Abstract: The invention provides an electronic apparatus including: a substrate that has a penetrating portion at a part of a periphery around a display area of the substrate; a display element that is provided over the display area of one surface of the substrate; a first moisture-proof film that has optical transparency and covers, at least, the display area of the above-mentioned one surface of the substrate and the display element; and a second moisture-proof film that covers, at least, the display area of another opposite surface of the substrate.

Abstract: A display devise includes a display panel and a chassis base supporting the display panel. At least one reinforcing member is attached to the chassis base to add rigidity to the chassis base and at least one stand is attached to the chassis base to allow the chassis base to stand upright. A guide stand couples the reinforcing member to the stand, the guide stand comprising a body and a reinforcing plate substantially extending at an angle from the body.

Abstract: Electronic systems and method to make such electronic systems using co-processing print technology. In one embodiment, the electronic system includes a substrate, a printed display device, a printed component and a printed functional layer. The printed display device includes a transparent conductor layer positioned on the substrate and at least one display layer positioned on the transparent conductor layer. The printed component is positioned on the substrate and includes at least one component layer. The printed functional layer is associated with the printed display device and the printed component where the printed functional layer characterized by a chemical property or physical property that allows said printed functional layer to serve as a component layer and a display layer.

Abstract: An exemplary flat panel display includes a chassis, a locking apparatus fixed to the chassis, and a supporting base. The locking apparatus includes a mobile member and a releasing button. The mobile member includes at least one sliding surface and at least one first fixing protrusion. The releasing includes a button base corresponding to the at least one sliding surface, and at least one sliding rib provided at the button base. The at least one sliding rib is configured for sliding along the at least one sliding surface. The supporting base includes at least one second fixing protrusion. The at least one first fixing protrusion and the at least one second fixing protrusion are configured to fix to each other such that the supporting base is fixed to the locking apparatus.

Abstract: A bezel mounting assembly includes a chassis (10), a bezel (30), and a latch member (50) for securing the bezel to the chassis. The chassis includes a front panel (11), and a pair of fixing holes (13) defined in the front panel. The bezel includes a pair of fixing pieces (34) inserted through the fixing holes (13) of the chassis. Each fixing piece has a hook (341) formed at a distal end thereof. The latch member includes a pair of securing pieces (54) engaged with the hooks of the bezel for securely fixing the bezel, and a pair of resilient arms (52) capable of being elastically deformed to urge the securing pieces of the latch member disengaging from the hooks of the bezel. The resilient arms are connected between the securing pieces.

Abstract: An exemplary latching mechanism for connecting a first component (20) and a second component (40). The latching mechanism includes at least one first engaging portion (408) formed/defined on the second component, at least one latch holder (60a, 60b) fixed relative to the first component, and at least one first latching member (80a, 80b). A first latch-clasping piece (604) extends from the at least one latch holder. The at least one first latching member has at least one second engaging portion (806). The second engaging portion engages with the first engaging portion of the second component. The first engaging portion of the second component and the first latching member are disposed between the first latch-clasping piece of the latch holder and the first component. The present invention further provides an electronic device employing the latching mechanism.

Abstract: A design structure embodied in a machine readable storage medium for at least one of designing, manufacturing, and testing a system chassis is provided. The system chassis includes multiple chassis bays configured for receiving either a single, conventional server blade or an adapter blade. The adapter blade can selectively secure a plurality of compact blades. The adapter blade includes a blade latch for selectively releasing the adapter blade from the chassis bay, wherein the presence of a compact blade enclosure within any of the plurality of adapter bays of the adapter blade prevents the latch from being operable to release the adapter blade. The compact blade includes a latch disposed along an upper or lower edge of the blade for selectively releasing the compact blade enclosure from the adapter bay.

Abstract: A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a system chassis includes multiple chassis bays configured for receiving either of a single, conventional server blade or an adapter blade is provided. The adapter blade can selectively secure a plurality of compact blades, such as a blade PC. The adapter blade includes an interposer disposed for electronically communicating each compact blade with a server interface as a separate node upon securing a compact blade within any of the adapter bays. Each compact blade may be configured as a server, a “client blade” or “blade PC”, or a companion blade providing application-specific features. Therefore, the use of an adapter blade increases the flexibility of and capability of the processor system.

