Abstract: A baseplate in a disk drive suspension system is configured with an integral anvil having a spring-forming edge that coincides with an optimal bend location on a linear flex spring. The spring attaches to upper surfaces of baseplate and load beam to allow for alignment of a rolling tool above the optimal bend location. During assembly, rolling tool pressure permanently bends the spring around the spring-forming edge to create a desired pre-load characteristic for the suspension system. The integral anvil may include a relief portion for reducing friction on the spring during the bending operation. A method for pre-loading a suspension assembly comprises forming an integral anvil on a baseplate, forming a spring-forming edge on the integral anvil, positioning an optimal bend location on the spring to coincide with the spring-forming edge, and forming a permanent bend in the spring by applying pressure on the spring around the spring-forming edge.

Abstract: A HDD includes a disk unit, a circuit board and an air intake and exhaust mechanism. In the disk unit, a magnetic disk is rotatably provided. The circuit board is provided with a driving circuit including electronic components. The air intake and exhaust mechanism includes a bag provided between the disk unit and the circuit board. The bag includes a communication hole airtightly communicating with an air intake and exhaust hole provided in a housing of the disk unit, and air intake and exhaust valves are provided at the bag, and located apart from the communication hole. Due to this structure, when the internal air pressure of the disk unit changes, gas flows into and out from the gap between the disk unit and the bag through the communication hole, thus restricting changing of the air pressure.

Abstract: A housing has a base that includes a baseplate and a rail. The rail projects outwardly to an impact rim along a bottom edge of the rail. The rail includes a flexible web that couples the impact rim to the baseplate. A projecting contact surface on the impact rim is laterally offset from at least one bending axis through the flexible web. An impact to the contact surface is offset from the bending axis by a moment arm.

Abstract: A hard disk drive (HDD) and method, with the HDD including a housing, having a base member and a cover member attached to each other, a plurality of disks, rotatably stacked on the base member and spaced apart from one another, an actuator installed on the base member to rotate around a pivot and fixedly supporting, on its leading end, a slider on which a magnetic head for recording or reproducing data to or from the disks is mounted, and a damper, disposed between the stacked disks, wherein a groove is formed on surfaces of the damper facing the disks.

Abstract: A thin-film magnetic head comprises at least one of a magnetoresistive device for reading and an electromagnetic transducer device for writing, and a heating element provided in the head body part. The heating element has an up portion meandering between an origin and a halfway point and a down portion meandering along the up portion from the halfway point to an end positioned in the vicinity of the origin, and adapted to generate heat when energized.

Abstract: A leader tape to be spliced in a butting manner to a leading end of a magnetic tape, the leading end being mechanically cut in a tapered shape, wherein the leader tape has a surface roughness RZ (RZ complies with JIS B0601-1994) of 5 ?m or less.

Abstract: An assembly includes a suspension component with a surface extending over a flexible region of the suspension component. The assembly also includes a damping layer disposed in a pattern that extends onto the surface. A sealing layer that is non-friable covers the damping layer. The sealing layer also preferably comprises a shear restraint layer for the damping layer.

Abstract: A disk apparatus, e.g., a magnetic disk apparatus has a storage medium in the form of a disk which is rotated and accessed, and is designed so as to reduce the occurrence of scratches on the storage medium due to contact between the head and the storage medium while ensuring stable access to the disk-type storage medium. In addition to a main dowel which is provided on a suspension and which supports a magnetic head at a center of the same, an auxiliary dowel is provided on the suspension on the air outflow side relative to the main dowel to limit the tilt of the magnetic head at the time of loading.

Abstract: Single write poles tend to large shape anisotropy which results in a very large remnant field when not actually writing. This has now been eliminated by giving the write pole the form of a three layer laminate in which two ferromagnetic layers are separated by a non-magnetic or antiferromagnetic coupling layer. Strong magnetostatic coupling between the outer layers causes their magnetization directions to automatically be antiparallel to one another, unless overcome by the more powerful write field, leaving the structure with a low net magnetic moment. The thickness of the middle layer must be carefully controlled.

