Abstract: The heat sink, particularly for a thermoelectric module, is of the kind formed of a plurality of first fin plates and second spacer plates, alternately disposed side by side and in contact with one another, and comprises fastening members which extend through the first and second plates for fastening one to the other. Each of said first and second plates has on one side at least a protrusion and on the opposite side at least a recess. The protrusion on one side of said first and second plates engages into the recess on a facing side of said second and first plates, respectively, with a positive fit. The protrusion on one side and the recess on the opposite side of said first and second plates are disposed out of alignment relative to a straight line on the plane of the plates intersecting the axis of the fastening members.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: Provided is an integrated circuit (IC) holder that includes: a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); and a heat-dissipation unit for transferring heat generated from the IC package to the case, so that the IC holder is not in contact with the PCB or designed to avoid devices or circuits adjacent to the IC package even though it is contact with the PCB, thereby reducing an unnecessary area not used for layout of the PCB and providing a layout structure similar to that using only the IC package. Further, the IC holder can have a solderless structure to make the devices be readily replaced, solve an environment problem, and be easily applied to various kinds of the IC packages.

Abstract: The invention relates to a terminal module (1) with integrated functions, comprising a housing (2), at least one terminal strip (14-16) for connecting wire strands, and at least one circuit board (20) which is disposed in the housing (2) and on which functional elements are arranged that are electrically placed between contacts of the terminal strip or strips (14-16). Switching elements (21), by means of which conductor paths between the contacts can be modified, are positioned on the circuit board (20).

Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Abstract: Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the PCB surrounding the edge connector to bend relative to the remainder of the PCB, thereby confine the bending to a localized area between the ends of the slots, and isolate the electrical components from any stresses caused thereby.

Abstract: A storage apparatus includes an enclosure that has an opening in a bottom, and a carriage block. A flexible printed board has an upper part and a lower part, and a connector attached on an opposed surface of the lower part to a bottom plate of the enclosure inserted through the opening. A connector packing is fixed around the connector, with a catching part that stretches toward the flexible printed board. The flexible printed board has a first opening formed in the lower part, into which the catching part of the connector packing is infixed and a second opening formed in the upper part, into which the catching part of the connector packing fixed into the first opening is further fixed with the upper part folded on the lower part.

Abstract: A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second array of interconnects disposed on a top surface of the substrate, corresponding interconnects of the first and second arrays of interconnects electrically connected by wires in the substrate; an interposer, a first array of pads disposed on a top surface of the interposer and a second array of pads disposed on a bottom surface of the interposer, corresponding pads of the first and second arrays of pads electrically connected by wires in the interposer, and pads of the second array in direct physical and electrical contact with corresponding interconnects of the second set of interconnects; and wherein the interposer includes an interposer substrate of the same material as a substrate of the integrated circuit chip.

Abstract: Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased.

Abstract: A resist 7 of a predetermined thickness is formed on a printed circuit board 1 except electrode-opposing portions 1a (FIG. 1A), and a silk screen printed layer 9 of a predetermined thickness is formed on the resist 7 (FIG. 1B). Thereafter, a concave portion 2b of a film capacitor 2 is bonded to the silk screen printed layer 9 by an adhesive double coated tape 6 of a predetermined thickness in such a manner that electrode portions 2a of the film capacitor 2 are opposed respectively to the electrode-opposing portions 1a of the printed circuit board 1 (FIG. 1D). Here, the sum of the thicknesses of the resist 7, silk screen printed layer 9 and adhesive double coated tape 6 is not smaller than a concave-convex height difference L1 of the film capacitor 2, and with this arrangement the electrode portions 2a of the film capacitor 2 are prevented from interfering with the printed circuit board 1.

Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

Abstract: A retention device for an interface card cradle is provided for retaining an interface card cradle in a case of a computer. The retention device includes a guiding seat fixed to the case, a guided member, and a latching member. The guided member is connected to the interface card cradle and guided by the guiding seat, so as to move the interface card cradle relative to the guiding seat. The latching member is pivotally connected to the guiding seat, for selectively fixing the interface card cradle at a retained position or a released position.