Abstract: Provided is an apparatus comprising a tray coupled to leaf spring mounts with multiple guide slots, the multiple guide slots adapted to receive multiple guide pins coupled to an electronic component, the leaf spring mounts adapted to hold the electronic component in a pre-determined position with spring force.

Abstract: Provided is an apparatus comprising a latch mechanism, wherein the latch mechanism comprises a touch point, push points, pull back handles, and a latch tongue adapted to move up and down, wherein the latch tongue is adapted to being inserted into a retention hole.

Abstract: A computer enclosure includes a cover panel, a blocking piece attached to the cover panel, and a drive bracket secured in the computer enclosure. The drive bracket includes a side panel. A top flange is perpendicularly bent out from a top edge of the side panel. The blocking piece includes a flange. The flange extends downwardly and perpendicularly from edges of the block. The flange of the blocking piece resists against the top flange of the drive bracket in order to prevent the drive bracket from deforming outward.

Abstract: A disk drive assembly is mounting in an enclosure (1). The enclosure has a bar (12). The disk drive includes a disk drive (4), a mounting bracket (2), and a converter card (3). The disk drive has a top surface (41), opposite side surfaces (43) and a back surface (45) perpendicular to the top surface. The disk drive has a first output connecter on the back surface. The mounting bracket has a pair of feet (248) attached to the side surfaces of the disk drive and a mounting board (22) attached to the back surface of the disk drive. A resilient arm (5) with a protrusion (53) is formed on the resilient arm for engaging with the bar. The converter card is received in the mounting bracket, the converter card has a circuit board (31) parallel to the top surface of the disk drive.

Abstract: A mobile event data recorder is described providing a contained environmental control system for a hard drive module for use in, or with, a vehicle. A hard drive housing with multiple hard drives and a vibration isolation system are provided within a hard drive module chassis. The vibration isolation system simultaneously provides triaxial isolation in each of two different orientations of the hard drive module. First and second vibration isolators connect the hard drive housing with adjoining walls of the chassis, the first and second vibration isolators positioned to achieve a natural resonant frequency suitable to isolate frequencies in the hard drive operating range, taking into account the forces that will be applied to the vehicle. The natural resonant frequency can be about 10 Hz or less, in order to isolate the hard drives from frequencies of greater than about 10 Hz.

Abstract: The disk array system includes: controller modules, power source modules, and battery modules of a basic chassis; enclosure modules and power source modules of an expanded chassis; and operation levers which are commonly used for operations of insertion/removal and fixation of the modules. The operation lever includes a rotary shaft portion serving as a fulcrum point, a lever main body and a latch portion located on one side of the lever, and a hook portion located on the other side thereof. When a module is inserted and fixed, a user rotates the lever main body. By this means, the latch portion and the hook portion are fixed to a receiving portion and the module is connected and fixed to the backboard with a connector.

Abstract: In the disk array system, in the basic chassis, HDD modules are installed from a front surface in a front part of a backboard, and duplex CTL modules are installed up and down from a rear surface in a rear part, and duplex power source modules containing fans are installed in the left and right sides thereof. By the operation of the fans, in the rear part, the cooling air flows separately into each CTL module and into each power source module, and the cooling air having passed through the area of the duct by a block in the CTL module is drawn by the fans in the power source module through a ventilation hole and is then exhausted outside. The cooling air flow path to the plurality of ICs is divided by the block. The rotation speed of the fans is controlled by using a temperature sensor.

Abstract: The disk array system includes: controller modules, power source modules, and battery modules of a basic chassis; enclosure modules and power source modules of an expanded chassis; and operation levers which are commonly used for operations of insertion/removal and fixation of the modules. The operation lever includes a rotary shaft portion serving as a fulcrum point, a lever main body and a latch portion located on one side of the lever, and a hook portion located on the other side thereof. When a module is inserted and fixed, a user rotates the lever main body. By this means, the latch portion and the hook portion are fixed to a receiving portion and the module is connected and fixed to the backboard with a connector.