Abstract: A head actuator assembly includes a coarse positioner base assembly that is mounted on a guide shaft and an anti-rotation shaft and provides increased structural rigidity due to a four-point support and spring loading of the coarse positioner base against the anti-rotation shaft. A two-part head-carriage and voice coil holder system permits different materials to be used for the head-carriage and the voice coil holder, obviating structural problems of a single-structured head-carriage and coil-holder system. A flexible printed circuit bracket eases manufacture and allows flexible printed circuits to be slid into the bracket and retained in place without the need for locating tabs and screws.

Abstract: Embodiments of the present invention provide a rotating disk storage device adopting a thin yoke structure. In one embodiment, the yoke structure of a voice coil motor includes a base of a casing formed from a ferromagnetic material; an auxiliary yoke disposed so as to be magnetically coupled to the base; a magnet disposed so as to be magnetically coupled to a front surface of the auxiliary yoke; and a main yoke provided with yoke legs magnetically coupled to the auxiliary yoke and an opposing surface that confronts a front surface of the magnet. In addition, a yoke gap is defined between the opposing surface and the front surface of the magnet. The base and the auxiliary yoke form a magnetic path, which allows a dedicated yoke on a lower portion to be eliminated.

Abstract: A slim actuator and a micro-drive apparatus using the same are provided. The slim actuator includes a suspension having a head mounted at one end of the suspension to write/read data to/from a disk and a head gimbal assembly. The head gimbal assembly includes a unit-mounting portion having one end connected to the suspension, a fantail molding portion extending from the other end of the uni-mounting portion, and a voice coil which is mounted on the fantail mounting portion such that current flows in the voice coil. The voice coil rotates the suspension by an electromagnetic force created by interaction between the electric field of the current and an applied magnetic field. Thus, the slim actuator uses a single channel and has excellent resonance characteristics. Mobile micro-drive apparatuses employing the slim actuators can be obtained.

Abstract: A flexible printed circuit board using a lead-free solder is to be fixed within a disk enclosure while ensuring a high rigidity. In one embodiment, a rotating disk storage device comprises a flexible printed circuit board (FPC), wherein there is formed a wiring pattern including a signal line for the transmission of a signal of data read by a head in an actuator head suspension assembly (AHSA) and wherein one side end portion is fixed to a base and an opposite side end portion is fixed to the AHSA. A first metallic plate and a second metallic plate are both fixed to one side end portion of the FPC. A connector is disposed in an area where the first metallic plate in the FPC is provided, and connected to the wiring pattern. A shock sensor is disposed in an area where the second metallic plate in the FPC is provided, and connected to the wiring pattern.

Abstract: A head slider having a thin film magnetic head is mounted on a suspension assembly. The suspension assembly is comprised of a metal plate-like member, and a piezoelectric actuator for displacing the head slider relative to the suspension assembly. The piezoelectric actuator has a piezoelectric film, and a pair of electrode films placed so as to sandwich the piezoelectric film in between. The piezoelectric film and the pair of electrode films are formed in an order of one electrode film, the piezoelectric film, and the other electrode film on the plate-like member.

Abstract: An area of an element can be made small and fluctuation in area can be reduced. A magneto-resistance effect element is provided with a first electrode with an end face; a magneto-resistance effect film which is formed such that a surface thereof comes in contact with the end face of the first electrode; and a second electrode which is formed on another surface of the magneto-resistance effect element opposed from the surface coming in contact with the surface of the first electrode. The magneto-resistance effect film includes a magnetization pinned layer whose magnetization direction is pinned, a magnetization free layer whose magnetization direction is changeable, and a first non-magnetic layer which is provided between the magnetization pinned layer and the magnetization free layer.

Abstract: A magnetoresistive sensor having a pinned layer that extends beyond the stripe height defined by the free layer of the sensor. The extended pinned layer has a strong shape induced anisotropy that maintains pinning of the pinned layer moment. The extended portion of the pinned layer has sides beyond the stripe height that are perfectly aligned with the sides of the sensor within the stripe height. This perfect alignment is made possible by a manufacturing method that uses a mask structure for more than one manufacturing phase, eliminating the need for multiple mask alignments.