Abstract: A structural packaging assembly to support a multi-function optic chip or the like is mountable in a gyroscopic unit. An example assembly includes a housing mounted to a mounting plate. The chip is located in the housing, which in turn is coupled to a mounting plate. The housing may have a prescribed section modulus capable of sufficiently withstanding applied vibrations within a predefined vibrational range, such as a vibrational range at or below about 3500 Hz. The structural packaging assembly utilizes a mounting system with mounting feet that clamp to dowels, which in turn have been press fit into the mounting plate. In one embodiment, the mounting feet take the form of “C” clamp mechanisms, which after being clamped to the dowels, allow for resonance dampening between the housing and the mounting plate.

Abstract: A packaging substrate with fiat bumps for an electronic device and a method of manufacturing the same relate to the production of the packaging substrate for an electronic device, which comprises base islands and pins structurally and wherein the base islands and pins which all exhibit flat bump shape distribute on the front face of the substrate; the bottom side of the bumps, namely the rear faces of the base islands and pins are contiguous in the same substrate; in the packaging body of a single electronic device to be formed in later procedure, one or more base island may be included, the pins may arrange on one single side of the base island, also may arrange on the both sides or three sides of the base island, or may surround the base island so as to form the structure of one or more circuits of pins.

Abstract: The present disclosure relates to a rack for telecommunications equipment. The rack includes a frame defining a bay opening sized and shaped for receiving a plurality of jack modules. The rack also includes a first set of cable management brackets that define a first vertical channel arranged and configured for receiving and vertically managing a plurality of cross-connect cables. Each of the cable management brackets includes a pivot portion that is pivotally movable relative to the frame. The pivot portions are pivotally movable between first positions in which the pivot portions extend partially across a front of the bay opening, and second positions in which the pivot portions are generally offset from the front of the bay opening. The present disclosure also relates to a rack for telecommunications equipment that includes rear cable management structure that defines a plurality of vertical channels along a back side of the rack.

Abstract: An appliance assembly includes an appliance and an appliance member. The appliance includes a wall defining a plurality of holes. The appliance member is carried by the appliance. The appliance member includes a housing which includes a snap-fit arrangement coupled with the appliance. The snap-fit arrangement includes a first plurality of ears and a second plurality of ears, the first and second plurality of ears snap-fittingly engaging the plurality of holes.

Abstract: A light source (110) is fixed at a position and emits light in a direction away from an optical axis (A) of an objective lens. An outer reflecting mirror (an optical member) (130) and an inner reflecting mirror (an optical member) (140) are provided as a unit so that relative positions thereof are fixed. A reflecting mirror unit (120) can be moved in directions along the optical axis (A), i.e. up and down relative to the light source (110). A free-form curved surface portion (131) of the outer reflecting mirror (130) and a reflecting surface of the inner reflecting mirror (140) reflect light in different directions depending on a position of the light incident thereon.

Abstract: The invention relates to a polymeric optical film comprising a base provided with integral optical features on at least one side, wherein the features have two or more sides that form a ridge line, wherein the optical film has light leakage through crossed polarizers of less than 1.0%.

Abstract: The present invention relates to illumination of an instrument for displaying information suitable for use in a vehicle. The invention provides an illumination device for an instrument of a vehicle comprising: a substantially Y shaped light guide having a first leg portion a second leg portion and a third leg portion coupled at a junction; an LED coupled to one end of the first portion of the light guide; and in which the second portion and the third portion have an internal peripheral portion and an external peripheral portion, and the second leg portion and the third leg portion are arranged in operation to illuminate a segment of an instrument and each of the second leg portion and third leg portion have first grooves formed along the internal peripheral portion, and second grooves formed along the second peripheral portion. An instrument comprising such an illumination device is also provided.

