Patents Issued in September 16, 2010
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Publication number: 20100230121Abstract: Firefighting bucket (11) suspended from an aircraft by lines (15), has open top (12A) and a valve at base (13). The valve is attachable to the aircraft by remotely actuatable line (16) and independent movement of lines (15-16) may utilize the weight of the water to facilitate opening and closing of the valve. Dynamic sensing of a bucket attribute, e.g. weight, enables bucket (11) to be filled or discharged by a pre-determined volume by the pilot. Chemical fire retardant may be added by entraining it with water discharging from the valve.Type: ApplicationFiled: March 29, 2010Publication date: September 16, 2010Inventors: Geoff HALL, Mark Robertson
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Publication number: 20100230122Abstract: A fire extinguisher device for aircraft has a hanger structure (4) and a reservoir (3) of extinguishing agent, said reservoir being hung beneath said hanger structure by metal fittings (300, 301a, 301b) held by fasteners to said hanger structure. Said extinguisher is characterized in that the reservoir (3) has means of suspension (31) and the hanger structure (4) has carriers (41) complementary to the means of suspension (31), said means of suspension and said carriers being such that when the fasteners are withdrawn, the reservoir (3) is in a position called the “intermediate position,” in which the metal fittings (300, 301a, 301b) are free and the reservoir (3) is suspended by interaction of the means of suspension (31) and the carriers (41). The invention also relates to a method for fastening such an extinguishing device.Type: ApplicationFiled: March 5, 2010Publication date: September 16, 2010Applicant: AIRBUS OPERATIONS (SOCIETE PAR ACTIONS SIMPLIFIEE)Inventors: Stéphane MACHADO, Frédéric ROSSI, Julien CAYSSIALS, Nicolas VOYER
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Publication number: 20100230123Abstract: An arrangement for setting variable operating elevation for a hand-held powered tool capable of generating a rotational motion and employed to manipulate a combination turbo garden tiller and a grass trimmer apparatus includes at least one elongated rod like member engageable at a first end thereof with threaded end of the apparatus and engageable at an opposed second end thereof with the powered tool. The at least one elongated rod like member has each of a predetermined length and a third predetermined cross-sectional shape in a direction transverse to the predetermined length. At least one aperture is formed through the at least one elongated rod like member in the direction transverse to the predetermined length. An elongated pin is provided and has at least one end thereof sized for insertion into the at least one aperture.Type: ApplicationFiled: March 11, 2009Publication date: September 16, 2010Inventor: GEORGE A. ORTIZ
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Publication number: 20100230124Abstract: An opener assembly for a ground engaging implement having a disk is shown. This invention attaches a scraper to the main opener arm of an opener assembly with a two point connection. One connection point allows rotation of the scraper about three orthogonal axes while the other connection point restricts rotation about one of the axes and biases the scraper edge into contact with the disk blade.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Inventor: Robert W. Martin
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Publication number: 20100230125Abstract: A return path between a first HVDC station and a second HVDC station. A first electrode is connected to the first station and a second electrode is connected to the second station. The return path includes a first part including a first low resistive zone through the crust of the earth in which the first electrode is embedded. A second part includes the earth mantle. A third part includes a second low resistive zone through the crust of the earth in which the second electrode is embedded.Type: ApplicationFiled: May 4, 2006Publication date: September 16, 2010Applicant: ABB Technology Ltd.Inventors: Gunnar Asplund, Olof Heyman, Urban Åström
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Publication number: 20100230126Abstract: An arrangement for current limiting is specified, using components (4, 5, 6) composed of a superconducting material which are arranged in a cryostat (KR) which comprises two metallic tubes (1, 2) which are arranged concentrically with respect to one another and between which vacuum insulation (3) is fitted, and which cryostat surrounds a free space (FR) for a coolant to pass through. The components (4, 5, 6) each comprise three phase conductors (7, 8, 9) composed of a superconducting material based on rare earths (ReBCO), which are arranged insulated from one another and concentrically with respect to one another.Type: ApplicationFiled: February 16, 2010Publication date: September 16, 2010Inventors: Mark Stemmle, Rainer Soika
