Abstract: A local interconnect is formed with a gate conductor line that has an exposed sidewall on an active area of a semiconductor substrate. The exposes sidewall comprises a silicon containing material that may form a silicide alloy upon silicidation. During a silicidation process, a gate conductor sidewall silicide alloy forms on the exposed sidewall of the gate conductor line and an active area silicide is formed on the active area. The two silicides are joined to provide an electrical connection between the active area and the gate conductor line. Multiple sidewalls may be exposed on the gate conductor line to make multiple connections to different active area silicides.

Abstract: A memory element which includes a family of fault-tolerant storage elements using complementary metal-oxide-semiconductor (CMOS) technology is provided. The memory element provides arbitrary levels of redundancy, allowing the tolerance of multiple single event upsets due to particle hits. The memory element may be used in memory arrays such as caches and register files, and clocked registers and latches found in data path and control structures.

Abstract: Disclosed herein are toggle-mode magnetoresistive random access memory (MRAM) devices having small-angle toggle write lines, and related methods of toggle-mode switching MRAM devices. Also disclosed are layouts for MRAM devices constructed according to the disclosed principles. Generally speaking, the disclosed principles provide for non-orthogonally aligned toggle-mode write lines used to switch toggle-mode MRAM devices that employ a bias field to decrease the threshold needed to switch the magnetic state of each device. While the conventional toggle-mode write lines provide for the desired orthogonal orientation of the applied magnetic fields to optimize device switching, the use of a bias field affects this orthogonal orientation. By non-orthogonally aligning the two write lines as disclosed herein, the detrimental affect of the bias field may be compensated for such that the net fields applied to the device for both lines are again substantially orthogonal, as is desired.

Abstract: A data write current from a pinned layer to a free layer is larger than a data write current from the free layer to the pinned layer. A data read current is smaller in value than the data write current. In the case where a difference in data read current between a high-resistance state and a low-resistance state is relatively small, a sense amplifier is connected so that the data read current flows from the pinned layer to the free layer, namely from a source line to a bit line.

Abstract: A magnetic memory device includes a memory cell including magnetoresistance effect elements MTJ1, MTJ2 and a select transistor connected to the connection node of the magnetoresistance effect elements MTJ1, MTJ2, a first signal line extended in a first direction and connected to the magnetoresistance effect element MTJ1, a second signal line extended in the first direction and connected to the magnetoresistance effect element MTJ2, and a third signal line extended in a second direction and crossing the first signal line in a region where the magnetoresistance effect element MTJ1 is formed and crossing the second signal line in a region where the magnetoresistance effect element MTJ2 is formed. When memory information is written into the memory cell, the memory information to be memorized is switched by directions of write currents to be flowed to the first and the second signal lines.

Abstract: There is proposed a nonvolatile information recording/reproducing device with low power consumption and high thermal stability. The information recording/reproducing device according to an aspect of the present invention includes a recording layer, and mechanism for recording information by generating a phase change in the recording layer while applying a voltage to the recording layer. The recording layer is comprised one of a Wolframite structure and a Scheelite structure.

Abstract: One embodiment of the invention provides a compensation circuit. The compensation circuit comprises a writing driver, a distance detection circuit, an operating element and an auxiliary writing driver. The writing driver provides a writing current to a writing path. The distance detection circuit is coupled to the writing path to detect a distance that the writing current has travelled and outputs a control signal based on the distance. The operating element is coupled to the writing path. The auxiliary writing driver provides an auxiliary current to the writing path based on the control signal.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array which includes a memory cell string including a plurality of memory cells each having a variable resistor element and a switching element having a current path with one end and the other end, between which the variable resistor element is connected, the plurality of memory cells having current paths thereof being connected in series, the memory cell array further including a first select element connected to one end of a current path of the memory cell string, and a second select element connected to the other end of the current path of the memory cell string, a bit line which is electrically connected to one end of a current path of the first select element, and a source line which is electrically connected to one end of a current path of the second select element.

Abstract: A magnetic memory array. A first bit line provides a first writing magnetic field to a magnetic memory cell. A second bit line provides a second writing magnetic field to a reference magnetic memory cell. A word line provides a third writing magnetic field to the magnetic memory cell and a fourth writing magnetic field to the reference magnetic memory cell. The third writing magnetic field exceeds the fourth writing magnetic field.

Abstract: Methods and apparatus for managing electrical loads of electronic devices are disclosed. According to one embodiment, a current load imposed by an electronic device, such as a memory device (or memory system), can be measured. Then, using the measured current load, the memory device can determine whether (and to what extent) operational performance should be limited. By limiting operational performance, the memory device is able to limit its current load so as to satisfy a specification criterion or other requirement. The electrical load management is well suited for use in portable memory products (e.g., memory cards) to manage current loads being drawn.