Abstract: A magnetic head includes a seed layer structure comprising Ta and NiFeCr seed layers; an antiparallel (AP) pinned layer structure formed above the NiFeCr seed layer; a free layer positioned above the AP pinned layer structure; and a layer of metal oxide positioned between the free layer and the AP pinned layer structure. A magnetic head in another embodiment includes a seed layer structure comprising Al2O3, Ta, and NiFeCr seed layers, wherein a thickness of the NiFeCr seed layer is less than about a thickness of at least one of the Al2O3 and Ta seed layers; an antiparallel (AP) pinned layer structure formed above the NiFeCr seed layer; and a free layer positioned above the AP pinned layer structure. In another embodiment, a thickness of the NiFeCr seed layer is greater than about a thickness of at least one of the Al2O3 and Ta seed layers.

Abstract: The invention discloses an integrated circuit that includes a first device in a first power domain; a second device in a second power domain; and an electrostatic discharge (ESD) bus coupled to the first and second devices for providing a current path to dissipate an ESD current during an ESD event occurring at the first or second device. The ESD bus is disposed across the first and second power domains without having a diode module interposed therebetween, thereby preventing the ESD current from flowing through the first and second devices.

Abstract: An IC having inputs and outputs for a plurality of frequency bands from a high frequency band to a low frequency band is protected from electrostatic damage. A high-frequency section of the IC is provided with a protection circuit including diode-connected transistors connected by multiple stages. In addition, there are applied the transistors in which elements thereof are isolated by insulator that can prevent thyristor operation.

Abstract: A power management IC including a dual purpose pin, a fault detection system, and a fault signature system. The dual purpose pin performs a power management function during normal operation (e.g., a soft start pin coupled to an external capacitor, a set pin coupled to an external resistor, a frequency set pin coupled to a resistor-capacitor combination, etc.). The fault detection system senses any of multiple fault conditions and provides a corresponding fault indicator signal, each indicating a corresponding fault condition. The fault signature system generates a selected fault signature signal on the dual purpose pin, where each fault signature signal has a characteristic indicative of a corresponding fault condition. Thus, an existing pin on the IC is re-used to indicate the fault condition. The fault signature signal may be a unique voltage level, a unique charging rate, a unique frequency signal, or any a combination thereof.

Abstract: Methods and apparatus are disclosed for protecting circuits from damages caused by elevated temperatures. Presented embodiments illustrate IC thermal protection circuits that shut down power delivery circuits when the circuit temperature reaches a predefined upper threshold and restart the circuit when the circuit cools down to a predefined lower threshold. Other embodiments provide soft shutdown and soft restart, where not only the temperature range between the shutdown and the restart is predetermined, but also the time between the start of a shutdown process and the complete shutdown is controllable.

Abstract: A circuit system is disclosed for protecting a capacitor coupled between a voltage supply node and a complementary voltage supply node from an ESD. The circuit system includes at least one NMOS transistor having a drain coupled to the voltage supply node, a source and a gate together coupled to the complementary voltage supply node, and at least one diode chain having one or more diodes serially coupled between the voltage supply node and the complementary voltage supply node. During an ESD event, the diode chain and the NMOS transistor dissipate an ESD current from the voltage supply node to the complementary voltage supply node, thereby protecting the capacitor from ESD induced damages.

Abstract: An over-voltage surge protection device includes a circuit board having a signal carrying conductive member with a plurality of nodes positioned therealong, and a conductive member running to ground positioned therealong. The nodes on the signal carrying member and the ground conductive member each extend along a common path with corresponding ones of the signal carrying nodes positioned in adjacent, but spaced relation to the ground member, wherein the conductive member running to ground is formed along the interior of the main body enclosing the circuit board and the signal carrying conductive member. The peripheral edges of the nodes accumulate and discharge transient high voltage surges. The nodes can be shaped in the form of triangles due to this particular geometry's favorable ability to accumulate and discharge voltage, but may also be formed in a variety of other geometries.

Abstract: A multilayer capacitor comprises a capacitor body, a first connecting conductor arranged on a first side face of the capacitor body, first and second terminal electrodes, and a first insulator arranged between the first connecting conductor and first terminal electrode. The capacitor body has a plurality of laminated insulator layers and a plurality of first and second inner electrodes. The second terminal electrode is connected to the second inner electrode. Each of the first inner electrodes has a first lead portion exposing an end to the first side face. At least one of the first inner electrodes also has a second lead portion whose end is exposed to the first side face. The first connecting conductor continuously covers all the ends of the first lead portions of the first inner electrodes and mechanically connects with the ends of the first lead portions.