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Publication number: 20100230127Abstract: A conduit box includes a first rear wall and a second rear wall spaced apart form the first rear wall to form a stair-stepped rear wall of the conduit box. The conduit box also includes a top wall, bottom wall, a first sidewall, and a second sidewall. The top and bottom walls have a substantial “L”-shape. The second sidewall has a length that is greater than the length of the first sidewall. The conduit box also include a rear sidewall extending from the first rear wall to the second rear wall.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Inventor: Lee Rodenberg
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Publication number: 20100230128Abstract: Drain structure of an electric connection box is provided that is capable of preventing penetration of water with simplicity. According to the drain structure of the electric connection box, since a pair of engaging leg portions of a waterproof lid is engaged in a peripheral part of a communication hole of the drain portion and a lid portion covers the upper part of the water discharging hole, the water that penetrates through to the inside of the electric connection box through the communication hole and water discharging hole of the drain portion can be dammed in use of lid portion of the waterproof lid and can be prevented from gushing into the electric connection box. As a result, since it is possible to prevent the terminal portion of a wire such as a wire harness or the like, which is arranged to run from moistening with the water, penetration of water can be surely prevented.Type: ApplicationFiled: April 25, 2008Publication date: September 16, 2010Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kengo Aburaya, Fumikazu Naimi, Masami Takase
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Publication number: 20100230129Abstract: The invention relates to a symmetrical data cable (1) for communications and data technology, comprising at least one symmetrical line pair (3) and a cable sheath (2), wherein the line pairs (3) are individually each encapsulated by a ferrite-filled and/or ferrite-coated material.Type: ApplicationFiled: July 18, 2007Publication date: September 16, 2010Inventor: Ulrich Hetzer
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Publication number: 20100230130Abstract: A foam coaxial cable includes a central conductor; an inner skin layer surrounding the central conductor coaxially; an insulation layer surrounding the inner skin layer coaxially and made of polyethylene resin containing a plurality of foam cells uniformly formed therein; wherein the inner skin layer is made of polyolefin resin having excellent compatibility with the polyethylene resin to increase an interfacial adhesive force with the insulation layer, an outer skin layer surrounding the insulation layer coaxially to prevent overfoaming of the insulation layer and allow uniform creation of foam cells; a shield surrounding the outer skin layer coaxially; and a jacket surrounding the shield. This cable improves an interfacial adhesive force between the central conductor and the insulation layer and also improves the degree of foam of the foam cells, thereby capable of propagating ultra high frequency of GHz level without signal interference.Type: ApplicationFiled: August 10, 2007Publication date: September 16, 2010Applicant: LS CABLE LTD.Inventors: Chan-Yong Park, Bong-Kwon Cho, Gi-Joon Nam, Jung-Won Park, Dae-Sung Lee
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Publication number: 20100230131Abstract: The present invention is a cable having (a) one or more electrical conductors or a core of one or more electrical conductors and (b) each conductor or core being surrounded by a layer of insulation. The insulation layer is prepared from a composition comprising a polyolefin and a 3-dimensional, cage-structured nanoparticle. The preferred polyolefins are polyethylene polymers, and the preferred nanoparticles are polyhedral oligomeric silsesquioxanes (POSS), polyhedral oligomeric silicates (POS), or polyhedral oligomeric siloxanes.Type: ApplicationFiled: February 26, 2007Publication date: September 16, 2010Applicant: Union Carbide Chemicals & Plastics Technology LLC (formerly Union Carbide Chemicals & Plastics TechnInventors: Suh Joon Han, Laurence H. Gross, Scott H. Wasserman
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NON-METALLIC, INTEGRATED SENSOR-INTERCONNECT DEVICE, MANUFACTURING PROCESS, AND RELATED APPLICATIONS
