Patents Issued in March 31, 2009
  • Patent number: 7510857
    Abstract: A Clostridium thermocellum thermostable cellulase enzyme with both endocellulase activity and exocellulase activity that is able to degrade cellulose in the absence of scaffolding and other cellulosomic proteins is provided. The use of the enzyme to degrade cellulosic materials to soluble sugars is also provided.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: March 31, 2009
    Assignee: C5-6 Technologies, Inc.
    Inventor: Phillip Brumm
  • Patent number: 7510858
    Abstract: IRAK 1c [Interleukin-1 Receptor-Associated Kinase 1c] splice variants and their preparation and use are described. The splice variants may be used in drug screening assays and methods for diagnosing medical conditions mediated by IRAK 1c-modulating activity.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: March 31, 2009
    Assignee: Janssen Pharmaceutica N.V.
    Inventors: Wai-Ping Leung, Navin Rao
  • Patent number: 7510859
    Abstract: The invention relates to novel perhydrolases, derived from the protease Carlsberg by amino acid exchange in positions 11, 15, 21, 38, 50, 54, 58, 77, 83, 89, 93, 96, 107, 117, 120, 134, 135, 136, 140, 147, 150, 154, 155, 160, 161, 171, 179, 180, 181, 194, 205, 208, 213, 216, 217, 238, 239, 251, 253, 257, and/or 261. The invention further relates to methods for production of said novel perhydrolases, products comprising said novel perhydrolases, particularly bodycare, haircare, shampoo, hair-dyeing, hair-bleaching, oral-care, dental-dare, dental-prosthesis-care, cosmetic, therapeutic (textile) washing, cleaning, rinsing, handwash, washing-up and dish-washing products, and corresponding applications of said novel perhydrolases.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: March 31, 2009
    Assignee: Henkel Kommanditgesellschaft Auf Aktien
    Inventors: Susanne Wieland, Laura Polanyi-Bald, Inken Prueser, Regina Stehr, Karl-Heinz Maurer
  • Patent number: 7510860
    Abstract: The present invention provides a xylanase, or a modified xylanase enzyme comprising at least one substituted amino acid residue at a position selected from the group consisting of amino acid 11, 116, 118, 144 and 161, the position determined from sequence alignment of the modified xylanase with Trichoderma reesei xylanase II amino acid sequence. The xylanases described herein exhibit improved thermophilicity, alkalophilicity, expression efficiency, or a combination thereof, in comparison to a corresponding native xylanase.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: March 31, 2009
    Assignee: National Research Council of Canada
    Inventor: Wing L. Sung
  • Patent number: 7510861
    Abstract: A novel gluconate dehydratase derived from Achromobacter xylosoxidans and a gene encoding the gluconate dehydratase are provided. By reacting the gluconate dehydratase or a transformed cell containing the gene with an aldonic acid, the corresponding 2-keto-3-deoxyaldonic acid can be efficiently produced.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: March 31, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hitoki Miyake, Toshifumi Yamaki, Toshihiro Oikawa, Takeshi Nakamura, Hiroki Ishibashi, Yasushi Fukuiri, Atsushi Sakuma, Hironori Komatsu, Tomoyuki Ando, Kazuhiko Togashi, Hideki Umetani
  • Patent number: 7510862
    Abstract: Described is a polynucleotide molecule being a fragment of a polynucleotide sequence of an infectious human endogenous retrovirus, said polynucleotide molecule comprising a sequence selected from the group consisting of (a) a sequence with at least 98%, preferably 99%, still preferred 99.5%, identity to a sequence according to SEQ ID No 1, (b) a sequence which hybridises under stringent conditions with a nucleotide sequence according to said SEQ ID No 1, (c) a sequence which differs from said sequences (a) or (b) due to degeneration of the genetic code and (d) a sequence comprising sequences inserted into vectors pCR4-Topo and deposited as “MERV-env”, “MERV-gag”, “MERV-prt” and “MERV-pol” at the DSMZ on 26 Sep. 2001 or fragments thereof.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: March 31, 2009
    Assignee: Avir Green Hills Biotechnology Research Development Trade AG
    Inventors: Klaus Wolff, Hubert Pehamberger, Andreas Grassauer, Thomas Muster
  • Patent number: 7510863
    Abstract: The present invention is directed to novel avian pneumovirus strain Colorado (APV/CO) genes and intergenic sequences. Also disclosed are methods of making recombinant avian pneumovirus and live-attenuated APV/CO. Further disclosed are methods of diagnosing avian pneumovirus.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: March 31, 2009
