Abstract: An aircraft electronics housing assembly maintains the electronics unit at given ambient conditions despite changes in conditions outside the housing during the aircraft flight cycle.

Abstract: A self-service device, particularly an automated cash machine, having an operating unit with an operating panel for entering alphanumeric characters and/or control data, and having a cover surface having a plurality of edges bounding a recess, whereby the operating panel is encompassed, wherein at least one first edge of the cover surface is disposed at a distance from a first edge of the operating panel, forming an intermediate space, wherein a functional strip is disposed, the functional strip being mounted on a mounting frame encompassing the operating panel, said frame being connected to the cover surface by mounting elements.

Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

Abstract: A portable electronic device is provided. The portable electronic device includes a frame, a display and at least one spacing element. The display includes a panel, wherein the panel is disposed in the frame. The spacing element is adhered to the frame, and disposed between the frame and the panel.

Abstract: An information processing apparatus includes: a wireless communication unit configured to perform wireless communication with counterpart devices; a housing configured to include the wireless communication unit, the housing being formed with an opening for exposing the wireless communication unit; a lid member configured to be movable between an opened position for opening the opening and a closing position for closing the opening; and an input device configured to receive an input and outputs an operation signal in accordance with the input, the input device being provided on the housing, wherein the input device includes the lid member.

Abstract: A portable computer includes a main body having a top surface, a keyboard, a touchpad, an ejector assembly, and a latching assembly. A receiving recess and a receiving hole are defined in the top surface. The receiving hole is positioned between the receiving recess and the keyboard and communicates with the receiving recess to form a connecting portion. The touchpad is detachably received in the receiving recess and includes a touchpad body and an engaging member with an engaging portion protruding from the touchpad body adjacent to the keyboard. The ejector assembly includes at least one elastic member. One end of the elastic member is fixed to a side of the receiving recess, and the other end abuts the touchpad body. The latching assembly includes a first restricting member connected to the connecting portion and a second restricting member fixed to the receiving hole and exposed from the receiving hole.

Abstract: An adjustable mount assembly and a related rack mount system are provided. The adjustable mount assembly is adapted for mounting a user interaction device outward from a cabinet structure comprising a first surface and a second surface adjacent to the first surface. The adjustable mount assembly comprises a moving member movable substantially horizontally with respect to the first surface. The adjustable mount assembly further comprises an adjustable frame member coupled to the moving member for mounting the user interaction device, wherein a length of the adjustable frame member is adjustable with respect to the second surface. In accordance with an embodiment, the adjustable frame member comprises a two-fold sliding track, wherein the two-fold sliding track comprises a first fold slidably mounted on the first surface and a second fold fixedly holding the user interaction device.

Abstract: A monitor comprises a back cover defining a depressed portion to receive a hard disk, a motherboard, and a power supply. The depressed portion comprises a bottom board and a side wall connected between the bottom board and a baseboard of the back cover. An opening corresponding to a plurality of input/output interfaces of the motherboard is defined in the side wall of the depressed portion.

Abstract: An exemplary USB flash memory device includes a main body, a bending portion, a memory unit, and a connector. The main body includes a front wall, a back wall, and two side walls between the front and back walls. A transverse width of each of the front wall and the back wall is larger than a transverse width of each side wall. The bending portion is pivotably connected to the main body, a rotation axis of the bending portion is substantially perpendicular to the front wall and the back wall of the main body. The memory unit is received in the main body. The connector is electrically connected to the memory unit, the connector is secured to an end of the bending portion farthest away from the main body.

Abstract: A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.

Abstract: In one embodiment, an ejection mechanism for ejecting a removable module from a piece of equipment includes a two-part ejection lever including a first lever portion that is snap fit to a second lever portion, wherein the first lever portion can separate from the second portion when a user pulls on the ejection lever in an attempt to eject the removable module when the module has been locked within the equipment.

Abstract: An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

Abstract: An electronic device includes a back cover, a mounting frame fixed to inner surface of the back cover, a battery connector, a sliding member, and a driving member. The battery connector is fixed to the sliding member and is configured for connecting to a battery of the electronic device. The mounting frame includes a guide portion. The driving member driving member is connected to the back cover 20 and externally accessible and is capable of rotating in response to user operation; the sliding member is configured for moving only along the guide portion; when the driving member is rotated, the driving member drives the sliding member to move and then establish or discontinue the connection between the battery connector and the battery.

Abstract: A computer system is provided. The computer system includes a chassis, a motherboard secured in the chassis, and a mounting bracket. A connector is arranged on the motherboard, and a riser card is inserted in the connector. The mounting bracket is secured to the chassis and located above the motherboard. The computer system further includes a positioning member attached to the riser card. The positioning member has two opposite side plates. One of the side plates is secured to the second riser card, and the other side plate is secured to the mounting bracket.

Abstract: An electronic device is directly disposed on a lamp base and is powered by the lamp base. The electronic device includes a connection base matching with a specification of the lamp base, and an air-flow generator. The connection base may be directly screwed into the lamp base to power the air-flow generator, so that the air-flow generator operates to generate an air flow.

Abstract: Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device.

Abstract: In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage.