Publication number: 20100230132Abstract: Exemplary embodiments provide materials, devices and arrays of integrated sensor assembly, as well as methods for forming and using such devices and arrays in sensing systems. In one embodiment, the integrated sensor assembly can include an interconnecting member and at least one sensor member connected with the interconnecting member at any location thereof. Each of the sensor member and the interconnecting member can include a core element and a polymer. The core element for the sensor member and the core element for the interconnecting member can be electrically interconnected. Various embodiments can also include a connector member connected to the interconnecting member for transmitting sensing signals from or to the sensor member.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Applicant: Xerox CorporationInventors: Joseph A. Swift, Stanely J. Wallace, Roger Lee Bullock -
Publication number: 20100230133Abstract: A multilayer insulated electric wire includes a conductor and three or more insulating layers covering the conductor. In the multilayer insulated electric wire, the outermost layer (A) of the insulating layers includes a coating layer formed of a resin composition of a polyamide resin containing copper iodide, and the innermost layer (B) of the insulating layers includes a coating layer formed of a resin composition of 100 parts by mass of a polyester-based resin (B1), all or a part of which is formed of an aliphatic alcohol component bonded with an acid component, and 5 to 40 parts by mass of an ethylene-based copolymer (B2) having side chains of a carboxylic acid or a metal salt of a carboxylic acid.Type: ApplicationFiled: March 29, 2007Publication date: September 16, 2010Inventors: Minoru Saito, Hideo Fukuda, Makoto Onodera, Tsuneo Aoi
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Publication number: 20100230134Abstract: Disclosed is type THHN cable having a reduced surface coefficient of friction, and the method of manufacture thereof, in which the central conductor core and insulating layer are surrounded by a nylon sheath. A high viscosity, high molecular weight silicone based pulling lubricant for THHN cable, or alternatively, erucamide or stearyl erucamide for small THHN gauge wire, is incorporated, by alternate methods, with the nylon material from which the outer sheath is extruded, and is effective to reduce the required pulling force on the cable during installation.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: Southwire CompanyInventors: Terry Chambers, Randy Kummer, John Armstrong, Philip Sasse, David Reece, Hai Lam
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Publication number: 20100230135Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.Type: ApplicationFiled: July 13, 2006Publication date: September 16, 2010Applicant: Magnecomp CorporationInventors: Christopher Schreiber, Christopher Dunn
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Publication number: 20100230136Abstract: The present invention provides a method for producing a resist pattern sufficiently miniaturized having an excellent shape including: repeating a process of forming a patterned resist film comprising the following step (1): (1) forming a resist film, and exposing the formed resist film, and the like to form a patterned resist film by n cycles to obtain a resist pattern, wherein the resist film exposed in the step (1) in at least one cycle of the n cycles of the process of forming the patterned resist film is a film formed by layering a resist composition containing a resin (B) that becomes soluble in an alkali aqueous solution by an action of an acid and has a weight-average molecular weight of 7,000 to 10,000 and a glass transition temperature of 150 to 200° C., a photoacid generator (A) and a crosslinking agent (C).Type: ApplicationFiled: March 9, 2010Publication date: September 16, 2010Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Koji ICHIKAWA, Masako Sugihara
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Publication number: 20100230137Abstract: A method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids.Type: ApplicationFiled: May 28, 2010Publication date: September 16, 2010Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Hironori KOBAYASHI
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Publication number: 20100230138Abstract: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength ?=0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.Type: ApplicationFiled: March 26, 2008Publication date: September 16, 2010Inventors: Toshiyuki Asahi, Yukihiro Shimasaki, Fumio Echigo
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Publication number: 20100230139Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.Type: ApplicationFiled: March 14, 2009Publication date: September 16, 2010Applicant: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: JengPing Lu, Eugene M. Chow
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Publication number: 20100230140Abstract: A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured.Type: ApplicationFiled: October 13, 2009Publication date: September 16, 2010Inventors: Chien-Yi HUANG, Chen-Liang Ku, Ko-Chin Lee
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Publication number: 20100230141Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.Type: ApplicationFiled: March 12, 2010Publication date: September 16, 2010Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Ayao Kariya, Katsuhiro Satou, Yasuhiro Okuda