    Assignee: University of Maryland, College Park
    Inventors: Siba K. Samal, Govindarajan Dhanasekaran
  • Patent number: 7510864
    Abstract: This invention fills several voids in bioreactor technology that allows efficient connection of aspects of physical science (optics, electronics, physical chemistry, sensors) to aspects of microbial and cell culture physiology in a uniquely interactive manner. This is accomplished mathematically through decision making software that utilizes detected changes in the course of fermentation. Decisions are aimed at determining the optima for cellular growth, optimizing for production or degradation of metabolites or substrates, or determining the limits of growth under various combinations of conditions. The invention determines optima or limits in a manner more quickly and at less cost than traditional methods. The basis for the computer generated decisions may be first or second derivative changes observed such as inflection points, limits on allowable rates of change, or the like. The most common measured parameter controlling the decision making process is the optically observed growth of the cells (e.g.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: March 31, 2009
    Inventors: Micah I. Krichevsky, Steven A. Seiden, Louis W. Seiden, Sam Butz, Marc J. Epstein
  • Patent number: 7510865
    Abstract: Provided are a sensing switch and a sensing method using the same. The sensing switch includes: a substrate; a supporter on the substrate; a sensing plate that is connected to a side of the supporter and is in parallel with the substrate by a predetermined distance; a receptor binding region on an upper surface of an end portion of the sensing plate; an electric or magnetic field generation device that induces deflection of the sensing plate when a receptor bound to the receptor binding region is selectively bound to an electrically or magnetically active ligand; and a pair of switching electrodes that are separated by a predetermined distance and is connected when the sensing plate contacts the substrate due to the deflection of the sensing plate. A target material need not be labelled, a signal processing of a fluorescent or electrical detection signal using an analysis apparatus is not required, and a signal can be directly decoded by confirming whether a current flows through the switch.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: March 31, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyu-tae Yoo, Joon-ho Kim, Jun-hong Min, Sung-ouk Jung, Ji-na Namgoong, Kui-hyun Kim, Jeo-young Shim, Kak Namkoong
  • Patent number: 7510866
    Abstract: A hybrid bioreactor for cell culture is disclosed. To simultaneously apply compressive strain for cell differentiation and shear strain for cell proliferation to cells, the hybrid bioreactor includes a plurality of reactor tube assemblies (100), a compressive strain motor (5), a shear strain motor (25), a lower anchor mount (20) having a plurality of toothed anchors (70) to respectively anchor the lower ends of the reactor tube assemblies (100) to the lower anchor mount (20), a ball screw (90) operated in conjunction with the compressive strain motor (5), an upper anchor mount (60) which engages with the ball screw (90) to vertically move upward and downward and having a plurality of compressive strain anchors (80) to anchor the upper ends of the reactor tube assemblies (100) to the upper anchor mount (60), a power transmission unit to transmit the rotating force of the shear strain motor (25) to the toothed anchors (70).
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: March 31, 2009
    Assignee: Korea Institute of Science and Technology
    Inventors: Kuiwon Choi, Tae Soo Bae, Jung Kyu Kim, Chang Yang Lee
  • Patent number: 7510867
    Abstract: The present invention provides a series of novel dystrophin minigenes that retain the essential biological functions. The expression of the dystrophin minigenes may be controlled by a regulatory element along with a small polyadenylation signal. The entire gene expression cassettes may be readily packaged into a viral vector, preferably an AAV vector. The present invention further defines the minimal functional domains of dystrophin and provides ways to optimize and create new versions of dystrophin minigenes. Finally, the present invention provides a method of treatment for Duchenne muscular dystrophy (DMD) and Becker muscular dystrophy (BMD).