Abstract: An electronic device bearing seat includes a casing, a hook, a first resilient element, an ejector, a second resilient element, a pivot, a connecting rod and an ejecting button. The casing has a first opening and a second opening. The hook is movably provided in the first opening and includes a first withstanding post and a recess. The first resilient element is disposed between the casing and the hook. The ejector is movably provided in the second opening and is detachably fastened in the recess. The ejector includes a second withstanding post. The second resilient element is disposed between the casing and the ejector. The shaft is disposed in the casing. The connecting rod is rotatably disposed at and passed by the pivot and pushes against the first and second withstanding post. The ejecting button is movably disposed on the casing and abuts against the connecting rod.

Abstract: A data processing system storage unit for storing a plurality of data processing systems is disclosed. In one example of the storage unit, a plurality of storage spaces, each storage space configured for storing a data processing system, is provided. An air inlet duct and an air outlet duct allow air circulation within the storage unit. A plurality of inlet conduits, each inlet conduit configured to connect the inlet air duct to an inlet port of a data processing system, provides air supply to the data processing system. A plurality of outlet conduits, each outlet conduit configured to connect the outlet air duct to an outlet port of a data processing system, provides air exhaust from the data processing system. The example storage unit may also provide a primary air transfer system configured for directing air into the air inlet duct and/or for extracting air from the air outlet duct.

Abstract: In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material.

Abstract: An apparatus for guiding air through electronic components is disclosed. The apparatus has an intake, a transition portion, and a focused egress. The transition portion is connected to the intake and defines a channel. The channel has a generally ‘u’ shaped cross-section and a first edge and a second edge configured to be positioned substantially opposing a surface. The focused egress is connected to the transition portion.

Abstract: An enclosure 4 for electrical apparatus 6 has a sealable outlet 8 for partially evacuating the enclosure and a sealable inlet 9 for partially filling the enclosure with a liquid 7 having a vapour pressure at operating temperatures of the apparatus suitable to enhance electrical isolation of the electrical apparatus and suitable to provide convective cooling of the electrical apparatus. The vapour preferably provides a voltage hold-off sufficiently high for operating voltages of the electrical apparatus and has a relative permittivity sufficiently low to prevent stray capacitance in the electrical apparatus above a predetermined limit.

Abstract: A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.

Abstract: A heat dissipating system is used for dissipating heat from a computer enclosure. The computer enclosure includes a front plate, a rear plate, and a side plate connected between the front and rear plates. First and second heat dissipating devices are accommodated in the enclosure. A motherboard is mounted on the side plate. A plurality of interface cards is mounted on the motherboard. The interface cards are located between the first and second heat dissipating devices.

Abstract: A cooling fan module comprising a module housing and a fan assembly. The fan assembly comprises a blade assembly coupled to a motor disposed within a fan housing that is disposed within the module housing. The fan housing has an inlet and an outlet that is disposed within the module housing. A fan control circuit board is disposed within the module housing and outside of the fan housing. The fan control circuit board is coupled to the motor. An electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A fan module is disclosed. The fan module includes a base, at least one first side coupled to the base, and a plurality of fans coupled to the base. The plurality of fans are configured to substantially disperse thermal energy away from one or more electronic components in an enclosure to maintain a current temperature of the one or more electronic components below a critical temperature. The fan module further includes a connector mounted on the at least one first side and coupled to provide power to the plurality of fans. When one of the plurality of fans ceases to operate, the remaining fans in the plurality of fans continue to substantially disperse thermal energy away from the one or more electronic components while maintaining the current temperature below the critical temperature.

Abstract: According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a pair of elements arranged symmetrical with respect to the border line.

Abstract: An outdoor equipment cabinet includes a housing with an equipment compartment therein. An intake air vent and an exit air vent are formed in the housing. A fan is mounted within the housing for pulling air into the intake air vent, moving an air stream through the equipment compartment, and pushing air out of the exit air vent. A membrane is disposed adjacent the intake air vent. The membrane allows air to pass therethrough, but resists the passage of water and contaminants therethrough. In some embodiments, a baffling plate is disposed to direct the air stream within the equipment compartment, and/or the fan speed is controlled by a temperature sensor, and/or a clogging of the membrane is monitored and reported, and/or the intake air vent is located in a first door and the exit air vent is located in a second door of the cabinet.

