Abstract: A semiconductor package including at least a sensing component and a shielding layer is provided. While the shielding layer disposed over the molding compound can protect the semiconductor package from EMI radiations, the sensing component of the package is not blocked by the shielding layer for the feasibility of receiving the sensing signal.

Abstract: A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.

Abstract: An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. A length of the first common electrode bar is substantially equal to a predetermined distance between two pads among a plurality of power or ground pads on a side of the die facing the first common electrode bar. An electronic device with the electronic package is also disclosed.

Abstract: Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.

Abstract: A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings.

Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.

Abstract: A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation.

Abstract: Embodiments of the present invention relate to a method of stiffening a semiconductor coreless package substrate to improve rigidity and resistance against warpage. An embodiment of the method comprises disposing a sacrificial mask on a plurality of contact pads on a second level interconnect (package-to-board interconnect) side of a coreless package substrate, forming a molded stiffener around the sacrificial mask without increasing the effective thickness of the substrate, and removing the sacrificial mask to form a plurality of cavities in the molded stiffener corresponding to the contact pads. Embodiments also include plating the surface of the contact pads and the sidewalls of the cavities in the molded cavities with an electrically conductive material.

Abstract: A chip package structure including a substrate, a plurality of electrodes, a chip, and a plurality of bumps is provided. Each of the electrodes has a bottom portion and an annular element, wherein the bottom portion is disposed on the substrate, the annular element is disposed on the bottom portion, and the bottom portion and the annular element define a containing recess. The chip is disposed above the substrate and has an active surface facing the substrate and a plurality of pads disposed on the active surface. The bumps are respectively disposed on the pads and respectively inserted into the containing recesses. The melting point of the electrodes is higher than that of the bumps. A chip package method is also provided.

Abstract: Two integrated circuits having circuitry on one of their major surfaces are ground on their opposite major surfaces to reduce their thickness. The ground integrated circuits are then adhered together to form a composite body and placed in a chamber formed within a substrate such as a printed circuit board. Electrical connections are formed between contacts of the integrated circuits and contacts of the substrate. Components may be mounted on the outer surfaces of the substrate.

Abstract: A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge.

Abstract: Implementations of encapsulated nanowires are disclosed.

Abstract: A semiconductor module is of a structure such that a wiring layer, an insulating resin layer and a semiconductor device are stacked in this order by bonding them together with compression. In the wiring layer, bump electrodes each having a base and a tip portion are provided in positions corresponding respectively to device electrodes of the semiconductor device. The bump electrodes penetrate the insulating resin layer and are electrically coupled to the corresponding device electrodes.

Abstract: In order to provide a wafer level semiconductor device, a protection film and a stress buffer layer are formed on a metal wiring formed on a semiconductor element, a via-hole that passes through the protection film and the stress buffer layer is formed so as to expose the metal wiring, and a bump electrode is formed on a conductive layer that fills the via-hole.

Abstract: A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.

Abstract: Provided is a feeding method for feeding conductive balls to the insides of through holes of a mask reliably and efficiently so as to match a fine pitch. In the feeding method, a head (300), which can move over the surface of a feeding mask (200) and which is caused to give a directivity to micro balls (340) by a squeezee (310) for rotating around a feed port (320) to be fed with the micro balls (340), is used to feed the micro balls (340) to the insides of a plurality of through holes (210) formed in the feeding mask (200). At this time, the head (300) is moved while being oscillated, to feed the micro balls (340) to the insides of the through holes (210) while improving the probability, on which the micro balls (340) meet the through holes (210) of the feeding mask (200).

Abstract: A semiconductor device comprising a wiring suitable for miniaturization and manufacturing method thereof are disclosed. According to one aspect of the present invention, it is provided a semiconductor device comprising an insulator formed above a semiconductor substrate, and a wiring formed in the insulator and having surface roughness capable of suppressing surface scattering of electrons and reduction in electrical conductivity thereof.

Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

Abstract: The present invention provides a method of fabricating an interconnect structure in which a patternable low-k material replaces the need for utilizing a separate photoresist and a dielectric material. Specifically, this invention relates to a simplified method of fabricating single-damascene and dual-damascene low-k interconnect structures with at least one patternable low-k dielectric and at least one inorganic antireflective coating. In general terms, a method is provided that includes providing at least one patternable low-k material on a surface of an inorganic antireflective coating that is located atop a substrate. The inorganic ARC is liquid deposited and comprises a polymer that has at least one monomer unit comprising the formula M-R1 wherein M is at least one of Si, Ge, B, Sn, Fe, Ta, Ti, Ni, Hf and La and R1 is a chromophore. At least one interconnect pattern is formed within the at least one patternable low-k material and thereafter the at least one patternable low-k material is cured.

Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

Abstract: A semiconductor package structure is disclosed. The semiconductor package structure includes semiconductor chips on a semiconductor substrate. Each of the semiconductor chips includes chip pads. Through-vias extend through each of the semiconductor chips. Redistribution structures and a chip selection interconnection line are disposed on each of the semiconductor chips. The redistribution structures electrically connect at least one of the through-vias with at least one of the chip pads. Each chip selection interconnection line includes first regions connected to a corresponding number of the through-vias and a second region connecting at least one of the first regions with one of the chip pads. The semiconductor chips are stacked and electrically connected using the through-vias.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.

Abstract: After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently, the capillary is moved upward and then toward the lead until the face portion of the capillary is positioned above the ball neck, thereby a wire is folded back toward the lead. Then, the capillary is moved downward such that a side of the wire is pressed by the capillary against the ball neck that has been trodden on. After the capillary is moved obliquely upward toward the lead and then looped toward the lead, the wire is pressure-bonded to the lead.

Abstract: Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a side and forming a polymer layer on the side. The polymer layer has a central portion and a first frame portion spatially separated from the central portion to define a first channel.

Abstract: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3?,4?-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3?,4?-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4?-hydroxydiphenylsulfone, 4,4?-diamino-3,3?5,5?-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor devic

Abstract: A wafer level chip scale package and method of laser marking the same are disclosed. The method includes forming a plurality of semiconductor devices on a frontside surface of a wafer, metallizing device contacts on the frontside surface of the wafer, grinding the backside surface of the wafer, silicon etching the backside surface of the wafer, laser marking the backside surface of the wafer following the silicon etch step, oxide etching the backside surface of the wafer following the laser marking step, depositing a metal layer on the backside surface of the wafer following the oxide etch step, and dicing the wafer into wafer level chip scale packages.

Abstract: A method and apparatus includes an integrated circuit device, and at least one alignment mark on the integrated circuit device, the alignment mark comprises a first coded region, a second coded region adjacent the first coded region, and a third coded region adjacent the second coded region, the second coded region located between the first coded region and the third coded region, and markings on the first coded region and the third coded region being identical.

Abstract: A submersible aerator has an impeller which includes blades having partition walls which separate liquid passages and air passages and which is accommodated within a guide casing for rotation between a lower surface of an intermediate plate having an air suction opening and an upper surface of a suction cover having a liquid suction opening. The liquid passages and the air passages meet through communication portions at radially outer ends of rear-side blade partition walls. Intermediate blades are provided at radially outer ends of the liquid passages. A conical space is defined between the blade lower end surfaces and the suction cover upper surface such that the space, which is wide at a portion adjacent to the liquid suction opening, becomes narrower toward a radially outward region including guide vane tongues. A plurality of support legs and a plurality of straining projections are integrally formed on the lower surface of a peripheral portion of a bottom wall of the guide casing.

Abstract: A humidification system includes a humidifier housing mountable to the air duct. The humidifier housing has an opening to provide fluid communications between the humidifier housing and the air circulation system. An air inlet extends through the duct opening into the humidifier housing. A duct damper extends into the air duct and is reversibly positionable between a stowed position and a deployed position. The stowed position is characterized by placement of the duct damper substantially adjacent to the humidifier housing while the deployed position is characterized by positioning a portion of the duct damper deeper into the air duct. An evaporative element is positioned between the air inlet and an air outlet. A cover is configured to reverse the direction of flow air sending it to the air outlet extending into the air duct. A deploying means changes the duct damper between the stowed position and the deployed position.

Abstract: With the invention, a method and a device for explosive forming of work pieces, in which at least one work piece is arranged in at least one die and there deformed by means of an explosive to be ignited, is to be improved, in that an ignition mechanism that is technically easy to handle is produced with the shortest possible setup times, which permits the most precise possible ignition of the explosive with time-repeatable accuracy. This task is solved by a method and device, in which at least one work piece is arranged in at least one die and deformed there by means of an explosive being ignited, in which the explosive is ignited by means of at least one energy beam.