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: March 31, 2009
    Assignee: Asklepios Biopharmaceutical Inc.
    Inventor: Xiao Xiao
  • Patent number: 7510868
    Abstract: The present invention relates to oncolytic adenoviruses having therapeutic applications. Recombinant chimeric adenoviruses, and methods to produce them are provided. The chimeric adenoviruses of the invention comprise nucleic acid sequences derived from adenoviral serotypes classified within the subgroups B through F and demonstrate an enhanced therapeutic index.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: March 31, 2009
    Inventors: Paul Harden, Terry Hermiston, Irene Kuhn
  • Patent number: 7510869
    Abstract: This invention provides a series of low-copy number plasmids comprising restriction endonuclease recognition sites useful for cloning at least three different genes or operons, each flanked by a terminator sequence, the plasmids containing variants of glucose isomerase promoters for varying levels of protein expression. The materials and methods are useful for genetic engineering in microorganisms, especially where multiple genetic insertions are sought.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: March 31, 2009
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Mark S. Payne, Stephen K. Picataggio, Amy Kuang-Hsu, Ramesh Velayudhan Nair, Fernado Valle, Philippe Soucaille, Donald Eugene Trimbur
  • Patent number: 7510870
    Abstract: Stem cells modified to express activated form of STAT3 by genetic modification or protein delivery, and stem cells co-cultured with cells expressing activated form of STAT3 exhibit increased ex-vivo expansion and enhanced in-vivo regeneration accompanied by net increase in stem cell self-renewal as compared to control group.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: March 31, 2009
    Assignees: Industry-Academic Cooperation Foundation,, The Catholic University of Korea
    Inventor: Il-Hoan Oh
  • Patent number: 7510871
    Abstract: The present invention relates to methods and reagents for drug screening. Screening methods are disclosed employing neuronal cells that have been treated so as to exhibit characteristics associated with a re-entry into the cell cycle. One treatment approach comprises transfection of neuronal cells with an expression vector comprising one or more oncogenes.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: March 31, 2009
    Assignee: Case Western Reserve University
    Inventors: Mark A. Smith, Andrew McShea
  • Patent number: 7510872
    Abstract: The present invention relates to methods and materials for recombinant adeno-associated virus production. More particularly, the invention relates to use of recombinant adenovirus encoding adeno-associated virus protein in recombinant adeno-associated virus production methods.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: March 31, 2009
    Assignee: Nationwide Children's Hospital
    Inventors: Kelly Reed Clark, Philip Rudolph Johnson, Jr.
  • Patent number: 7510873
    Abstract: Cells derived from human umbilical cords are disclosed along with methods for their therapeutic use. Isolation techniques, culture methods and detailed characterization of the cells with respect to their cell surface markers, gene expression, and their secretion of trophic factors are described.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: March 31, 2009
    Assignee: Ethicon, Incorporated
    Inventors: Sanjay Mistry, Anthony J. Kihm, Ian Ross Harris, Alexander M. Harmon, Darin J. Messina, Chin-Feng Yi, Anna Gosiewska
  • Patent number: 7510874
    Abstract: A line of cultured mammalian cells includes HERG1b subunits and optionally HERG1a subunits.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: March 31, 2009
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Gail A. Robertson, Eugenia M. Jones, Jinling Wang
  • Patent number: 7510875
    Abstract: The present invention addresses the need to improve the yields of viral vectors when grown in cell culture systems. In particular, it has been demonstrated that for adenovirus, the use of low-medium perfusion rates in an attached cell culture system provides for improved yields. In other embodiments, the inventors have shown that there is improved Ad-p53 production with cells grown in serum-free conditions, and in particular in serum-free suspension culture. Also important to the increase of yields is the use of detergent lysis. Combination of these aspects of the invention permits purification of virus by a single chromatography step that results in purified virus of the same quality as preparations from double CsCl banding using an ultracentrifuge.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: March 31, 2009
    Assignee: Introgen Therapuetics, Inc.