Abstract: Method and device for providing voltage generation with load-based control are disclosed. The voltage generation can be provided within an electronic device, such as a memory system that provides data storage. In one embodiment, an electrical load imposed on a generated voltage can be monitored and used to dynamically control strength of the generated voltage. For example, for greater electrical loads, the generated voltage can be provided with a greater strength, and for lesser electrical loads, the generated voltage can be provided with a lesser strength. By compensating the generated voltage for the nature of the imposed electrical load, the generated voltage can be provided in a stable manner across a significant range of loads. In the case of a memory system, stability in the generated voltage provides for reduced voltage ripple and thus improved sensing margins. The voltage generation is well suited for use in portable memory products (e.g., memory cards) to generate one or more internal voltages.

Abstract: A memory cell is provided which includes an access transistor and a gated lateral thyristor (GLT) device. The access transistor includes a source node. The gated lateral thyristor (GLT) device includes an anode node coupled to the source node of the access transistor.

Abstract: A read method for multiple-value information in a semiconductor memory such as a nonvolatile semiconductor memory is introduced. The method includes obtaining a first data from a selected multiple-value memory cell by applying a first voltage to a control gate of the selected multiple-value memory cell. A second data from the selected multiple-value memory cell is obtained by applying a second voltage to the control gate of the selected multiple-value memory cell. A first bit of the plurality of bits stored in the selected multiple-value memory cell is then obtained by performing a predetermined calculation on the first data and the second data. A second bit of the plurality of bits is obtained from the selected multiple-value memory cell by applying a third voltage to the control gate of the selected multiple-value memory cell.

Abstract: A nonvolatile semiconductor memory according to the present invention includes a memory cell array including a plurality of electrically writable memory cells; a plurality of word lines and a plurality of bit lines connected to the plurality of memory cells; and a data reading and programming control section for, when performing 4-value data programming, read or erasure with respect to at least one of the plurality of memory cells, selecting and applying a voltage to a corresponding word line and a corresponding bit line among the plurality of word lines and the plurality of bit lines; wherein the data reading and programming control section includes an adjacent memory cell data reading section for reading, at a reading voltage of a predetermined reading voltage level, whether or not data is programmed in a lower page of a second memory cell adjacent to a first memory cell in the memory cell array, and generating adjacent memory cell state data which represents a data state of the second memory cell; an adjac

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for programming multilevel non-volatile multilevel memory cells. One method includes increasing a threshold voltage (Vt) for each of a number of memory cells until the Vt reaches a verify voltage (VFY) corresponding to a program state among a number of program states. The method includes determining whether the Vt of each of the cells has reached a pre-verify voltage (PVFY) associated with the program state, selectively biasing bit lines coupled to those cells whose Vt has reached the PVFY, adjusting the PVFY to a different level, and selectively biasing bit lines coupled to cells whose Vt has reached the adjusted PVFY, wherein the PVFY and the adjusted PVFY are less than the VFY.

Abstract: A non-volatile memory chip has word lines spaced a sub-F (sub-minimum feature size F) width apart with extensions of the word lines in at least two transition areas. Neighboring extensions are spaced at least F apart. The present invention also includes a method for word-line patterning of a non-volatile memory chip which includes generating sub-F word lines with extensions in transition areas for connecting to peripheral transistors from mask generated elements with widths of at least F.

Abstract: The quality of data stored in individual blocks of memory cells of a flash memory system is monitored by a scrub read of only a small portion of a block, performed after data are read from less than all of a block in response to a read command from a host or memory controller. The small portion is selected for the scrub read because of its greater vulnerability than other portions of the block to being disturbed as a result of the commanded partial block data read. This then determines, as the result of reading a small amount of data, whether at least some of the data in the block was disturbed by the command data read to a degree that makes it desirable to refresh the data of the block.

Abstract: A flash memory device includes a cell array and a decision unit. The cell array includes multiple regions corresponding to multiple input/output lines. Initialization data are repeatedly stored in each of the regions. The decision unit determines whether the stored data are valid based on values of bits of the stored data read from each region.

Abstract: A cell array of a flash memory device includes first and second memory block units, and a voltage generator. Each of the first and second memory block units includes a plurality of memory blocks having a plurality of memory cells. The voltage generator outputs a source voltage, a power supply voltage and a positive bias to the first and second memory block units. The first and second memory block units are connected in parallel through a bit line.

Abstract: A semiconductor storage system includes a first memory region including at least one block constituted from a plurality of memory cells, the memory cell is capable of storing n bits data, the block is a minimum unit which is capable of being independently erased, a second memory region including at least one block constituted from a plurality of memory cells, the memory cell is capable of storing m (m>n: m is integer) bits data, the block is a minimum unit which is capable of being independently erased, and a controller which controls a number of rewrites for the block in the first memory region not to be more than a first predetermined number of times, and controls a number of rewrites for the block in the second memory region not to be more than a second predetermined number of times.

Abstract: According to an embodiment, a nonvolatile semiconductor memory system includes: a nonvolatile semiconductor memory; and a memory controller having: a memory interface unit that inputs commands to the nonvolatile semiconductor memory and inputs or outputs data between the nonvolatile semiconductor memory; a memory that stores writing information indicating a memory cell transistor that is written the latest in each of the NAND cell units; and a processor that sets a read voltage based on the writing information to readout data from the memory cell transistors connected to a first word line; wherein a row controller is configured to set a plurality of levels of the read voltage to be applied to the first word line, with respect to one threshold for discriminating data stored in a memory cell transistors.

Abstract: Variation in programming efficacy due to variation in time constants along a word line that spans across a memory plane is compensated by adjusting the bit line voltages across the plane to modify the programming rates. In this way, the variation in programming efficacy is substantially reduced during programming of a group of memory cells coupled to the word line. This will allow uniform optimization of programming across the group of memory cells and reduce the number of programming pulses required to program the group of memory cells, thereby improving performance. In one embodiment, during programming, the bit lines in a first half of the memory plane closer to a source of word line voltage is set to a first voltage by a first voltage shifter and the bit lines in a second half of the memory plane further from the source of word line voltage is set to a second voltage by a second voltage shifter.

Abstract: A non-volatile memory device includes a plurality of memory cells coupled in series, a plurality of word lines coupled to the respective memory cells, and a plurality of spacers interposed between the word lines and having different dielectric constants according to line widths of the word lines.

Abstract: In a memory cell area of a semiconductor device, first, second, and third inter-layer insulating films respectively cover a cell transistor, a bit wiring line, and a capacitor which are connected to each other. In an adjacent peripheral circuit area, a peripheral-circuit transistor is covered with the first inter-layer insulating film, a first-layer wiring line connected to the peripheral-circuit transistor is provided on the first inter-layer insulating film and covered with the second inter-layer insulating film, and a second-layer wiring line is provided on the third inter-layer insulating film. In the memory cell area, a landing pad is provided on the second inter-layer insulating film and between the capacitor and a contact plug for connecting the capacitor to the cell transistor. An assist wiring line connected to the first-layer wiring line is provided on the main surface of the second inter-layer insulating film, on which the landing pad is provided.

Abstract: A semiconductor memory device comprises a memory cell unit including at least one memory cell having a structure with a floating gate and a control gate stacked via an insulator on a semiconductor substrate. A common source line is connected to one end of the memory cell unit. A bit line is connected to the other end of the memory cell unit. The control gate has at least an upper portion with a width along the gate length formed wider than the width of the floating gate.

Abstract: A nonvolatile semiconductor memory device includes a semiconductor substrate having a source, a drain, and a channel region between the source and the drain. The channel region has a first end portion near the drain, a second end portion near the source, and a middle portion between the first and second end portions. The first and second end portions having approximately same width. The memory device is electrically erased by using a hot carrier generated in the first end portion due to avalanche breakdown. The channel region includes a first channel extending from the drain and a second channel adjacent to the first channel. An impurity concentration of the second channel is higher than that of the first channel. An interface between the first and second channels is located in the middle portion between the first and second end portions.

Abstract: A monolithic, three dimensional NAND string includes a first memory cell located over a second memory cell, a select transistor, a first word line of the first memory cell, a second word line of the second memory cell, a bit line, a source line, and a select gate line of the select transistor. The first and the second word lines are not parallel to the bit line, and the first and the second word lines extend parallel to at least one of the source line and the select gate line.

Abstract: A string of nonvolatile memory cells connected in series includes fixed charges located between floating gates and the underlying substrate surface. Such a fixed charge affects distribution of charge carriers in an underlying portion of the substrate and thus affects threshold voltage of a device. A fixed charge layer may extend over source/drain regions also.

Abstract: Innovative self-adaptive and self-calibrated methods and structures for Multi-Level Cell (MLC) Non-Volatile Memory (NVM) are disclosed. In the MLC NVM, NVM cells are self-adaptively programmed into a fixed response tolerance window centered at the reference current or voltage corresponding to a selected level gate voltage applied to the controlled gates of NVM cells. The fixed response tolerance window is related to the threshold voltage tolerance window through the sense circuit gain. Properly choosing the sense circuit gain and the response window can control the threshold voltage tolerance window to a desired value. An incremental gate voltage larger than the threshold voltage tolerance window of each NVM cell will guarantee that each NVM cell will produce the correct output current (voltage) in response to applying to the control gate of the NVM cell the stepped voltage corresponding to the level of information stored in the NVM cell.

Abstract: A string of nonvolatile memory cells are formed with control gates extending between floating gates, control gates and floating gates separated by tunnel dielectric layers. Electron tunneling between control gates and floating gates is used for programming. A process for forming a memory array forms odd numbered floating gates from a first layer and even numbered floating gates from a second layer.

Abstract: A semiconductor memory device with NAND cell units arranged therein, the NAND cell unit including: a plurality of electrically rewritable and non-volatile memory cells connected in series; first and second select gate transistors disposed at the both ends of the NAND cell unit for coupling it to a bit line and a source line, respectively; and dummy cells disposed adjacent to the first and second select gate transistors in the NAND cell unit, wherein the dummy cells are set at a state with a threshold voltage higher than that of an erase state of the memory cell.

Abstract: A nonvolatile semiconductor memory includes a memory cell array, a flag information storage that stores a write flag indicating success/failure of writing in association with each address of a plurality of data segments contained in the data block, an internal address storage that selects the address where the writing has failed, a write circuit that performs data writing, a comparator that performs verify operation to verify success/failure of the data writing, and a sequence controller that updates a write flag according to the result of the verify operation.

Abstract: Variation in programming efficacy due to variation in time constants along a word line that spans across a memory plane is compensated by adjusting the bit line voltages across the plane to modify the programming rates. In this way, the variation in programming efficacy is substantially reduced during programming of a group of memory cells coupled to the word line. This will allow uniform optimization of programming across the group of memory cells and reduce the number of programming pulses required to program the group of memory cells, thereby improving performance. In one embodiment, during programming, the bit lines in a first half of the memory plane closer to a source of word line voltage is set to a first voltage and the bit lines in a second half of the memory plane further from the source of word line voltage is set to a second voltage.

Abstract: A non-volatile semiconductor memory device is provided with: a first memory cell including a floating gate transistor; a first bitline connected to a diffusion layer which is used as a source of the first memory cell; a second bitline connected to a diffusion layer which is used as a drain of the first memory cell; a first reference cell including a floating gate transistor; a third bitline electrically isolated from the first bitline and connected to a diffusion layer which is used as a source of the first reference cell; a read circuit identifying data stored in the first memory cell in response to a memory cell signal received from the first memory cell through the second bitline and a reference signal received from the first reference cell through the fourth bitline; and a bitline level controller controlling a voltage level of the third bitline.

Abstract: When a data write sequence is started, initially, write data is latched in a data latch circuit corresponding to one memory mat. Then, a program pulse is applied to the memory mat, and data read from a memory cell, which is a data write target bit in the memory mat, is performed. Thereafter, verify determination of the memory mat is performed. After a verify operation for the memory mat is completed, a program pulse is applied to another memory mat, and a verify operation for another memory mat is performed.

Abstract: A string of nonvolatile memory cells are formed with control gates extending between floating gates, control gates and floating gates separated by tunnel dielectric layers. Electron tunneling between control gates and floating gates is used for programming. A process for forming a memory array forms odd numbered floating gates from a first layer and even numbered floating gates from a second layer.

Abstract: An erase operating time can be shortened and an erase operating characteristic can be improved in a flash memory device. The flash memory device includes a plurality of memory cell blocks, an operating voltage generator and a controller. Each of the plurality of memory cell blocks includes memory cells connected to a plurality of word lines. A voltage generator is configured to apply an erase voltage to a memory cell block selected for an erase operation, and change a level of the erase voltage if an attempt of the erase operation is not successful. A controller is configured to control the voltage generator to apply a first erase voltage to a memory cell block selected for an erase operation. The first erase voltage corresponds to a previous erase voltage that was used successfully in completing a previous erase operation. The first erase voltage is an erase voltage that is used in a first erase attempt for the erase operation.

Abstract: Memory states of a multi-bit memory cell are demarcated by generating read reference signals having levels that constitute boundaries of the memory states. The read reference signals may be dependent upon the levels of programming reference signals used for controlling the programming of the memory cell. The memory cell can thus be programmed without reading out its memory state during the programming process, with programming margins being assured by the dependence of the read reference signals on the programming reference signals. Both sets of reference signals may be generated by reference cells which track variations in the operating characteristics of the memory cell with changes in conditions, such as temperature and system voltages, to enhance the reliability of memory programming and readout.

Abstract: A memory device may include a memory cell array having a plurality of memory cell transistors serially coupled in a string between a string selection transistor and a ground selection transistor. The string selection transistor may be coupled between the string and a bit line, and the ground selection transistor may be coupled between the string and a common source line. In addition, each memory cell transistor may includes a floating gate between a control gate electrode and a semiconductor substrate, and source/drain regions of the semiconductor substrate may be included on opposite sides of the control gate electrode. Responsive to an erase command, the memory cell transistors of the string may be erased.

Abstract: Disclosed herein are synchronization latch solutions.

Abstract: A flash memory device includes a data input/output pad and a core region in which a plurality of unit cells are arranged. A data input buffer is configured to receive command and address data through the data input/output pad and transfer the received command and address to the core region. A data output buffer is configured to output the data through the data input/output pad, and a data input controller is configured to detect an outputting of the data and disable the data input buffer.

Abstract: A multi-level sensing scheme compares the state of a multi-level storage cell with monotonously changing reference states, which are associated to different information values. That particular information value is identified to be the information stored in the multi-level storage cell, which has associated that reference state which, in a changing direction, firstly exceeds the state.

Abstract: A memory system includes a sense amplifier for detecting content of data memory cells by comparison with a voltage stored in a reference cell. The sense amplifier may comprise a comparator, first and second load circuits, and a low impedance circuit. A first input of the comparator is coupled to the low impedance circuit and a reference voltage node. A second input of the comparator is coupled to a data voltage node. The first load circuit loads a reference cell coupled to the reference voltage node. The second load circuit loads a data cell coupled to the data voltage node.

Abstract: A semiconductor memory device which prevents a drop of the level of an external voltage due to generation of high voltage, thereby ensuring an effective data window. The semiconductor memory device includes a level detecting unit and a voltage generating unit. The level detecting unit is configured to detect a level of an internal voltage based on a reference voltage to output a level detection signal. The voltage generating unit is configured to generate the internal voltage by selectively pumping an external voltage according to the level detection signal and a refresh signal.

Abstract: Methods and apparatus for managing electrical loads of electronic devices are disclosed. According to one embodiment, a current load imposed by an electronic device, such as a memory device (or memory system), can be measured. Then, using the measured current load, the memory device can determine whether (and to what extent) operational performance should be limited. By limiting operational performance, the memory device is able to limit its current load so as to satisfy a specification criterion or other requirement. The electrical load management is well suited for use in portable memory products (e.g., memory cards) to manage current loads being drawn.

Abstract: A semiconductor memory device includes a boosting circuit which boosts in a second voltage higher than an external power supply by using a first voltage as a reference voltage, and a bandgap reference circuit which operates by using the second voltage generated by the boosting circuit as a power supply voltage.

Abstract: A semiconductor memory device which includes: a voltage supplying unit for outputting a power source voltage as a driving source signal during a predetermined time, and then outputting a high voltage as the driving source signal in response to a driving control signal activated in response to an address signal; and a word line control unit for activating a word line at a voltage level of the driving source signal in response to the driving control signal.

Abstract: An exemplary amplifier circuit includes a first group of spatially distributed final amplifier stages having a first configuration, and a second group of spatially distributed final amplifier stages having a second configuration different than the first configuration. Both groups share the same control node for their respective final amplifier stages, and both groups share the same amplifier output node. Each group is typically enabled at a time that the other is disabled. In certain embodiments incorporating a memory array, only one critical analog node must be routed throughout the memory array.

Abstract: A semiconductor memory device includes an input/output line of a data transfer path and its surrounding circuits, comprising a controller which generates a control signal corresponding to command and address input in read and write operation; and a repeater which selects any one of the plurality of bank groups as the control signal to control data transfer between the selected bank group and an input/output pad.

Abstract: A method and calibration apparatus implement calibration of sampling of a data strobe signal (DQS) during synchronous dynamic random access memory (DRAM) reads. A calibration control is provided to enable calibration testing. A selected one of a received DQS signal and an internal Enable signal is driven onto a data mask (DQM) IO during a DRAM read for calibration testing. The received DQS signal and the internal Enable signal are used to adjust the Enable delay to generally center the preamble time at the DQS receiver.