Abstract: A method and an apparatus for automatically making conglomerated structures (6).

Abstract: A magnetic coupling for an injection molding apparatus, such as a hot half or hot runner, includes a first magnetic part for connection to an actuator, a valve pin plate, or the like and a movable second magnetic part for connection to a valve pin. The first magnetic part and the second magnetic part are coupled by a magnetic force. The first magnetic part can be part of the actuator. The second magnetic part can be part of the valve pin. A valve pin plate can be provided for a plurality of valve pins.

Abstract: A damping system includes a base substrate, a constraining substrate and a non-foam damping layer between them. The base substrate has greater lateral dimensions than the constraining substrate. Consequently, the damping system is provided in a localized region of the base substrate. The damping system can be provided, for example, at a region of the base substrate where a longitudinal projection or moving linkage extends through an opening in the base substrate, such as a steering column through a dashboard panel. In this embodiment, a composite opening is provided through the damping system to accommodate the extending projection or linkage, and the damping system is effective to provide localized damping against vibrations due to the through-the-panel linkage. The damping system provides these benefits without increasing the overall thickness of the body part, and without providing damping and constraining layers across its entire lateral expanse, saving cost and weight.

Abstract: A method of producing a tubular member which includes providing at least one micro-extruder configured to extrude at least one material and providing a surface configured to accept the material extruded from the micro-extruder.

Abstract: According to a process for producing a thermoplastic resin film according to one aspect of the present invention, a molten resin, while the molten resin is discharged from a die and thereafter lands onto a cooling roller, is uniformly heated in a direction of a flow by a heater. Thereby, a thermoplastic resin film having very slight thickness unevenness in a longitudinal direction can be formed. Moreover, according to the process for producing a thermoplastic resin film, heating by the heater can reduce a viscosity of the molten resin at the time of landing, and can suppress generation of retardation at the time of landing.

Abstract: A process of producing a polyimide film including applying a polyamic acid solution composition to a substrate to form a coating layer and heating the coating layer, wherein the polyamic acid solution composition contains a mixed solvent system of at least two solvents selected from N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, and 1,3-dimethyl-2-imidazolidinone, each solvent being present in a proportion ranging from 7% to 93% based on the total mixed solvent system, and a polyamic acid composed mainly of s-BPDA and PPD. The process enables a film with a thickness exceeding 40 ?m to be formed without involving bubble formation.

Abstract: The present invention is directed to a gelastic cushion. The gelastic cushion is made from a conventional gelastic composition. The gelastic cushion has a structure having a first wall that defines an opening area and buckles when a force is applied to the first wall. When the first wall buckles a predetermined amount, a second wall, interconnected to the first wall, also buckles. The second wall decreases the chance that the first wall bottoms out. Bottoming out increases the pressure on the patient (a.k.a., the force) overlying the gelastic cushion. That increased pressure is undesirable.

Abstract: The invention relates to a method and a device for producing a magnetic field sensor (13), particularly a rotary speed and/or rotational direction sensor for the wheel rotation or for the drivetrain of a motor vehicle, wherein an electrical component (10) and the end of a connecting cable (28) are encapsulated in plastic (32) by injection molding, and a mounting tab (38) is injection molded. After a first injection process step, wherein the electrical component (10) and the connecting cable (28) are encapsulated in a core-like first molded part (30, 32), and a mounting tab (38) is injected onto the core-like insert (30) in a second injection process step in a longitudinal and/or angular position that can be prescribed. The core-like insert (30) is thereby longitudinally displaceably and/or rotatably held in the injection mold (46, 58), together with the connecting cable, whereby various positions of the insert (30) can be defined relative to the mounting tab (38).

Abstract: This element (2) is of the type including a hollow elongate body (4) made of metal and having a closed section; and a continuous second body (6) made of plastics material overmolded on the metal first body (4), the plastics material second body (6) including at least two rings (24) surrounding the metal first body (4), the rings (24) being longitudinally spaced part. In any cross-section of the metal first body (4), the plastics material second body (6) is situated entirely outside the outline of the metal first body (4), and the ratio of the axial length of each ring (24) over the longitudinal distance between the rings (24) is less than 1. The invention is applicable to the front faces of motor vehicles.