    Inventors: Shuyuan Zhang, Capucine Thwin, Zheng Wu, Toohyon Cho, Deborah Wilson, Lucetta Caston
  • Patent number: 7510876
    Abstract: Disclosed herein are cell cultures comprising definitive endoderm cells and methods of producing the same. Also disclosed herein are cell populations comprising substantially purified definitive endoderm cells as well as methods for enriching, isolating and purifying definitive endoderm cells from other cell types.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: March 31, 2009
    Assignee: Cythera, Inc.
    Inventors: Kevin Allen D'Amour, Alan D. Agulnick, Emmanuel E. Baetge
  • Patent number: 7510877
    Abstract: The present invention relates to methods of identifying, collecting and isolating hematopoietic stem cells (HSCs) and compositions of purified HSCs. Specifically, the present invention provides methods of isolating and purifying CD150+ HSCs, CD48? HSCs, and CD244? HSCs. The present invention also relates to purified cell samples with enriched CD150+ HSCs, CD48? HSCs, and CD244? HSCs populations, as well as methods of treating subjects with such compositions.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: March 31, 2009
    Assignee: The Regents of the University of Michigan
    Inventors: Omer H. Yilmaz, Mark J. Kiel, Sean Morrison, Toshihide Iwashita
  • Patent number: 7510878
    Abstract: The invention provides nucleic acids, and variants and fragments thereof, obtained from strains of Bacillus thuringiensis encoding polypeptides having pesticidal activity against insect pests, including Lepidoptera. Particular embodiments of the invention provide isolated nucleic acids encoding pesticidal proteins, pesticidal compositions, DNA constructs, and transformed microorganisms and plants comprising a nucleic acid of the embodiments. These compositions find use in methods for controlling pests, especially plant pests.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: March 31, 2009
    Assignee: Pioneer Hi-Bred International, Inc.
    Inventors: Andre R. Abad, Hua Dong, Sue B. Lo, Xiaomei Shi
  • Patent number: 7510879
    Abstract: Described are determination procedures for fibrinogen and/or fibrinogen-derivatives by matrix-independent turbidimetry. In the FIFTA called procedure the fibrinogen activity is preferably determined in an undiluted sample by addition of thrombin and/or albumin, as well as polybrene if appropriate, in PBS and determination of the increase in absorbance at 405 nm. In the FIATA called procedure the fibrinogen-concentration and/or the concentration of fibrinogen-derivatives is preferably determined by addition of vancomycin and determination of the increase in turbidity at 405 nm. It is standardized by usage of plasma standards of known fibrinogen-activity and/or fibrinogen-concentration.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: March 31, 2009
    Inventor: Thomas W. Stief
  • Patent number: 7510880
    Abstract: A method for determination of at least one of the lipid species in a biological sample comprising subjecting the sample to lipid extraction to obtain a lipid extract and subjecting the resulting lipid extract to multidimensional electrospray ionization mass spectrometry using either precursor ion or neutral loss scanning (or both) of all naturally occurring aliphatic chains, lipid fragments and precursor ions leading to observed fragments to generate a multidimensional matrix whose contour densities provides structural and quantitative information directly without chromatography. A method for determination of lipid content and/or lipid molecular species composition and quantity directly from lipid extracts of a biological sample comprising subjecting said lipid extract to electrospray ionization multidimensional mass spectrometry by comparisons to standards and algorithms described herein.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: March 31, 2009
    Inventors: Richard W. Gross, Xianlin Han
  • Patent number: 7510881
    Abstract: A method and kit for quantitatively and/or qualitatively detecting one or more components in samples, including the use of metal-particle labelled reagents and an antibody conjugate are disclosed. The components are capable of binding to a probe. A kit and method for staining components in cell and tissue sections, based upon the detection method, are also disclosed.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: March 31, 2009
    Inventors: Marc Ramael, Jean-Paul Sanders
  • Patent number: 7510882
    Abstract: In a method for analysis biomolecules (3) attached to a solid surface of a substrate (1) are used for detecting the presence of analytes (4) in a sample by binding of the analytes to the biomolecules. The biomolecules (3) are attached directly to the surface of the substrate together with biomolecule-repellent molecules (5), which cover the surface between the biomolecules (3) to prevent nonspecific binding of analytes (4) and other biomolecules. The invention relates also to a biosensor where biomolecules (3) are attached directly to the substrate (1) together with biomolecule-repellent molecules (5), which cover the surface between the biomolecules (3) to prevent non-specific binding of analytes (4) and other biomolecules. The biomolecules (5) can be self-assembled hydrophilic polymers. One example of using the invention is immunological analysis using surface plasmon resonance (SPR).