Abstract: A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating.

Abstract: A heat dissipating device includes a heat sink, and a fan. The heat sink includes an end plane, and an engaging portion is defined in a middle of the end plane. The fan includes a frame, and an impeller mounted in the frame. The frame includes an end surface. A protrusion extends from a middle of the end surface of the frame for engaging in the engaging portion of the heat sink, such that the fan is fixed to the heat sink.

Abstract: A semiconductor element mounting substrate excellent in cooling performance and simple in structure is provided. The semiconductor element mounting substrate is a substrate 1B for mounting a semiconductor element 2, and has an insulating layer 3 and a conducting layer 4 for attaching a semiconductor element 2 on one surface of the insulating layer 3. To the other surface of the insulating layer 3, a heat releasing device 5 is directly attached. The heat releasing device 5 is preferably a liquid-cooling type cooling plate 7 having a plurality of fine passage 7a for cooling fluid. The insulating layer is preferably a composite member that an insulating cloth is impregnated with insulating resin or insulating resin composite in which thermally conductive filler is added to insulating resin.

Abstract: A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.

Abstract: An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices.

Abstract: A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an upper surface to the inner surface of the case panel. A cavity and piston in the base and the translating portion may provide complementary guide surfaces to constrain movement of the translational portion generally to a vertical dimension. A biasing element may urge the translational portion upward. The translational portion and the external panel may allow movement of their respective surfaces relative to one another. The cavity may include a port allowing air to pass into and out of the cavity. The upper surface of the translational portion may be tiltable with respect to the base. An adhesive layer may couple the base and the power dissipating device.

Abstract: In some embodiments, a heat sink is pressed down on a heat source such as an integrated circuit by rotating a cam to press down a set of springs over a loading arm, which is in turn positioned over a heat sink base. A cam shaft is placed in a hinge opening of a mounting frame secured to a printed circuit board (PCB). The mounting frame encloses a heat sink positioned over an IC. The hinge opening defines a hinge axis parallel to the PCB plane. A loading arm includes spring wells for holding coil springs, which are compressed between the mounting frame and the bottoms of the spring wells when the cam is rotated. The mounting frame and loading arm may include mating, self-locking sections including hinge protrusions having cross-sections shaped as a circle sectioned linearly off-center.

Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

Abstract: A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.

Abstract: An method of forming buried wiring lines makes it possible not to limit usable materials for an insulative plate to those having excellent heat resistance and to improve the corrosion resistance of the terminals provided for the buried wiring lines. The surface of an insulative plate is selectively etched using a mask formed on the surface, thereby forming grooves in the surface. A metallic nanoparticle ink is placed over the whole surface of the plate to fill the grooves with the ink, where the mask is being left. The ink is heated for preliminary curing to form a metallic nanoparticle ink film. The part of the film placed on the mask is selectively removed by detaching the mask, thereby leaving the remainder of the film in the grooves. The remaining film in the grooves is heated for main curing, thereby forming desired buried wiring lines.

Abstract: A connector hub apparatus is provided that has a carabiner clip connected to one or more portions of the apparatus. The apparatus can utilize a locking or non-locking type carabiner clip to secure the hub to a bag, belt loop, etc. for quick and easy transport of the apparatus. The hub apparatus can also be clipped around a group of wires or cables to securely fasten the hub in a position off the user's desktop, thus freeing up desk space. In one embodiment, the hub apparatus has an integrated upstream cable and plug that folds out from the apparatus, thereby eliminating the need to carry an upstream cable with the hub apparatus when traveling.

Abstract: According to one embodiment, a printed circuit board is provided with a printed wiring board and a circuit component mounted on the printed wiring board. The printed wiring board includes a first surface on which the circuit component is set, a second surface formed on the reverse side of the first surface, and a through hole formed penetrating the printed wiring board from the first surface to the second surface. The circuit component includes a projected portion to be inserted into the through hole. The projected portion is deformable between a first state in which a distal end of the projected portion projects to the outside of the printed wiring board beyond the second surface and a second state in which the distal end of the projected portion is situated in the through hole.