Abstract: An audio system with an illumination mechanism is disclosed. One embodiment includes a device which can be mounted in the center of an audio speaker and used to create an optical effect.

Abstract: In one embodiment the instant invention combines a post having a light at its top and a heater in its middle. In one embodiment, the post has a cabinet below the heater. The cabinet may contain the fuel source of the invention so that the heater may be easily portable. In one embodiment, a wind shield protects the heater so that the heat source will not be extinguished. In one embodiment, the light and the heater have separate controls and are separately operable.

Abstract: Headlights wherein one or more parameters associated with the illumination provided by the associated light source are described. Parameters that can be adjusted, for example, include the intensity of light exiting the headlight assembly, the dispersion of light emitted from the headlight, the direction of illumination, and the like.

Abstract: The present disclosure provides a light assembly (10) for connection to a shelf (16) having a top face (84), a front face (88), and a front edge (80) defined by the intersection of the top face (84) and the front face (88). The light assembly (10) includes an elongated housing (14) having an inner face (22), an outer face (30) formed opposite the inner face (22), and an upper face (26) extending between the inner face (22) and the outer face (30). The elongated housing (14) is adapted to receive a light source (34) therein. A mating portion (70) extends from the inner face (22) of the elongated housing (14) and is abuttable with a portion of a shelf (16) such that the upper face (26) of the elongated housing (14) is substantially flush with the top face (84) of the shelf (16) to form a continuous extension of the shelf (16). A clamp (96) extends from the mating portion (70) and is engageable with the shelf (16) to secure the elongated housing (14) to the shelf (16).

Abstract: The Invention is an apparatus for displaying a medallion in an item of memorabilia. The item of memorabilia defines a cavity. A holder is configured to be contained within the cavity and defines a medallion-receiving opening selectably receiving the medallion. The holder contains an LED lamp oriented generally parallel to the display surface of the medallion. The LED lamp causes the relief of the medallion to cast a shadow on the display surface of the medallion. The lustrous metal of the medallion reflects light from the relief to an observer.

Abstract: An improved flashlight having a flashlight housing, comprising an elongated substantially flat gear train having a mechanical input and a mechanical output is disclosed. An elongated substantially flat solar cell supplies power to the system. A control circuit is coupled to said solar cell. A generator is electrically coupled to the control circuit and mechanically coupled to the mechanical output of the elongated substantially flat gear train. An electrical switch is coupled to the control circuit. A rechargeable battery and is positioned within a battery housing, which opens to the outside of the housing of the flashlight coupled to said control circuit. A removable cap closes the battery housing. A crank is mechanically coupled to the input of the gear train.

Abstract: A high bay induction fluorescent lighting fixture having a multiple of nested circular lamps suspended on a post below the ballasts therefor and enclosed in a reflector.

Abstract: A strip light assembly including an elongated light carrying member with a series of lights extending along the length thereof, and an elongated translucent tubular cover member in which the light carrying member is removably slidably mounted, the interior of the cover member having radially spaced internal projections positioned to receive the light carrying member therebetween to maintain the light carrying member in selectable different angular orientations in the cover member.

Abstract: A luminaire system having an elongated throughway utilizing a thermal chimney effect. The thermal chimney effect within the throughway circulates air to remove heat generated from the electrical components of the system. Dissipating heat into the throughway from the electrical components can increase the life expectancy of the lamp and the output of the lamp. The electrical components of the system being entirely sealed and isolated from the throughway results in a permanent air, dust, and water tight seal. The permanent seal can minimize damage to the electrical components of the system as well as prevent the build up of moisture and dust within these sealed components.

Abstract: A fluorescent lamp assembly includes a fixture which supports at least one fluorescent lamp. A ballast is mounted to the fixture for controlling a supply of electrical current to the fluorescent lamp. A thermal transfer material is interposed between the ballast and a portion of the fixture whereby heat is transferred between the ballast and the fixture.