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: March 31, 2009
    Assignee: Bionavis Ltd.
    Inventors: Inger Vikholm, Janusz Sadowski
  • Patent number: 7510883
    Abstract: Techniques of sensing a temperature of a heat source disposed in a substrate of an integrated circuit are provided. According to one exemplary method, a Magnetic Tunnel Junction (“MTJ”) temperature sensor is provided over the heat source. The MTJ temperature sensor comprises an MTJ core configured to output a current during operation thereof. The value of the current varies based on a resistance value of the particular MTJ core. The resistance value of the MTJ core varies as a function of the temperature of the heat source. A value of the current of the MTJ core can then be associated with a corresponding temperature of the heat source.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: March 31, 2009
    Assignee: EverSpin Technologies, Inc.
    Inventors: Young Sir Chung, Robert W. Baird, Mark A. Durlam
  • Patent number: 7510884
    Abstract: A semiconductor manufacturing apparatus according to the present invention comprises: a treating unit that treats a substrate to manufacture thereon a semiconductor device; a fluid supplying channel for supplying a fluid required for a treatment of the substrate to the treating unit; a set voltage outputting unit that outputs a set voltage corresponding to a set flow volume of the fluid; a massflow controller disposed on the fluid supplying channel, that controls a flow volume of the fluid based on the set voltage; a first shut-off valve disposed on the fluid supplying channel on an upstream side of the massflow controller; and a second shut-off valve disposed on the fluid supplying channel on a downstream side of the massflow controller.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: March 31, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Tsuneyuki Okabe, Kengo Kaneko
  • Patent number: 7510885
    Abstract: A method of preparing a plurality of electrically connected organic optoelectronic devices on a substrate comprising firstly preparing a plurality of organic optoelectronic devices on a substrate, by the steps of providing a patterned layer of a first conductive material over the substrate, providing layer of organic optoelectronic material over the layer of first conductive material and providing a patterned layer of a second conductive material over the layer of organic optoelectronic material, at least partially removing regions of the organic optoelectronic material which are not covered by the patterned layer of second conductive material and secondly providing electrical connections to electrically connect at least two of the plurality of organic optoelectronic devices. The organic optoelectronic devices are suitably organic photovoltaic devices or organic electroluminescent devices.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: March 31, 2009
    Assignee: Cambridge Display Technology Limited
    Inventors: Jonathan Halls, Richard Wilson
  • Patent number: 7510886
    Abstract: A method of manufacturing a semiconductor photodetector having spectral sensitivity close to relative luminous characteristics at low cost includes steps of sealing a light receiving surface side of a semiconductor light receiving element having high spectral sensitivity in wavelengths from the visible light region to infrared region with a sealing resin, a semiconductor photodetector is made by preparing dispersion liquid by dispersing micro particles having infrared blocking characteristics not more than 100 nm in toluene, preparing a sealing resin by mixing the dispersion liquid in a transparent resin, sealing the semiconductor light receiving element with the resin, removing toluene in the sealing resin by defoaming and hardening sealing resin thereafter.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: March 31, 2009
    Assignee: New Japan Radio Co., Ltd.