Abstract: A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.

Abstract: A wiring board including, on a resin insulating layer, an Ni—Cu alloy bonding seed layer constituted by 20 to 75 wt % of Ni and Cu to be a residual part and a wiring layer constituted by Cu formed thereon is provided. It is possible to manufacture the wiring board by (A) forming the Ni—Cu alloy bonding seed layer through a one-time treatment and removing an unnecessary portion through one-time etching after wiring patterning, or (B) forming the Ni—Cu alloy bonding seed layer and a Cu layer thereon and patterning thereof in a lump by etching. A wiring board in which a wiring layer is formed by an Ni—Cu alloy constituted by 20 to 75 wt % of Ni and Cu to be a residual part over a whole thickness of the wiring layer is also provided.

Abstract: A wiring board is comprised of a core board, a capacitor, a conductor containing portion and a laminated wiring portion. The core board has an accommodation hole. The capacitor has a through hole therein and is accommodated in the accommodation hole. The conductor containing portion has a current supplying conductor and is disposed in the through hole so as to be surrounded by the capacitor. The laminated wiring portion includes a component mounting region in which a first connection terminal electrically connected to the current supplying conductor is provided. Further, second connection terminals are disposed so as to sandwich the first connection terminal therebetween.

Abstract: A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on an upper side of the upper circuit board and is electrically connected to the first upper-layer wirings. A lower circuit board which is provided on a peripheral part of a lower side of the upper circuit board, the lower circuit board including a plurality of external connection wirings that are electrically connected to the first lower-layer wirings, and an opening portion which exposes the second lower-layer wirings. A second semiconductor structure body which is disposed in the opening portion of the lower circuit board, second semiconductor structure body including a plurality of external connection electrodes that are electrically connected to the second lower-layer wirings of the upper circuit board.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: An open rail card cage for electronic assemblies is disclosed. The open rail card cage includes a base, an inlet side attached to the base, an outlet side attached to the base, the outlet side offset from the inlet side, a plurality of rail mounts attached to the base and positioned between the inlet side and the outlet side, wherein the plurality of rail mounts further comprise sets of layered guide rails that orient the electronic assemblies parallel to a direction of an airflow between the inlet side and the outlet side, and at least one first set of the layered guide rails spaced apart from at least one second set of the layered guide rails by at least one first air vent.

Abstract: A system chassis includes multiple chassis bays configured for receiving either of a single, conventional server blade or an adapter blade. The adapter blade can selectively secure a plurality of compact blades, such as a blade PC. The adapter blade includes a blade latch for selectively releasing the adapter blade from the chassis bay, wherein the presence of a compact blade enclosure within any of the plurality of adapter bays of the adapter blade prevents the latch from being operable to release the adapter blade. The compact blade preferably includes a latch disposed along an upper or lower edge of the blade for selectively releasing the compact blade enclosure from the adapter bay. The adapter blade preferably also includes an interposer disposed for electronically communicating each compact blade with a server interface a separate node upon securing a compact blade within any of the adapter bays.

Abstract: A wedge lock clamping assembly, system and method wherein the module to be clamped in a slot in a chassis has a pair of wedge surfaces oppositely inclined to spaced-apart side surfaces of the slot. The clamping assembly comprises a pair of wedge elements on opposite sides of a movement axis and each wedge element is configured to be disposed within the slot between a respective wedge surface of the module and a respective side surface of the slot. An actuator operates to forcibly urge the wedge elements along the movement axis for causing the wedge elements to be wedged between the respective wedge surfaces of the module and respective side surfaces of the slot for clamping the module in the slot.

Abstract: A thermally conductive sheet is used between a mounting table for mounting thereon a target substrate and an annular focus ring mounted on the mounting table to surround a circumferential peripheral portion of the target substrate. Further, the mounting table includes therein a cooling unit and is disposed in a depressurized accommodating chamber for accommodating therein the target substrate. The thermally conductive sheet has a non-adhesive layer on each of one or more surfaces thereof.