Abstract: A light control device implemented as a luminaire exhibits an ultra-wide batwing luminous intensity distribution in an upper hemisphere that provides substantially uniform illumination of a ceiling surface, even when the luminaire is mounted very close to the ceiling. Luminous side panel diffusers facilitate blending the luminaire with the ceiling surface as they create a batwing luminous intensity distribution in a lower hemisphere to evenly illuminate a work plane.

Abstract: Disclosed is a backlight device for illuminating a transmissive color liquid crystal display panel from its backside with white light. The backlight device includes, as a light source, a plural number of principal light emitting diode units 21mn, and a plural number of subsidiary light emitting diode units 21mn, where m and n are natural numbers. Each principal light emitting diode unit is made up by a plural number of light emitting diodes (21) arrayed in a string and emits white light of preset chromaticity. Each subsidiary light emitting diode unit is made up by a plural number of light emitting diodes (21) arrayed in a string and emits white light of chromaticity in the vicinity of the preset chromaticity. The number of the subsidiary light emitting diode units is smaller than that of the principal light emitting diode units.

Abstract: An LED lamp includes a lamp-lid, a metal lamp-cup, an insulating layer for connecting a lamp-cap and the metal lamp-cup, LEDs, a semispherical pallet or an astigmatism plate, and a PCB (Printed Circuit Board) in the metal lamp-cup, characterized in that, one semispherical pallet is provided on said PCB, the semispherical pallet has the same number of holes as that of the LEDs, the LEDs are installed in the holes of the semispherical pallet, electrical connections of the LEDs are connected to the PCB through the semispherical pallet, and provided with power.

Abstract: A substrate structure for light emitting diodes (LED) chips operation includes a heat spreader, chip holders arranged in the center of the heat spreader, transfer pads located near the chip holders for wire bonding interconnection between the LED chips, and a circuit layer having a gap dividing the circuit layer diagonally. The circuit layer includes a first insulation layer on top of the heat spreader, a metal trace layer on top of the first insulation layer, and a second insulation layer on top of the metal trace layer, wherein portions of the second insulation layer are removed at the opposite corners along the gap, and around the opening, and a conductive plating is plated on the second insulation layer around the opening. Furthermore, a spotlight cap is provided to focus the light emitted from the LED. A LED package includes the substrate structure and the spotlight cap is also provided.

Abstract: LED-based lighting fixtures suitable for general illumination in surface-mount or suspended installations, in which heat dissipation properties of the fixtures are significantly improved by decreasing thermal resistance between LED junctions and the ambient air. In various examples, improved heat dissipation is accomplished by increasing a surface area of one or more heat-dissipating elements proximate a trajectory of air flow through the fixture. In one aspect, various structural components of the fixtures are particularly configured to create and maintain a “chimney effect” within the fixture, resulting in a high air-flow rate, natural convection cooling system capable of efficiently dissipating the waste heat from the fixture without active cooling.

Abstract: A luminaire module comprising an LED on an optical axis, thermally mounted to a heat sink, said heat sink comprising openings for which air can circulate; said opening of each portion offset from each other so that light emanating from said LED can pass through the holes from one said portion, said light blocked by the solid area of the other portion.

Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided, wherein an end of the holder is connected to the base. The light emitting device includes a lampshade connected to the other end of the holder, multiple Lambertian LED light source assemblies, multiple side-emitting LED light source assemblies, a transparent support provided at the lampshade, and multiple brightness enhancement films (BEF). The lampshade has a side wall and a top wall connected the side wall, and the Lambertian LED light source assemblies and the side-emitting LED light source assemblies are disposed on the top wall. The BEFs are disposed on the transparent supports correspondingly to the Lambertian LED light source assemblies and are suitable to focus the light emitted from the Lambertian LED light source assemblies.