    Inventors: Fumio Takamura, Haruo Fukawa
  • Patent number: 7510887
    Abstract: This semiconductor laser device has the same structure as the conventional broad-area type semiconductor laser device, except that both side regions of light emission areas of active and clad layers are two-dimensional-photonic-crystallized. The two-dimensional photonic crystal formed on both side regions of the light emission area is the crystal having the property that 780 nm laser light cannot be wave-guided in a resonator direction parallel to a striped ridge within the region. The light traveling in the direction can exist only in the light emission area sandwiched between two photonic crystal regions, which results in the light laterally confined by the photonic crystal region. The optical confinement of the region suppresses the loss in the light at both edges of the stripe serving as the boundary of the optical confinement, which reduces the curve of wave surface and uniforms the light intensity distributions of NFP and FFP.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: March 31, 2009
    Assignee: Sony Corporation
    Inventors: Tsunenori Asatsuma, Shoji Hirata
  • Patent number: 7510888
    Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: March 31, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Ewald Karl Michael Guenther, Günter Waitl, Herbert Brunner, Jörg Strauss
  • Patent number: 7510889
    Abstract: A method for manufacturing a light emitting chip package includes bonding a patterned metal plate having at least a thermal enhanced plate and many contacts around the same to a substrate and bonding a film-like circuit layer to the patterned metal plate. Many conductive wires are formed to connect the film-like circuit layer and the contacts. Thereafter, at least a first molding is formed on the substrate to encapsulate the patterned metal plate, the conductive wires and a portion of the film-like circuit layer. At least one light emitting chip disposed on the film-like circuit layer exposed by the first molding has many bumps to which the light emitting chip and the film-like circuit layer are electrically connected. A cutting process is performed to form at least one light emitting chip package, and the substrate is removed. Therefore, heat dissipation efficiency of the light emitting chip package can be improved.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: March 31, 2009
    Assignee: ChipMOS Technologies Inc.
    Inventors: Yu-Tang Pan, Shih-Wen Chou, Men-Shew Liu
  • Patent number: 7510890
    Abstract: A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large part of said electromagnetic radiation being coupled out via the radiation coupling-out area. A luminescence conversion material is arranged downstream of the radiation coupling-out area in an emission direction of the semiconductor body. A radiation-transmissive covering body having a first main area, a second main area opposite to the first main area, and also side areas connecting the first and second main areas. The covering body is applied to the radiation coupling-out area of the semiconductor layer sequence in such a way that the first main area faces the radiation coupling-out area.
    Type: Grant
    Filed: November 1, 2004
    Date of Patent: March 31, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Hubert Ott, Stefan Grötsch, Herbert Brunner
  • Patent number: 7510891
    Abstract: A method of manufacturing an organic light emitting display device and the organic light emitting display device which reduces generation of dark spots by particles are disclosed.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: March 31, 2009
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Pil-Geun Chun, Eun-Ah Kim
  • Patent number: 7510892
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: March 31, 2009
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Patent number: 7510893
    Abstract: In a wiring manufacturing process which uses conventional photolithography, most of resist and wiring material, or process gas which is necessary at the time of plasma processing, etc. is wasted. Also, since air discharging means such as a vacuum equipment is necessary, an entire apparatus grows in size, and therefore, it has been a problem that production cost increases with growing in size of a processing substrate. In this invention, applied is such means that droplets are used for resist and wiring material, and they are emitted directly to a necessary place on the substrate in a line form or a dot form, to draw a pattern. Also, applied is means which carries out a gas reaction process such as ashing and etching, under atmospheric pressure or the vicinity of atmospheric pressure.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: March 31, 2009
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Kunio Hosoya
  • Patent number: 7510894