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Publication number: 20100230142Abstract: Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing.Type: ApplicationFiled: October 23, 2008Publication date: September 16, 2010Applicant: UBE INDUSTRIES, LTD.Inventors: Keita Bamba, Tadahiro Yokozawa, Hideaki Watanabe
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Publication number: 20100230143Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Publication number: 20100230144Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.Type: ApplicationFiled: January 26, 2006Publication date: September 16, 2010Applicant: Magnecomp CorporationInventors: Christopher Schreiber, Christopher Dunn
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Publication number: 20100230145Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.Type: ApplicationFiled: December 28, 2007Publication date: September 16, 2010Applicant: ORMET CIRCUITS, INC.Inventor: Ken Holcomb
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Publication number: 20100230146Abstract: Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.Type: ApplicationFiled: August 20, 2009Publication date: September 16, 2010Inventors: Eung Suek LEE, Je Gwang Yoo, Chang Sup Ryu, Jun Oh Hwang, Jee Soo Mok
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Publication number: 20100230147Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.Type: ApplicationFiled: August 10, 2007Publication date: September 16, 2010Applicant: Panasonic CorporationInventors: Manabu Gokan, Akihisa Nakahashi, Takayuki Hirose, Yoko Kasai, Kohichi Tanda
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Publication number: 20100230148Abstract: To provide a substrate for mounting a semiconductor element, in which fine-pitch wiring layers are formed to allow a semiconductor element to be mounted, while heat generated in the semiconductor element will not result in a decrease in reliability. Semiconductor-element mounting substrate sandwiches low-thermal-expansion substrate with upper interlayer resin layer and lower interlayer resin layer, and conductive circuit of organic substrate and first conductive circuit of low-thermal-expansion substrate are connected by via conductor formed in interlayer resin layer. Therefore, low-thermal-expansion substrate for mounting semiconductor element may be connected to organic substrate that is connected to outside substrates, without arranging an organic substrate and resin layers on the lower surface of low-thermal-expansion substrate, where impact from the thermal history of semiconductor element is notable.Type: ApplicationFiled: November 12, 2009Publication date: September 16, 2010Applicant: IBIDEN, CO., LTD.Inventors: Takashi Kariya, Daiki Komatsu
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Publication number: 20100230149Abstract: A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the substrate. A method of making a capacitor comprising a dense dielectric layer.Type: ApplicationFiled: June 15, 2006Publication date: September 16, 2010Inventors: William Borland, Seigi Suh, Jon-Paul Maria, Jon Fredrick Ihlefeld, Ian Burn
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Publication number: 20100230150Abstract: A motherboard includes a mounting area, a plurality of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The plurality of first mounting holes is defined in the motherboard around the mounting area to bound a first area, and configured to mount a first type of fan. The plurality of second mounting holes is defined in the motherboard around the mounting area to bound a second area, and configured to mount a second type of fan. The first and second areas are concentric with the mounting area, and each of the plurality of second mounting holes is located adjacent to a corresponding one of the plurality of first mounting holes.Type: ApplicationFiled: March 29, 2009Publication date: September 16, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHIH-SHENG HSIEH
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Publication number: 20100230151Abstract: A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one surface side of the substrate, the conductor strip being coated with a meltable insulating varnish and whereby the insulating varnish is heated and the conductor strip is pressed onto the substrate. A device is also provided for producing a circuit pattern comprising a conductor strip coil and a cylindrical or conical laying tool, which at least over a part of its length has an interior bore guiding the conductor strip and an annular active area arranged perpendicular to its longitudinal axis and merging in inner and outer radius.Type: ApplicationFiled: March 5, 2010Publication date: September 16, 2010Inventor: Manfred Michalk