Abstract: Disclosed herein is an illuminated signboard using a plane light source in which edges of two light guide plates are cut in an inclined form, an opaque plate having high surface reflectivity is inserted between the two light guide plates to optically block the two light guide plates from each other, and the light guide plates and the opaque plate are combined to form a second lighting part. U-shaped frames including LEDs are connected to construct a frame housing and the second lighting part is combined with the frame housing. Light emitted from the LEDs and transmitted in the light guide plates is dispersed by a dispersing mechanism formed on the backsides of the light guide plates using paint, print ink or engraving to transmit the light guide plates and graphics or natural color pictures formed on transparent plates attached to the outer sides of the light guide plates so as to illuminate the graphics or the natural color pictures.

Abstract: The present invention relates to a lighting device in the form of a matrix illumination system, comprising a transparent carrier plate (11) provided with a plurality of LEDs (3, 5), arranged thereon. The LEDs may be arranged in a pattern with rows and columns and each LED may be optically connected to a collimating optical component (13, 15) in the form of an optical transparent body which collimates light generated by the respective light emitting diode by means of total internal reflection. In order to make the overall system transparent, so that objects behind the system may be visible therethrough, the space between the optical elements of the individual LEDs is filled with a filling material (29) that has a refractive index which is higher than the refractive index of air. A gap is maintained between the filling material and the surfaces of the optical components in order to maintain the TIR lens property.

Abstract: The systems and methods described herein relate to solid-state light sources capable of generating radiation beams for, but not limited to, the treatment of surfaces, bulk materials, films, and coatings. The solid-state ultraviolet source optically combines the light output of at least two and preferably as many four independently controllable discrete solid-state light emitters to produce a light beam that has a controllable multi-wavelength spectrum over a wide range of wavelengths (i.e. deep UV to near-IR). Specific features of this light source permit changes in the spectral, spatial and temporal distribution of light for use in curing, surface modification and other applications.

Abstract: An exemplary bottom lighting type backlight module includes a frame, a plurality of light sources, a reflecting sheet and at least one optical sheet. The frame includes a base and a plurality of sidewalls extending from the peripheral of the base to define an opening. The base defines a plurality of guide holes. Each optical sheet is disposed on the opening of the frame. The at least one optical sheet and the frame collectively define a chamber. The reflecting sheet is supported by the sidewalls, for partitioning the chamber into an illumination space and a heat dissipation space. The reflecting sheet defines a plurality of through holes therein. The light sources are arranged on the base of the frame under the reflecting sheet according to the through holes, illuminating light through the through holes towards the at least one optical sheet.

Abstract: String and support for light-emitting diodes having a capsule and, at a rear end of said capsule, electrical connecting pins, in which encapsulating blocks embed the rear parts of said diodes, said pins, the end parts of the connecting wires connected to these pins and the adjacent end parts of their sheaths. Also described is a chain of light-emitting diodes, comprising sheathed flexible electrical supply wires and a multiplicity of strings, of which the end wires are connected respectively to said supply wires. Additionally, a luminous device with light-emitting diodes, comprising at least one board having a multiplicity of traversing holes, at least one string of light-emitting diodes and/or at least one chain of light-emitting diodes, of which the diodes are engaged respectively in at least some of said holes of the board, from one side of the latter and are held.

Abstract: The present invention relates to an LED light bulb. The LED light bulb comprises a base and a hollow shell. The base has a closed end, an open end and a sleeve between the two ends. The shell is connected to the open end of the base. The LED light bulb comprises at least two LEDs substantially linearly arranged within the shell. By arrangement of multiple LEDs one or more strands the luminance or brightness of the bulb is improved compared with a bulb with one LED or with several horizontally arranged LEDs in a common place, without sacrificing the advantage of energy saving.

Abstract: This invention relates to a lighting module (101) comprising a carrier (103), a plurality of LED groups (109), arranged in an array on the carrier (103), a mesh (105), arranged at the carrier (103), and a front diffuser plate (107) arranged in front of the mesh (105). The mesh (105) has walls, which are arranged in a geometrical pattern forming a plurality of cells (113), such that the light emitted from at least some of the LED groups, which are adjacent to each other, is mixed before passing the diffuser plate.