    Abstract: In producing an integrated sensor, regions of silicon between compensating electronics and a sensor are electrically isolated, while the sensor is delineating and released. The described process can be performed at the end of a fabrication process after electronics processing (i.e., CMOS processing) and compensating electronics are formed. In an aspect, the sensor and a conductive bridge are simultaneously developed from a silicon-on-insulator (SOI) substrate. In an aspect, the sensor is undercut from a silicon substrate utilizing a lateral etch. A cavity is concurrently defined by the same lateral etch in the silicon layer, forming the conductive bridge connecting the sensor to a logic component. An isolation trench is defined in the silicon layer between the sensor components and the logic component. A polymer masks vertical surfaces from the lateral etch, and an insulator layer and photosensitive film mask horizontal surfaces from the lateral etch.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: March 31, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: John C. Christenson, Dan W. Chilcott
  • Patent number: 7510895
    Abstract: A system manages the temperature of thermoplastic material by initiating a default heating cycle in response to a sensor failure. The system may thus continue to heat the thermoplastic material according to the default heating cycle until the sensor can be repaired or replaced. A system controller implements the default heating cycle using a stored profile. That is, the controller causes a heating element to generate heat according to a default heating profile retrieved from a memory. The profile may be determined using historical heating data, user input and/or a factory setting.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: March 31, 2009
    Assignee: Nordson Corporation
    Inventor: John M. Raterman
  • Patent number: 7510896
    Abstract: Disclosed are a CMOS image sensor and a method for manufacturing the same, capable of improving the characteristics of the image sensor by increasing junction capacitance of a floating diffusion area. The CMOS image sensor generally includes a photodiode and a plurality of transistors (e.g., transfer, reset, drive, and select transistors), a first conductive type semiconductor substrate, having an active area including a photodiode area, a floating diffusion area, and a voltage input/output area, a gate electrode of each transistor on the active area, a first conductive type first well area in the semiconductor substrate corresponding to the voltage input/output area, a first conductive type second well area in the semiconductor substrate corresponding to the floating diffusion area, and a second conductive type diffusion area in the semiconductor substrate at opposed sides of each gate electrode.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: March 31, 2009
    Assignee: Dongbu Electronics Co., Ltd.
    Inventor: In Gyun Jeon
  • Patent number: 7510897
    Abstract: A pinned photodiode with a pinned surface layer formed by a self-aligned angled implant is disclosed. The angle of the implant may be tailored to provide an adequate offset between the pinned surface layer and an electrically active area of a transfer gate of the pixel sensor cell. The pinned surface layer is formed by employing the same mask level as the one employed for the formation of the photodiode region, and then implanting dopants at angles other than zero degrees.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: March 31, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Chandra Mouli, Howard Rhodes
  • Patent number: 7510898
    Abstract: A manufacturing method of manufacturing an image display device having a wiring and a display element electrically connected to the wiring, comprising a step of dividing a device having the wiring and a substrate holding the wiring, at a predetermined division position, wherein the dividing step comprises a step of dividing the substrate at the predetermined division position and a step of dividing the wiring at the predetermined division position. The step of dividing the wiring is executed in a method different from a method in the step of dividing the substrate. Thus, the device constituting the image display device can be suitably divided.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: March 31, 2009
    Assignees: Canon Kabushiki Kaisha, Kabushiki Kaisha Toshiba
    Inventors: Takeshi Miyachi, Masaaki Furuya
  • Patent number: 7510899
    Abstract: A method for fabricating a CMOS image sensor includes providing a substrate having a sensor array region and a peripheral region defined thereon, forming at least a contact pad on the substrate of the peripheral region, forming a first dielectric layer covering the contact pad on the substrate, performing a first etching process to expose the contact pad and to form a step height, forming an optical shielding layer on the first dielectric layer, forming a plurality of color filters on the first dielectric layer, sequentially forming a planarizing layer and a plurality of micro-lenses on the first dielectric layer.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: March 31, 2009
    Assignee: United Microelectronics Corp.