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Publication number: 20100230152Abstract: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.Type: ApplicationFiled: March 2, 2010Publication date: September 16, 2010Applicant: FUJITSU LIMITEDInventor: Takahiro KITAGAWA
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Publication number: 20100230153Abstract: The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.Type: ApplicationFiled: November 21, 2008Publication date: September 16, 2010Inventor: Kazuto Satou
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Publication number: 20100230154Abstract: Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the breaking of wire, the non-conforming shape or the low contact, which is based on the non-conforming transfer of the conductive composite. The electromagnetic shielding material comprises a transparent base material, a primer layer formed over the transparent base material, and a conductive layer formed in a predetermined pattern on the primer layer. In the primer layer, a portion having the conductive layer formed therein has a thickness larger than the thickness of a portion without the conductive layer.Type: ApplicationFiled: June 6, 2008Publication date: September 16, 2010Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Nobuo Naito, Hironori Kamiyama, Nozomi Kaga, Yuichi Miyazaki, Takeshi Nishizono, Hidetsugu Tazawa, Shinya Kiura
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Publication number: 20100230155Abstract: An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing.Type: ApplicationFiled: March 1, 2009Publication date: September 16, 2010Applicant: NOKIA CORPORATIONInventors: Kenichi Hashizume, Hideki Ohhashi, Esa-Sakari Määttä
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Publication number: 20100230156Abstract: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern ; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.Type: ApplicationFiled: March 9, 2010Publication date: September 16, 2010Applicant: High Conduction Scientific Co., Ltd.Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
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Publication number: 20100230157Abstract: A protector includes a main body and a cover, which are a pair of T-shaped semi-annular sections formed by halving a T-shaped cylindrical body, and thin hinges connecting the main body and the cover. A setting jig is provided with a main body receiver including a main body receiving recess as an upper surface opening having a cross-sectionally arcuate shape and with a pressing wall projecting upward from one side end of the main body receiving recess. The cover of the protector in an open state is hooked and placed on the pressing wall; the main body is positioned and set above the main body receiving recess; and the T-shaped branch section of the wire harness is inserted into the main body and set into the main body receiving recess. Thereby, the cover is pressed by the pressing wall to rotate toward the main body; and locking hooks provided on the main body engage with locked portions provided on the cover, thus locking and closing the main body and the cover.Type: ApplicationFiled: December 14, 2006Publication date: September 16, 2010Applicant: SUMITOMO WIRING SYSTEMS, LTD.Inventors: Tsutomu Sakata, Gousei Kobayashi
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Publication number: 20100230158Abstract: An acid anhydride-introduced polymer and a polymer composition that have improved material properties including mechanical properties when used along with fillers. In the acid anhydride-introduced polymer, a side chain is grafted onto a polymer main chain, and an acid anhydride structure is introduced into the grafted side chain through an imide bond or an amide bond. The acid anhydride-introduced polymer may be obtained by reacting an amino group-containing polymer in which an alkyl chain having an amino group at a terminal is grafted onto a polymer main chain, and a compound having two acid anhydride structures. The polymer main, chain preferably is an olefin resin or a styrene thermoplastic elastomer. The polymer composition includes the acid anhydride-introduced polymer and fillers. The acid anhydride-introduced polymer content is preferably within the range of 0.1 to 20 mass %.Type: ApplicationFiled: November 14, 2008Publication date: September 16, 2010Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., KYUSHU UNIVERSITYInventors: Tatsuya Hase, Makoto Mizoguchi
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Publication number: 20100230159Abstract: A signal transfer apparatus includes a plurality of input connectors to which a plurality of signals are input from a first electronic device; and a single output connector which is connected to the plurality of input connectors and transfers the plurality of signals to a second electronic device. The length of a plurality of cables connecting the single output connector and the plurality of input connectors differs from each other so that the plurality of input connectors do not overlap each other.Type: ApplicationFiled: October 28, 2009Publication date: September 16, 2010Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jung-woo HEO