Abstract: A flexible, elastically gathered cover for food containers or the like, and a method of making such covers, uses a forming machine with a lower section having: a) a square shaped forming mandrel having a top, four substantially vertical sides, and a heating element extending longitudinally along each side, b) four elongated sealing bars having a tops with a guide and a front with an elongated strip of rubber attached, and c) a cover ejector with upwardly extending ejector pins. Each sealing bar is positioned opposite a respective side of the forming mandrel separated to create a forming groove around the mandrel. An upper section having a forming head assembly comprises: a) a forming die with sides that define a cavity sized to telescope over the forming mandrel, and b) a band ejector plate with plural downwardly extending ejector pins located along the perimeter. The forming die hangs below the band ejector plate.

Abstract: The present invention relates to a method of making mounting mats for use in pollution control device.

Abstract: A method of fabricating structural elements on the surface of a component is provided. The structural elements are configured to modify flow of a fluid passing over the surface. Conveniently, the fabrication is performed using a Direct Write technique. A three dimensional element is formed by depositing material on the surface, and subsequently curing the deposited material.

Abstract: A moulding machine for paper fibre articles has a mould (107, 1707) made from sintered particles. A measured shot of liquidised pulp is drawn through the mould using a piston (109, 1709) on the other side. The article is dried in situ with pressurised hot air. Large moulds may be fabricated by welding together sintered sections. A method of preparing the fibres is by liquidisation.

Abstract: A method of forming micro/nano channels and a method of forming micro/nano structures are provided which can easily form micro- and nano-sized channels and structures through simple processes. UV curable polymer patterns are formed on a first substrate, and the UV curable polymer patterns and a second substrate are sealed together by an electrostatic attraction. Then, a channel is formed by irradiating UV light. Also, after reversibly sealing the polymer patterns and a third substrate, prepolymer patterns are formed on the third substrate by flowing prepolymer. Then, the third is removed to form a fine structure. The nano-sized channels as well as the micro-sized channels can be formed through the substantially equal processes. Also, the reversible sealing or the irreversible sealing can be freely selected according to the coating of the curable polymer and UV irradiation time.

Abstract: According to one embodiment, in a die for manufacturing a resin stamper, the following are defined the sizes of a resin injection hole and a cut punch receiving portion of a fixed-side template, areas in which a vacuum suction hole and an air-blow hole, respectively, are formed, the diameter of a cut punch on a moving-side template, and the taper angle of the peripheral portion of a cavity.

Abstract: A process is provided for producing fibers which includes forming a plurality of bubbles on the surface of a fiber spinning solution, applying a voltage between the solution and a counter-electrode spaced apart therefrom to cause jets to extend from the bubbles to the counter-electrode, and treating the solution with a surfactant to stabilize the bubbles.

Abstract: An apparatus for forming a flange on a component is provided. The apparatus comprises a mold disposed for placement of the component thereon, a forming element configured to hold the component on the mold to facilitate formation of the flange, and a pressure element configured to cooperate with the mold to define a space therebetween. The apparatus further comprises a bladder disposed in the space and configured to impart a forming force to a portion of the component to form the flange on the component when the bladder is inflated. A method for forming a flange on a component is also presented.

Abstract: A system for cooling a hot rail of rail steel to a fine perlitic or ferritic or perlitic/ferritic structure has a plurality of separate cooling modules with independently adjustable cooling parameters. The rail is guided downstream through the modules of the cooling stretch and through intermediate zones between the modules so as to cool the surface of the rail in each of the modules and to subject the rail to destressing or stress relief between the modules. Sensors in each of the intermediate zones detect the actual surface temperature of the rail in the respective zones, and a controller connected to the modules and to the sensors varies the cooling parameters of the cooling modules in dependence on the detected temperatures in the respective upstream zones to ensure a defined temperature in the rail that lies above a critical temperature at which bainitic structure components are formed.

Abstract: A temperature measuring device for molten metal includes a porous plug with a first end and an opposed second end, an outer protective sheath with a closed end, an inner protective tube with a closed end, and a thermocouple arranged within an interior of the inner protective tube. The outer protective sheath extends away from the first end of the plug and the inner protective tube is arranged within an interior of the outer protective sheath. The porous plug comprises a substantially refractory material and the outer protective sheath consists essentially of substantially refractory metal oxide and graphite. A junction of the thermocouple is proximate to the closed end of the inner protective tube.