoseconds, wherein the material surface is finely polished during a pre-ablation process step (removal less than the ablation range) and the processable surface is low-heated (approximately up to 10° C., only) due to the extremely shot laser beam action time.

Abstract: A method of controlling the opening and closing of a book-type blow mold that is used to produce containers from a thermoplastic material, such as PET, by blowing or blow-drawing heated preforms. The mold includes at least two mold halves which can be moved away from one another by rotating the same around a shared fixed pivot pin. The two mold halves are opened asymmetrically on either side of the parting plane thereof and, as a result, the mold half that is open the most forms a larger passage for introducing an auxiliary member, such as a clamp arm, into the mold.

Abstract: The present invention provides a die with a first die member, a second die member and a holder device between the first die member and the second die member. A film is sent to the die between the holder device and the second die member. And then, operating the holder device toward the second die member to press the film on the second die member, and softening and molding the film in the second die member. Next, moving the first die member toward the second die member to close the die, and then performing an injection molding process to inject a molten material into the die. The molten material is combined with the film to form a product with the film on a surface thereof.

Abstract: In a method and apparatus for producing polystyrene tubular shrink film via film blow molding, a polystyrene plastic material is extruded into a circular tubular film, which is cooled and then uniformly heated in a special hot water tank to become softened. Hot air is then blown into the softened tubular film, and two sequentially arranged speed-controlled pressure guide roller sets are set to two different operating speeds, so that the softened tubular film is transversely and longitudinally stretched and thinned to form a stretched tubular film, which is then passed through a setting treatment system to form a thermally set tubular film and be finally wound in a take-up system into a roll for storage. The method and apparatus is simple, low cost, and easy to operate, and the product thereof is environment friendly to help in economic development.

Abstract: There is provided a method for melting a material rod in a material melting and holding apparatus of a metal molding apparatus where the material melting and holding apparatus provided for the metal molding apparatus includes a furnace body of a melting and holding furnace, and a melting cylinder for a material rod and a material supply cylinder for directly supplying the material rod into the furnace body provided in parallel with each other on the furnace body, upon startup of molding, the material rod is melted using the melting cylinder prior to supplying the molten material from the melting cylinder into the melting and holding furnace, and the material rod subsequently supplied from the material supply cylinder to a bottom portion of the furnace body is submerged and melted by the molten material, thereby maintaining the submersion melting in the melting and holding furnace after the startup of molding.

Abstract: The invention is directed to a material for coating iron ore pelletizing disks and drums and a constructive arrangement for pelletizing disks and drums that is comprised of a mixture of binders with ores (that may or not be ground) of the group consisting of iron, manganese or others, the inclusion of fluxes being also provided. The bottom (1) of the disk or drum (5) is coated with a cold cure coating material, vegetal oils, minerals and/or gel-forming products in order to form a bottom layer (2) that may or not be on the surface, and polyethylene plates (7) to aid in the separation of the fines from the pellets (6) can also be incorporated into the inner perimetral edge (6) of said pelletizing disk or drum (5).

Abstract: A vehicle suspension strut and air spring combination having a simplified means of attaching and sealing the upper end of the air suspension sleeve around the strut is provided, wherein an inner ring is placed within the upper end of the resilient air spring sleeve, and a cap for attaching the air spring sleeve to the extendable strut rod receiving the inner ring and upper end of the spring sleeve. The cap is subsequently crimped, retaining and sealing the upper end of the air spring sleeve between the inner ring and the cap. The sealed assembled end yields fewer parts for assembly as well as a clear upper outer surface of the cap, decreasing the risk for sources of corrosion to collect.