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Publication number: 20100230160Abstract: Provided is a technique of enabling high-compression crimping without breaking a crimp terminal while forming a recessed portion promoting a wire crimp portion of the crimp terminal to cut into a conductor in the wire crimp portion. The crimp terminal according to the invention includes a wire crimp portion, which is crimped to a conductor of a wire and includes a first crimp portion crimped to a base side of the conductor and a second crimp portion crimped to a tip end side. A recessed portion for promoting a cutting-in effect is formed in an inner surface of the wire crimp portion. A recessed portion formed in the second crimp portion is divided in a terminal width direction or is shallower than a recessed portion formed in the first crimp portion. Alternatively, the recessed portion is omitted and a recessed portion is formed only in the first crimp portion.Type: ApplicationFiled: October 31, 2008Publication date: September 16, 2010Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Junichi Ono, Hiroki Hirai, Tetsuji Tanaka, Hiroki Shimoda, Takuji Otsuka, Shigeru Ogihara, Akira Ito
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Publication number: 20100230161Abstract: The present invention aims to provide such a joint structure of a wound coil 1 and an IC chip 2 for a noncontact RFID device that is able to yield electrically and mechanically excellent connection, employing the wound coil 1, which is made by winding copper electric wire, with small variance of the electric resistance as an antenna coil for the noncontact RFID device, also by making use of such IC chips that their joint terminals 3 are covered with such metallization of the gold outermost layer 3a that is not liable to degradation during storage; and aims to provide such a method of joining the wound coil 1 and the IC chip 2 for the noncontact RFID device that is able to make said joint structure with ease and certainty, through selecting a direct joining process low in production cost as the joining method of the two, also through improving the process.Type: ApplicationFiled: March 28, 2007Publication date: September 16, 2010Inventor: Katsuji Hoshi
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Publication number: 20100230162Abstract: Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 16, 2010Publication date: September 16, 2010Applicant: SAPA PROFILES, INC.Inventor: Ray Goody
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Publication number: 20100230163Abstract: A perforating apparatus (100) used to perforate a subterranean well. The perforating apparatus (100) includes a generally tubular gun carrier (106) and a charge holder (104) rotatably mounted within the gun carrier (106). At least one shaped charge (102) is mounted in the charge holder (104) and is operable to perforate the well upon detonation. A dynamically adjustable weight system (124) is operably associated to the charge holder (104). The dynamically adjustable weight system (124) is operable to adjust the center of gravity (120) of the charge holder (104) such that gravity will cause the charge holder (104) to rotate within the gun carrier (106) to position the at least one shaped charge (102) in a desired circumferential direction relative to the well prior to perforating.Type: ApplicationFiled: March 13, 2009Publication date: September 16, 2010Applicant: HALLIBURTON ENERGY SERVICES, INC.Inventors: John H. Hales, Allison E. Novak, John D. Burleson
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Publication number: 20100230164Abstract: Drilling fluid additive compositions are provided for use with synthetic, oil based, or water based drilling fluids. The combined additive and drilling fluid are effective for reducing lost circulation, seepage loss as well as wellbore strengthening and/or wellbore lining. The method includes injecting the drilling fluid and 0.01 or more pounds per barrel of a loss control additive including ground and sized pumice, barite, anthracite or dolomite.Type: ApplicationFiled: June 30, 2009Publication date: September 16, 2010Inventor: Daniel Guy POMERLEAU
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Publication number: 20100230165Abstract: A core orientation head (12) comprises a substantially cylindrical body (28) having a first end (30) and an opposite end (34). A core face profile recording system (41) is carried by the body (28) to record a profile of the face of a core cut by a core drill in which the orientation head (12) is disposed. The system (41) comprises a plurality of pins (42) housed with an interference fit inside respective axially extending holes (38) provided in the body (28). A bearing scale (48) is marked on an outer circumferential surface 50 of the body (28). A cap (74) is demountably connectable to either of the ends (30) and (34). When connected to the end (30), the caps (74) protects the system (41). The caps (74) is also provided with a vernier scale (110) which, when the cap (74) is connected to the end (34), co-operates with the bearing scale (48) to facilitate marking of the core sample (46).Type: ApplicationFiled: March 27, 2007Publication date: September 16, 2010Applicant: 2iC Australia PTY LtdInventors: Andrew Beach, Cavin McLeod