Abstract: A multi-terminal multilayer capacitor reducing an equivalent series inductance (ESL), whose design flexibility is high, in which cost of electrode material is low, and in which a structural defect hardly occurs includes lead portions of first and second internal electrodes and lead portions of third and fourth internal electrodes that are disposed along the length of each of two side surfaces so as to be alternately exposed. Preferably, the first and third internal electrodes, and the second and fourth internal electrodes are disposed so as to be arranged along the length of each side surface in a coplanar manner, with a predetermined distance provided between two internal electrodes.

Abstract: An apparatus comprising a capacitor stack, including one or more substantially planar anode layers, and one or more substantially planar cathode layers. Additionally, the capacitor has a case having a first opening and a second opening, the first opening sized for passage of the capacitor stack, and a cover substantially conforming to the first opening and sealingly connected to the first opening. Also, the capacitor includes a plate substantially conforming to the second opening and sealingly connected to the second opening, the plate defining an aperture. Additionally, the capacitor includes a plug substantially conforming to the aperture in the plate, the plug sealingly connected to the plate. The capacitor stack is disposed in the case, and the terminal is in electrical connection with the case and at least one capacitor electrode.

Abstract: A display unit includes a display panel, a casing covering the rear surface of the display panel, and a front panel extending around in front of a periphery of the display panel and supporting the display panel. The front panel protects the display panel against impact loads applied thereto.

Abstract: A case structure of an electronic device comprises a first shell, a second shell, a first engagement element, a second engagement element, a first spring element, a second spring element and a plug element. The first engagement element protrudes from the first shell. The second shell having a first penetrating opening allows the first engagement element to pass through. The second engagement element having a button portion passes through a second penetrating opening of the second shell. The second engagement element is driven by the button portion and the first spring element to control the second engagement element and the first engagement element to engage or disengage from each other. The plug element located in the second shell is pushed for filling in the first penetrating opening by the second spring element.

Abstract: An external bay faceplate for a computer case which includes an integrated wireless LAN unit is disclosed. In particular, a faceplate is provided which includes a bezel defining interior and exterior major surfaces arranged to removably cover at least a portion of an external bay opening in a computer case, and a wireless LAN unit mechanically coupled to a surface of said bezel and including a data interface enabling data transfer between the wireless LAN unit and the information processor within the computer case. Several protocols and wired interfacing techniques, including various flavors of USB, FireWire, ethernet, and disk or removable media drive transmission may be used in conveying data between the information processor and the wireless LAN unit. The wireless LAN unit may be conveniently integrated with a blank faceplate covering substantially all of the external bay opening, or a drive faceplate, such as a removable media faceplate.

Abstract: A carrier and docking assembly in combination for removeably interconnecting a PC card device with a computer. The docking assembly is configured in size to be fixed in a memory storage device bay of a computer housing, or a memory storage device housing. The docking assembly includes a plug for the carrier, a power connector and an interface connector. The interface connector is adapted for connection with an IDE ribbon cable. The carrier includes a PC card device for receiving PC cards and a plug for interconnection with the docking assembly. The carrier plug removeably couples with the plug of the docking assembly.

Abstract: A disk array device including a logic mounting unit which mounts a cache memory which temporarily stores data transferred from a high-level device and performs control to write the data stored in the cache memory to a plurality of memory devices at the time of power failure. The power supply from the battery mounting unit to the plurality of memory devices is sequentially stopped in an order of memory device to which data writing from the cache memory has been completed at a time of the power failure, and even after the power supply to the hard disks in which the destage has been completed is stopped, the power supply into the cache memory from the battery is continued.

Abstract: A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.

Abstract: The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating.

Abstract: A method- and apparatus are disclosed for mounting vertically two sets of computer components in a back-to-back configuration. The vertically mounted components are interconnected to an internal distribution unit. The pair of sets of vertically mounted components are connected to opposite sides of the distribution unit.

Abstract: Techniques for distributing airflow for cooling an electronic device are described. Vanes positioned immediately after a set of cooling fans direct airflow over a plurality of components within the device. For example, the vanes may be designed to segment the net fan blade travel area into equal sections—one section per component—to accomplish balanced airflow distribution. Components requiring cooling include cards, e.g., printed circuit boards and the like. A plurality of cards may form slots between the cards and the vanes may divide the airflow equally among the slots to provide consistent cooling for each of the cards. Embodiments of the invention may be directed to distributing cooling airflows within a computing device, e.g., a network router or a server.

Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises a hole through a portion thereof. The IC die and the wire bond are disposed substantially between the heat spreader and the package substrate.

Abstract: A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.

Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.

Abstract: A latch for securing a cover (10) to a base (40) includes a projecting tab (145) on one of the cover and the base, a mounting member (50) and a resilient member (70). The projecting tab engages with the mounting member so that the cover engages with the base. The mounting member is deformable. The resilient member is compressed by the mounting member. When the mounting member is deformed, the resilient member is released to urge the mounting member to disengage from the projecting tab thereby removing the cover from the base.

Abstract: A fastening structure for stacking a plurality of electronic modules on a mainboard is provided. The fastening structure includes a locking member and a plurality of supporting members. The locking member is disposed on a first electronic module for locking the first electronic module onto the mainboard by locking elements. The supporting members are connected to the locking member and are used to carry a second electronic module above the first electronic module. Therefore, under a limited space for disposing the first/second electronic modules, the fastening structure of the present invention increases the space utilization, thereby enhancing the strength of the structure for the first/second electronic modules.

Abstract: A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate.

Abstract: A computer subassembly aspect is disclosed comprising a case defining an interior, a primary circuit board located in the interior of the case, and a BIOS chip socket mounted on the primary circuit board. The case has an opening formed therein that is aligned with a position of the BIOS chip socket on the primary circuit board to permit insertion of a BIOS chip into the BIOS chip socket through the opening. A method of assembling a computer is also disclosed that comprises assembling a subassembly of a laptop computer in a first location, with the subassembly including a BIOS chip socket for receiving a BIOS chip but lacking a BIOS chip, transporting the subassembly from the first location to a second location, and installing a BIOS chip into the BIOS chip socket of the subassembly when the subassembly is in the second location.

Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the first structure and capable of movement with respect to the first structure along a first direction, and a third structure slidingly supported by the second structure. Sliding motion of the third structure with respect to the second structure results in movement of the third structure relative to the first structure that is along a second direction different from the first direction.

Abstract: An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

Abstract: A memory module includes: one or more semiconductor memory devices; a plurality of module tabs configured to transmit and receive signals between the one or more semiconductor memory devices and external devices; a data bus configured to transfer signals between data input/output pins of the one or more semiconductor memory devices and the plurality of module tabs; and impedance-matching capacitive elements, each coupled between a line of the data bus and a reference voltage. Accordingly, the memory module and a memory system employing such a module can achieve improved impedance matching, thereby also improving signal integrity.

Abstract: An expanding high speed transport interface hardware method for motherboard is provided. In the method, a mezzanine card is provided and the mezzanine card has a chip socket. An expanding hardware with high speed transport interface is installed in the chip socket of the mezzanine card. In addition, the mezzanine card is inserted into an idle CPU socket in a motherboard with plural CPU structure to make the mezzanine card electrically connect with the second CPU socket, so that the mezzanine card and the expanding hardware become components of the motherboard. Finally, the motherboard is activated to detect the mezzanine card and the expanding hardware and set the CPU bus as a data transmission path between the mezzanine card and the expanding hardware so as to expand interface hardware for the idle CPU socket. Besides, more design choices and opportunities are provided for the manufacturers of motherboard and peripheral.

Abstract: A device for insertion and extraction of printed circuit boards or other components from a device or system such as a network router includes a positionable handle. The handle adjusts in a manner similar to a handle on a c-clamp, and may be repositioned relative to the centerline of a driveshaft of the device. Additionally, the handle may include internal detents that define selectable handle positions. Various handle positions may allow an operator to utilize limited available space and increase the mechanical advantage of the handle.

Abstract: An electronic module includes an electronic circuit substrate, and a plurality of driving circuit boards attached to a terminal region of the electronic circuit substrate while being arranged adjacent to one another in the x direction. The driving circuit boards are electrically connected to one another. Adjacent driving circuit boards are electrically connected to each other by only substrate terminals provided on the electronic circuit substrate, with the connection resistance therebetween being about 10 ? or less.