Abstract: A composite illumination device includes a first casing; at least one first light-emitting element; at least one electric socket and at least one second light unit. The first casing having a receiving space thereinside and the first light-emitting elements are received in the receiving space to emit first light. The second light unit electrically connected to the electric socket to control a second light-emitting element to emit second light. Furthermore, the second light unit is rotatably and movably connected into the electric socket. With the above-mentioned structure, first light is provided for a common illumination and second light can be adjusted to shine a predetermined position for a guiding effect.

Abstract: A light emitting device comprises a substrate (61) and an arrangement of light emitting elements (62) provided over the substrate. The substrate has a contoured surface which defines at least first and second regions (60a, 60b, 60c), having normal directions which face in different directions. The light emitting elements (62) comprise directional light emitting elements, and are provided on the first and second regions (60b, 60c), thereby to define first and second light emission directions. This arrangement provides light source elements on a structured (topographically non-flat) substrate in a device, such that the angular distribution of light emitted by the device can be electronically adapted by controlling the light emission per light-emitting area.

Abstract: The present invention concerns a lamp with jointed rigid arms forming, in the folded position, a spiral shape, that can be a circular spiral or a polygonal spiral: see FIG. 1A, 2, 12, 13, 14, 15, 16. The arms are joined one another by means of joints, see FIG. 3, housed and locked inside the arms, and that consist of cylindrical hinges provided with brakes having an adjustable braking moment, see FIGS. 3, 4 and 5. This allows to turn at will the arms one another and to keep them still in the wanted position. The joints have a pass through hole inside, see FIGS. 3, 7 and 8, to permit the passing of the electric wires or of the optical fibres.

Abstract: The full light cut-off, light pollution-free, light bulb is a complete and self-contained bulb that is designed to replace standard light bulbs in standard light fixtures turning that standard light fixture into a full cut-off, light pollution-free fixture. The light bulb assembly is built around a light bulb, such as a compact florescent light bulb or a standard incandescent light bulb. Two variations are described. The first design is to replace standard compact florescent light bulbs or incandescent light bulbs mounted in an upward facing socket such as a lamp post or upward socket carriage light fixture. The second design is to replace standard compact florescent light bulbs or incandescent light bulbs mounted in a downward facing socket such as downward socket carriage light fixture. In both designs, the basic light bulb is enclosed in a transparent cylinder.

Abstract: The present invention discloses a LED (Light-Emitting Diode) heat-dissipating module, which comprises a heat-dissipating fin, a heat-conduction pipe, a LED illumination module and a casing. The heat-dissipating fin has an insertion/press-fit member inserted by or press-fitted to the heat-conduction pipe. The heat-conduction pipe has a contact region contacting the LED illumination module. In the application of the present invention, the LED illumination module is installed on the contact regions of several heat-conduction pipes inserted into or press-fitted to the heat-dissipating fins; thus, the heat generated by the LED illumination module can be effectively dissipated. Then, the LED illumination module is placed inside the casing having an accommodation space. Thus, heat can be conducted via the heat-conduction pipe to the heat-dissipating fin and then fast dissipated therefrom even though the LED illumination module is placed inside the casing.

Abstract: A PAR lamp (10) has a body (12) with an internal reflector surface (14) disposed about a longitudinal axis (16). A cavity (18) is provided at one end (20) of the body (12) and an arc discharge tube (22) that provides a substantially spherical light source is positioned in the cavity (18) and disposed on the longitudinal axis (16). A cover receiving opening (24) is provided at a second end (26) of the body and a cover (27) closes the cover receiving opening (24). A plurality of spiral facets (28) is formed on the internal reflector surface (14), the plurality of spiral facets (28) being sufficient in number to increase the maximum beam candle power and decrease the beam angle when compared to faceted lamps having a lesser number of facets. The number of facets is equal to or greater than 75 and preferably is 100.