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Publication number: 20100230166Abstract: A derrickless system for servicing tubulars at a wellhead has a first tubular handling apparatus with a gripper positioned adjacent the wellhead where the gripper grips a surface of one of the tubulars, a second tubular handling apparatus with a gripper positioned adjacent the wellhead where the gripper grips a surface of another of the tubulars, and a slip assembly positioned in the wellhead. The slip assembly has a wedge bowl positioned at the wellhead that is suitable for receiving the tubular therein, and wedges positioned in the wedge bowl that are suitable for positioning between the wedge bowl and the tubular. Each of the grippers of the first and second tubular handling apparatus has a stab frame and three grippers attached to the stab frame.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Applicant: T&T ENGINEERING SERVICESInventors: Axel M. SIGMAR, Keith J. ORGERON
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Publication number: 20100230167Abstract: The present invention provides drilling assembles and methods that are especially useful for a bottom hole drilling assembly for drilling/reaming/or other operations related to drilling a borehole through an earth formation. In one embodiment, the drilling assembly utilizes standard drill collars which are modified to accept force transfer sections. In another embodiment, the drilling assembly comprises a tension inducing sub which creates a force that may be used to place the bottom hole assembly or portions thereof in tension. In another embodiment, a reaming assembly is held in tension to provide a stiffer reaming assembly.Type: ApplicationFiled: May 24, 2010Publication date: September 16, 2010Inventors: Richard A. Nichols, Bruce L. Taylor, Roger Pierce
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Publication number: 20100230168Abstract: A method and system for controlling a horizontal directional drilling machine having a boring tool. A rate of rotation and a rate of thrust are selected by an operator. Controls allow an automatic boring operation mode to be initiated to maintain the selected rate of rotation and thrust without further input from the operator. Periodically, when the rotation and thrust are interrupted, such as to modify the drill string, the automatic boring operation mode is interrupted. The automatic boring operation mode may be resumed without requiring the operator to select the rate of rotation and rate of thrust. The rate of rotation is resumed before the rate of thrust to reduce drill string shock loads and increase drilling performance.Type: ApplicationFiled: May 24, 2010Publication date: September 16, 2010Applicant: VERMEER MANUFACTURING COMPANYInventors: Robin W. Carlson, Randy R. Runquist
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Publication number: 20100230169Abstract: Drilling fluid additive compositions are provided for use with synthetic, oil based, or water based drilling fluids. The combined additive and drilling fluid are effective for reducing lost circulation, seepage loss as well as wellbore strengthening and/or wellbore lining. The method includes injecting the drilling fluid and 0.01 or more pounds per barrel of a loss control additive including ground and sized pumice, barite or dolomite.Type: ApplicationFiled: March 12, 2009Publication date: September 16, 2010Inventor: Daniel Guy Pomerleau
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Publication number: 20100230170Abstract: A pressure compensation assembly for a drill bit having a cavity to receive the pressure compensation assembly, a mud port connected to the cavity, and a lubricant passageway connected to the cavity, is disclosed. The pressure compensation assembly includes a relief mechanism having a selected operating pressure. The pressure compensation assembly is movable from a first position to a second position within the cavity. The pressure compensation assembly may receive lubricant at a pressure exceeding the selected operating pressure to permit the flow of lubricant into the lubricant passageway while substantially preventing the release of lubricant into the mud port while in the first position. The pressure compensation assembly is operable to limit a pressure differential within the drill bit while in the second position.Type: ApplicationFiled: September 13, 2007Publication date: September 16, 2010Applicant: Burintekh USA, LLCInventors: Michael Burl Crawford, Pele Jason Nunley