Abstract: An electric equipment includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to face opening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: A rotatable cooling module includes a cooling coil. An input line is coupled to the cooling coil via a coupler that allows the cooling coil to rotate independent of the input line. An output line is coupled to the cooling coil via a second coupler that allows the cooling coil to rotate independent of the output line. A coolant flows through the input line and the first coupler and passes through the cooling coil, which removes heat from an electronic assembly to which the cooling unit is attached. The coolant then flows through the second coupler and through the output line and returns to a heat exchanger, which cools the liquid before recirculating through the cooling unit. The couplers are disposed about a single axis which allows the cooling module to be rotated, and the couplers prevent damage from occurring to any of the elements of the cooling module.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.

Abstract: Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.

Abstract: Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.

Abstract: Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block.

Abstract: A heat sink for use with a heat generating component includes a molded cooling block including a molded cooling passage for receiving a cooling medium. The cooling block is configured to be positioned in sufficient heat transfer relationship with respect to the heat generating component so that the cooling medium receives heat from the heat generating component.

Abstract: A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.

Abstract: Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.

Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.

Abstract: An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.

Abstract: A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.

Abstract: The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.

Abstract: The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area.

Abstract: An apparatus including: an intermediate chassis configured to move in at least a first direction and configured to define a reaction surface; a movable chassis configured to move in at least a second direction orthogonal to the first direction and configured to define a follower wherein the reaction surface and follower interact to convert movement of the intermediate chassis and reaction surface in the first direction to movement of the follower and movable chassis in the second direction. Also, an apparatus including a first movable housing portion having side faces including one or more interface components; and a second housing portion; wherein the first movable housing portion is movable relative to the second housing portion between a compact configuration in which the one or more interface components are obscured by the second housing portion and an expanded configuration in which the one or more interface components are exposed.

Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Abstract: In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.

Abstract: A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract: An electronic device includes a bracket, a rear plane, a mounting member, and a middle plane. The bracket is configured for receiving at least one hard disk drive therein, and includes a bottom plate. The rear plane is secured to the bracket. The mounting member secures the middle plane to the bottom plate, so that the middle plane is perpendicular to the bottom plate and parallel to the rear plane.

Abstract: An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.

Abstract: A positioning structure for portable electronic device includes two latching elements and a positioning element. Each latching element includes a blocking portion. The positioning element includes a cover portion and two fixing portions formed at two ends thereof. The cover portion defines a plurality of cavities for receiving electronic components. Each fixing portion defines a hole, and the blocking portion is received in the hole.

Abstract: In order to readily and securely mount, for example, a fuse block to a cover and readily accommodate increase in the number of circuits, bus bars each having on one side a terminal portion for connection of an electrical component and on the other side a terminal portion for connection of circuit board are provided in an insulating block body parallel to each other to constitute a busbar block. The bus bars are prevented from uplifting by virtue of a rib integral with the block body. Recessed portions for positioning are provided in an insulating cover corresponding to the ribs, and at the same time as the busbar block is attached to the cover, the ribs are brought into engagement with the recessed portions to provide positioning of the busbar block.

Abstract: An electronic apparatus comprises a body chassis to which a cabinet is fastened by a screw, the screw is screwed from outside of the cabinet into a boss made of synthetic resin on the body chassis to pass through the boss, the body chassis is provided with a component having a metal surface arranged thereon, and the screw includes a tip opposed to the metal surface of the component. The body chassis is provided with a grounded metal plate arranged thereon, on which a projection intervening between the tip of the screw and the metal surface of the component is formed, the projection includes a through-hole through which the tip of the screw can pass, and the smallest gap length between inner peripheral surface of the through-hole and the screw is set to be smaller than the smallest gap length between the metal surface of the component and the screw.

Abstract: An automation appliance with at least one wireless communication interface has electronics arranged on a printed circuit board, where the printed circuit board is in a housing having externally accessible plug connectors. A plug connector is connected to the communication interface electronics and is aligned adjacent to the printed circuit board in the area of the interface electronics. The plug connector has a center contact for RF signal connection surrounded by outer contacts that provide RF shielding. Another plug connector of similar mechanical design is also provided which provides for cable based communications interface and is not a RF plug.

Abstract: A mobile digital video recorder (MDVR) has a hollow shell, two board tracks, two brackets, a main board, power board, VSM board, and a storage device. The board tracks and the brackets are attached securely in the shell. The main board is mounted slidably and detachably in the shell via the tracks. The power board is mounted slidably and detachably in the shell via the tracks. The VSM board is mounted slidably and detachably in the shell via the tracks. The storage device is mounted slidably and detachably in the shell via the brackets. Therefore, the main board, power board, VSM board and the storage device are easily pulled out from the shell for repairing, replacing, or upgrading to new technology.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is mounted on an insulating layer of a conductive foil in a first step, the active side of the electronic component pointing in the direction of the conductive foil. In a second step, the conductive foil having the at least one electronic component mounted thereon is laminated to a circuit board substrate, the at least one electronic component pointing in the direction of the circuit board substrate. Finally, circuit tracks are developed by patterning the conductive foil, and the at least one electronic component is contacted.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer.