Abstract: A one-way dipolar component with overcurrent protection including, in parallel, a first one-way dipolar component with a positive temperature coefficient; and a second one-way dipolar component having the same biasing as the first one-way dipolar component having a conduction threshold voltage greater than the conduction threshold voltage at ambient temperature of the first one-way dipolar component, the second component comprising a silicon diode in series with a component of a zener diode type.

Abstract: A switching power supply system has a control circuit that controls an output voltage by causing a switching device to turn ON and OFF. The control circuit includes a control pulse supplying unit that supplies a pulsed signal that_keeps the switching device turned-ON and -OFF. A protection circuit shuts down the switching power supply system upon occurrence of an abnormality. A delay circuit produces a delay signal that delays by a specified time duration the termination of a state of the pulsed signal in which the pulsed signal keeps the switching device turned-ON. The protection circuit is responsive to the pulsed signal or the delay signal to switch between an operation state and a stand-by state.

Abstract: An example controller includes a fault detector and a control. The fault detector is to be coupled to a feedback circuit of a power converter to detect a fault condition in the power converter in response to an input voltage of the power converter. The control is coupled to the fault detector and is to be coupled to control the switching of a power switch to regulate an output of the power converter. The control is coupled to inhibit the switching of the power switch in response to the fault detector detecting the fault condition during the switching of the power switch.

Abstract: At least three power converters in a power distribution and power transmission system can be controlled as rectifiers or inverters and are connected together by a direct current network. A measuring direct current voltage and a measuring direct current are measured on each power converter and respectively, transmitted to the respective rectifier control and/or inverter control, and a rectifier desired direct power and/or inverter desired direct power is determined for each power converter.

Abstract: An electrical energy generation system comprising: a plurality of photovoltaic generators connected in parallel and connected to a common load via respective DC voltage converters; and a regulator configured to vary the transconductances of said respective voltage converters to maximize the power generated by said current generators; wherein: said generators are also connected to a common input of an additional voltage converter the output of which is connected to said common load; and said regulator is also configured to vary the transconductance of said additional voltage converter to maximize the power generated by said current generators.

Abstract: An example controller for a power converter according to aspects of the present invention includes a switching control that switches a power switch to regulate an output of a power converter. The controller also includes a sensor coupled to receive a signal from a single terminal of the controller. The signal from the single terminal is representative of a line input voltage of the power converter during at least a portion of an on time of the power switch. The signal from the single terminal is also representative of an output voltage of the power converter during at least a portion of an off time of the power switch. The switching control is responsive to the sensor.

Abstract: There is disclosed a power supply and method. The power supply may include a power converter for converting AC primary power into DC power, the power converter having a normal operating mode and a low power quiescent operating mode. A DC power plug may be adapted to deliver DC power from the power converter to a load. The normal operating mode and the low power quiescent operating mode of the power converter may be selected by a switch integrated into the DC power plug.

Abstract: A regulating apparatus for a three-phase AC machine has a DC controller and an inverter. An input of the inverter is coupled to the DC controller and an output of the inverter can be coupled to the AC machine.

Abstract: The invention relates to a controlling apparatus of an AC LED string, which includes a controller to control the string being capable of flickering or totally unflickering very easily. The apparatus can also connect an adjustable resistance for application on a string with various numbers of LEDs. The apparatus includes at least one set of a pair of slots with different shapes or sizes at output ends for connecting with the LED string correctively that obtains improvement and utilization.

Abstract: An energy transfer element includes a first winding coupled to an input circuit and a second winding coupled to an output circuit. The first winding has a first unit and a second unit, and the second winding is wound between the first unit of the first winding and the second unit of the first winding. The energy transfer element further includes a third winding provided between the first unit of the first winding and the second winding. The third winding is used to supply a bias voltage of the input circuit, and a winding width of the third winding is greater than a winding width of the first unit of the first winding and a width of the second winding.

Abstract: A system for reducing and limiting current and reducing voltage for a light string system. The system includes: an input terminal connected to a rectifying circuit; the rectifying circuit being connected between the input terminal and a voltage-reducing and current-limiting circuit; the voltage-reducing and current-limiting circuit being connected between the rectifying circuit and the input terminal; and an output terminal being connected to the device for rectifying current, reducing voltage and limiting current.

Abstract: A semiconductor device is provided, which comprises a rectifier circuit configured to generate a first voltage from a first signal inputted from an input terminal, a comparing circuit configured to compare a reference voltage and the first voltage inputted from the rectifier circuit and to output a second signal to a switch, and a voltage generation circuit configured to generate a second voltage from the first signal inputted from the input terminal. The rectifier circuit includes a transistor including at least a control terminal, and the voltage generation circuit inputs the second voltage to the control terminal when the switch is turned on in accordance with the second signal.

Abstract: A controller for controlling a controlled switching device functioning as a synchronous rectifier of alternating current, the controller comprising a control circuit for sensing the direction of current through the controlled switching device, the controlled switching device comprising a MOSFET having a conduction channel and a parasitic body diode and having two main current carrying terminals and a control terminal, the control circuit generating a control signal provided to the control terminal to turn on the controlled switching device approximately when current begins to flow in a first direction through the controlled switching device and turn off the controlled switching device approximately when current begins to flow in a second opposite direction through the controlled switching device, further wherein the control circuit for sensing the direction of current through the controlled switching device main current carrying terminals comprises a sensing circuit coupled across the controlled switching dev

Abstract: A resonant inverter includes inductive elements (L1, L2) that allow the number of magnetic components in the inverter to be reduced. The elements (L1, L2) may be designed with a leakage inductance to eliminate the need for a large DC inductor. They may also perform the function of a current splitting transformer. The inverter switches may also be driven directly from the inverter circuit without a separate controller being required.

Abstract: A method for operating a matrix converter to convert n phases of a generator into alternating voltage with nr (nr<n) phases of a load connected to a network includes the steps of alternatingly connecting the nr phases of the load using a plurality of controllable bi-directional switches disposed in an (n×nr) matrix, wherein nr phases of the generator are always connected with the load and (n?nr) phases of the generator are not connected with the load, and controlling the switching of a phase k of the generator at a time t to a phase c of the grid, using a periodical, continuous, segmented function k(t). The function k(t) defines a broken line having a plurality of segments, wherein each segment i is defined by a starting time ti and a pulsation ?i, and the value of the function k(t) is rounded to the closest integer value.

Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.

Abstract: Improved circuitry and methods for programming memory cells of a memory device are disclosed. The improved circuitry and methods operate to protect the memory cells from potentially damaging electrical energy that can be imposed during programming of the memory cells. Additionally, the improved circuitry and methods operate to detect when programming of the memory cells has been achieved. The improved circuitry and methods are particularly useful for programming non-volatile memory cells. In one embodiment, the memory device pertains to a semiconductor memory product, such as a semiconductor memory chip or a portable memory card.

Abstract: In one aspect, a resistive memory device may be implemented in an embedded system. A resistive memory may comprise a resistive switchable medium that may be electrically connected to a first and a second electrode. In one aspect the first and the second electrode may comprise a via conductor and an interconnection line of an embedded structure.

Abstract: According to one aspect, a switching element may comprise a first electrode, a second electrode, and a resistive switching region extending from the first electrode to the second electrode and comprising transition metal oxinitride.

Abstract: A method of implementing a write operation for a programmable resistive random access memory array includes coupling a current source to a bit line associated with a programmable resistive memory element; prior to activating a word line associated with the memory element, precharging the bit line by passing current the bit line and through a dummy path selectively coupled to the bit line; and upon achieving a desired operating point of bit line current and bit line voltage, decoupling the dummy path from the bit line and activating the word line associated with the memory element so as to cause current from the bit line to flow for a period of time selected to program the memory element to one of a low resistance state and a high resistance state.

Abstract: An integrated circuit includes a plurality of resistivity changing memory cells and a plurality of resistivity changing reference cells. The integrated circuit is arranged such that each memory cell is switchable between N resistance levels, N being an integer greater than or equal to 2. To each of at least two possible resistance levels of a memory cell an individual reference cell as assigned. A resistance level of a memory cell is determined or set depending on the resistance level of the reference cell which is assigned to the resistance level of the memory cell.

Abstract: A design structure embodied in a machine readable medium used in a design process includes a circuit for implementing a write operation for a programmable resistive random access memory array, the circuit including a current source coupled to a bit line associated with a programmable resistive memory element; a dummy path configured for selective coupling to the bit line prior to activation of a word line associated with the memory element, wherein the passage of current through the bit line and dummy path precharges the bit line; and control circuitry for decoupling the dummy path from the bit line and for activating the word line associated with the memory element upon achieving a desired operating point of bit line current and bit line voltage, so as to cause current from the bit line to flow for a period of time selected to program the memory element to one of a low resistance state and a high resistance state.

Abstract: A resistive random access memory (RRAM) device may include a first metal pattern on a substrate, a first insulating layer on the first metal pattern and on the substrate, an electrode, a second insulating layer on the first insulating layer, a resistive memory layer, and a second metal pattern. Portions of the first metal pattern may be between the substrate and the first insulating layer, and the first insulating layer may have a first opening therein exposing a portion of the first metal pattern. The electrode may be in the opening with the electrode being electrically coupled with the exposed portion of the first metal pattern. The first insulating layer may be between the second insulating layer and the substrate, and the second insulating layer may have a second opening therein exposing a portion of the electrode.

Abstract: A memory using an SRAM memory cell intended for low-voltage operation is designed to decrease the threshold value of MOS transistors constituting the memory cell without substantial decrease in the static noise margin, which is the operational margin of the memory cell. To this end, a voltage Vdd? higher than a power supply voltage Vdd of a power supply line for peripheral circuits is supplied from a power supply line for memory cells as a power supply voltage for memory cells. Since the conductance of driver MOS transistors is in-creased, the threshold voltage of the MOS transistors within the memory cells can be reduced without reducing the static noise margin. Further the ratio of width between the driver MOS transistor and a transfer MOS transistor can be set to 1, thereby allowing a reduction in the memory cell area.

Abstract: The present invention provides circuitry for writing to and reading from an SRAM cell core, an SRAM cell, and an SRAM device. In one aspect, the circuitry includes a write circuit coupled to the SRAM cell core that includes a write transistor gated by a write word line. The circuitry also includes a read buffer circuit coupled to the SRAM cell core to read the cell without disturbing the state of the cell. The read buffer circuit includes a read transistor gated by a read word line, the read transistor coupled between a read bit-line and a read driver transistor that is further coupled to a voltage source Vss. The read driver transistor and a first driver transistor of the cell core are both gated by one output of the cell core. The read transistor has an electrical characteristic that differs from that of the core cell first driver transistor.

Abstract: Systems, circuits and methods for determining read and write voltages for a given word line transistor in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A first voltage can be supplied to the write operations so that the write operations occur in the saturation region of the word line transistor. A second voltage, which is less than the first voltage, can be supplied for read operations so that the read operations occur in the linear region of the word line transistor.

Abstract: A spin-injection magnetic random access memory of an aspect of the present invention includes a magnetoresistive element, a unit which writes data into the magnetoresistive element by use of spin-polarized electrons generated by a spin-injection current and which applies, to the magnetoresistive element, a magnetic field of a direction of a hard magnetization of the magnetoresistive element during the writing.

Abstract: Memory cells are described along with arrays and methods for manufacturing. An embodiment of a memory cell as described herein includes a second doped semiconductor region on a first doped semiconductor region and defining a pn junction therebetween. A first electrode on the second doped semiconductor region. An insulating member between the first electrode and a second electrode, the insulating member having a thickness between the first and second electrodes. A bridge of memory material across the insulating member, the bridge having a bottom surface and contacting the first and second electrodes on the bottom surface, and defining an inter-electrode path between the first and second electrodes across the insulating member, the inter-electrode path having a path length defined by the thickness of the insulating member, wherein the memory material has at least two solid phases.

Abstract: A variable resistance memory array, programming a variable resistance memory element and methods of forming the array. A variable resistance memory array is formed with a plurality of word line transistors surrounding each phase change memory element. To program a selected variable resistance memory element, all of the bitlines are grounded or biased at the same voltage. A top electrode select line that is in contact with the selected variable resistance memory element is selected. The word line having the word line transistors surrounding the selected variable resistance memory element are turned on to supply programming current to the element. Current flows from the selected top electrode select line through the variable resistance memory element into the common source/drain region of the surrounding word line transistors, across the transistors to the nearest bitline contacts. The word lines are patterned in various lattice configurations.

Abstract: Memory devices having memory cells comprising variable resistance material include an electrode comprising a single nanowire. Various methods may be used to form such memory devices, and such methods may comprise establishing contact between one end of a single nanowire and a volume of variable resistance material in a memory cell. Electronic systems include such memory devices.

Abstract: A semiconductor memory device includes: plural bit lines connected with plural memory cells, respectively; plural transfer lines allocated in common to the plural bit lines; sense amplifiers (SA1) and (SA2) connected to these transfer lines, respectively; and a control circuit making the sense amplifier (SA2) perform a converting operation during an amplifying operation performed by the sense amplifier (SA1). Because the plural sense amplifiers are allocated to the same bit lines, and these are operated in parallel in this way, data can be read at a high speed.

Abstract: A non-volatile storage device in which current sensing is performed for a non-volatile storage element with a negative threshold voltage. A control gate read voltage is applied to a selected word line of a non-volatile storage element, and source and p-well voltages are applied to a source and a p-well, respectively, associated with the non-volatile storage element. The source and p-well voltages exceed the control gate read voltage so that a positive control gate read voltage can be used. There is no need for a negative charge pump to apply a negative word line voltage even for sensing a negative threshold voltage. A programming condition of the non-volatile storage element is determined by sensing a voltage drop which is tied to a fixed current which flows in a NAND string of the non-volatile storage element.

Abstract: A non-volatile storage device in which current sensing is performed for a non-volatile storage element. A voltage is applied to a selected word line of the first non-volatile storage element, and source and p-well voltages are applied to a source and a p-well, respectively, associated with the non-volatile storage element. The source and p-well voltages are regulated at respective positive DC levels to avoid a ground bounce, or voltage fluctuation, which would occur if the source voltage at least was regulated at a ground voltage. A programming condition of the non-volatile storage element is determined by sensing a current in a NAND string of the non-volatile storage element. The sensing can occur quickly since there is no delay in waiting for the ground bounce to settle.

Abstract: A novel FLASH-based EEPROM cell, decoder, and layout scheme are disclosed to eliminate the area-consuming divided triple-well in cell array and allows byte-erase and byte-program for high P/E cycles. Furthermore, the process-compatible FLASH cell for EEPROM part can be integrated with FLASH and ROM parts so that a superior combo, monolithic, nonvolatile memory is achieved. Unlike all previous arts, the novel combo nonvolatile memory of the present invention of ROM, EEPROM and FLASH or combination of any two is made of one unified, fully compatible, highly-scalable BN+ cell and unified process. In addition, its cell operation schemes have zero array overhead and zero disturbance during P/E operations. The novel combo nonvolatile memory is designed to meet the need in those markets requiring flexible write size in units of bytes, pages and blocks at a lower cost.

Abstract: A NAND flash memory device includes: a memory cell array that includes a plurality of NAND memory cell units each including a connection element having a plurality of electrically-rewritable memory cells; a plurality of word lines that are connected to the plurality of memory cells; a plurality of bit lines that are connected to the plurality of memory cells; and a read-write control section that applies a voltage selectively to the plurality of word lines and the plurality of bit lines, wherein each of the plurality of NAND memory cell units includes a first select gate transistor and a second select gate transistor; and wherein the read-write control section sets an voltage level applied to word lines, so that the voltage level becomes lower than a predetermined voltage level applied to other word lines connected to control gate electrodes of memory cells.

Abstract: A semiconductor storage device includes a first memory cell for storing two kinds of states, a second memory cell for storing two kinds of states, and a sense amplifier for detecting a potential difference between voltages equivalent to readout currents of the first and second memory cells, respectively. Either one of information data “0” or data “1”, which is stored in combination of the first and second memory cells, is read out by detecting the potential difference equivalent to the readout current difference between the first and second memory cells.

Abstract: A nonvolatile memory device which can reduce consumption current and shorten access time and a control method thereof is provided. The nonvolatile memory device 1 comprises a booster controller circuit 10, a booster circuit 20, a level-shifting circuit 30, a Y-decoder 40, and a main circuit 50. A NAND gate ND1, a NOR gate NR1, and a NOR gate NR2 provided in the booster controller circuit 10 output kick signals KICK0 to KICK2. The booster circuit 20 comprises boosting systems B0, B1, B2 which respectively receive the kick signals KICK0, KICK1, and KICK2. The kick signals KICK0 and KICK1 outputted from the NAND gate ND1 and the NOR gate NR1 make transition to high level in accordance with the transition of column address coladd from address 7 to 8. Therefore, the boosting system B0 is activated in addition to the boosting system B1.

Abstract: A flash memory device includes a plurality of memory cell blocks, an operating voltage generator, a block switching unit and a voltage supply circuit. Each of the plurality of memory cell blocks includes select lines and word lines, and has pass word lines included between the select lines and the word lines. The operating voltage generator outputs operating voltages to global select lines, global word lines and global pass word lines. The block switching unit connects the global word lines to the word lines and the select lines in response to a block select signal. The voltage supply circuit is connected to the select line and the pass word line, and is configured to supply the select line and the pass word line with a ground voltage in response to a block select inverse signal.

Abstract: Provided are a flash memory device and a method of driving the same for reading set information and stably storing the read set information in a latch. The method of driving the flash memory device includes applying power to the flash memory device, which includes a memory cell array for storing set information used to set an operating environment of the flash memory device. An initial read operation of the memory cell array is performed to read the set information. The set information read in the initial read operation is stored in a latch. It is determined whether the set information is normally stored in the latch based on set data input to the latch and set data output from the latch.

Abstract: A method for operating a flash memory device includes applying a first program voltage Vp1 to a plurality of word lines of memory cells. Threshold voltages of the memory cells are measured to obtain a first threshold voltage distribution for the memory cells. A second program voltage Vp2 is applied to the word lines of the memory cells that had been programmed with the first program voltage Vp1. The threshold voltages of the memory cells that have been programmed with the second program voltage Vp2 are measured to obtain a second threshold voltage distribution for the memory cells. A determination is made whether or not the memory cells that have been programmed with the second program voltage have been programmed properly. If the memory cells are determined to have been programmed properly, then the second program voltage is defined as an ending bias for a programming operation.

Abstract: A semiconductor memory device includes a plurality of sense amplifiers which read data from a plurality of memory cells of a memory cell array, and a sense time generation circuit which controls the sense time of the plurality of sense amplifiers, the sense time generation circuit including a dummy capacitor having substantially the same size as that of a capacitor provided in each of the plurality of sense amplifiers, a control transistor connected to one electrode of the dummy capacitor and a constant-current discharge circuit which controls the control transistor to discharge the dummy capacitor with a constant current. The constant-current discharge circuit includes first and second nMOS transistors which are connected in series and a mirror circuit which generates gate voltage to operate the first and second nMOS transistors in a saturated region by use of the lowest voltage.

Abstract: Current sensing is performed in a non-volatile storage device for a selected non-volatile storage element with a negative threshold voltage. A control gate read voltage is applied to a selected word line of a non-volatile storage element, and source and p-well voltages are applied to a source and a p-well, respectively, associated with the non-volatile storage element. The source and p-well voltages exceed the control gate read voltage so that a positive control gate read voltage can be used. There is no need for a negative charge pump to apply a negative word line voltage even for sensing a negative threshold voltage. A programming condition of the non-volatile storage element is determined by sensing a voltage drop which is tied to a fixed current which flows in a NAND string of the non-volatile storage element.