    Inventor: Ching-Hung Kao
  • Patent number: 7510900
    Abstract: A pinned photodiode, which is a double pinned photodiode having increased electron capacitance, and a method for forming the same are disclosed. The invention provides a pinned photodiode structure comprising a substrate base over which is a first layer of semiconductor material. There is a base layer of a first conductivity type, wherein the base layer of a first conductivity type is the substrate base or is a doped layer over the substrate base. At least one doped region of a second conductivity type is below the surface of said first layer, and extends to form a first junction with the base layer. A doped surface layer of a first conductivity type is over the at least one region of a second conductivity type and forms a second junction with said at least one region of a second conductivity type.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: March 31, 2009
    Assignee: Aptina Imaging Corporation
    Inventor: Inna Patrick
  • Patent number: 7510901
    Abstract: With a conventional cylindrical can method, a region used as a film formation ground electrode is a portion of the cylindrical can, and an apparatus becomes larger in size in proportion to the surface area of the electrode. A conveyor device and a film formation apparatus having the conveyor device are provided, which have a unit for continuously conveying a flexible substrate from one end to the other end, and which are characterized in that a plurality of cylindrical rollers are provided between the one end and the other end along an arc with a radius R, the cylindrical rollers being arranged such that their center axes run parallel to each other, and that a mechanism for conveying the flexible substrate while the substrate is in contact with each of the plurality of cylindrical rollers is provided.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: March 31, 2009
    Assignees: Semiconductor Energy Laboratory Co., Ltd., TDK Corporation
    Inventors: Masato Yonezawa, Naoto Kusumoto, Hisato Shinohara
  • Patent number: 7510902
    Abstract: The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with conductive material. In addition, electrode pads are connected to solder balls via a metal wiring pattern arranged on a second surface of the image sensor chip. As a result, the present invention can provide further miniaturized and thinned image sensor chip packages, reduce fabricating processes, and improve device performance and reliability.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: March 31, 2009
    Assignee: Dongbu Electronics Co., Ltd.
    Inventor: Byoung Young Kang
  • Patent number: 7510903
    Abstract: A bi-directional transient voltage suppression (“TVS”) device (101) includes a semiconductor die (201) that has a first avalanche diode (103) in series with a first rectifier diode (104) connected cathode to cathode, electrically coupled in an anti-parallel configuration with a second avalanche diode (105) in series with a second rectifier diode (106) also connected cathode to cathode. All the diodes of the TVS device are on a single semiconductor substrate (301). The die has a low resistivity buried diffused layer (303) having a first conductivity type disposed between a semiconductor substrate (301) having the opposite conductivity type and a high resistivity epitaxial layer (305) having the first conductivity type. The buried diffused layer shunts most of a transient current away from a portion of the epitaxial layer between the first avalanche diode and the first rectifier diode, thereby reducing the clamping voltage relative to the breakdown voltage.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: March 31, 2009
    Assignee: Protek Devices LP
    Inventors: Fred Matteson, Venkatesh P. Pai, Donald K. Cartmell
  • Patent number: 7510904
    Abstract: The invention addresses the problem of creating a high-speed, high-efficiency photodetector that is compatible with Si CMOS technology. The structure consists of a Ge absorbing layer on a thin SOI substrate, and utilizes isolation regions, alternating n- and p-type contacts, and low-resistance surface electrodes. The device achieves high bandwidth by utilizing a buried insulating layer to isolate carriers generated in the underlying substrate, high quantum efficiency over a broad spectrum by utilizing a Ge absorbing layer, low voltage operation by utilizing thin a absorbing layer and narrow electrode spacings, and compatibility with CMOS devices by virtue of its planar structure and use of a group IV absorbing material. The method for fabricating the photodetector uses direct growth of Ge on thin SOI or an epitaxial oxide, and subsequent thermal annealing to achieve a high-quality absorbing layer.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: March 31, 2009
    Assignee: International Business Machines Corporation
    Inventors: Jack O. Chu, Gabriel K. Dehlinger, Alfred Grill, Steven J. Koester, Qiqing Ouyang, Jeremy D. Schaub
  • Patent number: 7510905
    Abstract: When forming a contact hole by a conventional manufacturing step of a semiconductor device, a resist is required to be formed on almost entire surface of a substrate so as to be applied on a film other than an area in which a contact hole is to be formed, leading to drastically reduced throughput. According to a forming method of a contact hole and a manufacturing method of a semiconductor device, an EL display device and a liquid crystal display device of the invention, an island shape organic film is selectively formed over a semiconductor layer, a conductive layer or an insulating layer, and an insulating film is formed around the island shape organic film to form a contact hole. Therefore, a conventional patterning using a resist is not required, and high throughput and low cost can be achieved.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: March 31, 2009
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Gen Fujii, Hiroko Shiroguchi
  • Patent number: 7510906
    Abstract: A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: March 31, 2009
    Assignee: Kinik Company
    Inventors: Hsiao-Kuo Chang, Jen-Sheuan Huang, Chih-Peng Chen, Na-Ling Chen, Shih-Pang Wen