Abstract: Current sensing is performed in a non-volatile storage device for a non-volatile storage element. A voltage is applied to a selected word line of the first non-volatile storage element, and source and p-well voltages are applied to a source and a p-well, respectively, associated with the non-volatile storage element. The source and p-well voltages are regulated at respective positive DC levels to avoid a ground bounce, or voltage fluctuation, which would occur if the source voltage at least was regulated at a ground voltage. A programming condition of the non-volatile storage element is determined by sensing a current in a NAND string of the non-volatile storage element. The sensing can occur quickly since there is no delay in waiting for the ground bounce to settle.

Abstract: In an erase verifying method of a NAND flash memory device, a power supply voltage (Vcc) is applied to a second bit line while precharging a first bit line to a first positive voltage. Select transistors are turned on, and a ground voltage is applied to word lines of memory cell transistors. A second positive voltage is applied to source lines to which sources of the select transistors and the memory cell transistors are connected. An erased state of the memory cell transistor is verified according to whether charges accumulated in the first bit line are discharged.

Abstract: A pull down circuit pulls a bit line voltage to a regulated source voltage in a non-volatile storage device during a sense operation such as a verify operation which occurs during programming. The storage device may include NAND strings which have associated bit lines and sense components, and a common source line. When a selected storage element of a NAND string has been programmed to its intended state, the bit line is locked out during subsequent verify operations which occur for other NAND strings which are not yet locked out. The pull down device is coupled to each bit line and to the common source line, whose voltage is regulated at a positive DC level, to prevent coupling of system power bus (VSS) noise from the locked out bit lines to the not yet locked out bit lines.

Abstract: A one-time programmable device includes a controller, a protection system, a static storage element and a latch, which can be referred to as a latch-based one-time programmable (OTP) element. In one example, the static storage element includes a thin gate-oxide that acts as a resistance element, which, depending on whether its blown, sets the latch into one of two states.

Abstract: Provided are a semiconductor memory device having a post package repair control circuit and a post package repair method. In the semiconductor memory device and the post package repair method, in a post package repair mode, a second memory bank is used as a fail bit map memory for storing failed bit information regarding a first memory bank, and the first memory bank is used as a fail bit map memory for storing failed bit information regarding the second memory bank.

Abstract: A reading circuit in a memory having a first memory cell coupled to a first bit line and a second bit line and a second memory cell coupled to the second bit line and a third bit line, is provided. The reading circuitry comprises a source side sensing circuit, a drain side bias circuit, a first selection circuit and a second selection circuit. The drain side bias circuit provides a drain side bias. The first selection circuit connects the second bit line and the third bit line to the drain side bias circuit in a read operation mode. The second selection circuit connects the first bit line to the source side sensing circuit so that a source current of the first memory cell is sensed.

Abstract: Write control circuitry and control method are provided for a memory array configured with multiple memory subarrays. The write control circuitry includes multiple subarray write controllers associated with the multiple memory subarrays, each subarray write controller selectively enabling a local write control signal to its associated memory subarray. The selectively enabling is responsive to a received subarray select signal, wherein only one subarray select signal is active at a time. At least some subarray write controllers are powered at least in part via a switched power node, wherein powering of the switched power node is distributively implemented among the subarray write controllers. In one example, the distributively implemented powering of the switched power node is accomplished via multiple inverters distributed among the subarray write controllers, each inverter having an output coupled to the switched power node, and an input coupled to receive a global write enable signal.

Abstract: Methods and apparatus are provided for read/write control and bit selection with false read suppression in an SRAM. According to one aspect of the invention, a bit select circuit is provided for an SRAM. The disclosed bit select circuit comprises one or more transistors controlled by a write control gate signal to prevent data from being read from one or more data cells during a write operation. The transistors can comprise, for example, a pair of gated transistors controlled by the write control gate signal. The write control gate signal prevents data from being read from one or more data cells while the write control gate signal is in a predefined state.