Abstract: A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.

Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.

Abstract: A portable power source assembly including a plurality of battery cells that are directly attached to a housing used to enclose and support operational components of a portable computing device. A flexible interconnect component is used for electrically interconnecting the battery cells. Protective structures can be provided in discrete locations to protect the battery cells from compressive forces applied to the housing of the computing device. Removal handles or pull tabs may be provided on the battery cells so that individual battery cells may be easily removed for repair or replacement.

Abstract: A server enclosure includes a power input terminal to receive power signals, a number of connection elements, a number of lead terminals, and a number of power output terminals. Each connection element includes a connection portion and two fixing arms extending from opposite ends of the connection portion. The connection portion is engaged with the power input terminal to receive the power signals and output the power signals to the two fixing arms. Each lead terminal includes a first connection portion fixed to one fixing arm along an extending direction of the fixing arm to receive the power signals and a second connection portion to receive the power signals. Each power output terminal is connected to one of the second connection portions to receive the power signals.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in fluid communication with a coolant loop for passing chilled coolant through the heat exchanger, and the dehumidifying heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the dehumidifying of ingressing air, and a condensate delivery mechanism delivers the condensate to the re-humidifying structure to humidify air egressing from the electronics rack.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: A parallel redundant fan system includes at least first and second fans located adjacent each other. Each fan includes: (i) a fan housing defining a fan chamber in which an impeller is supported for rotation about an axis of rotation; (ii) a first chamber outlet in communication with the fan chamber and defined by an opening in a first wall of the fan housing; (iii) a second chamber outlet in communication with the fan chamber and defined by an opening in a second wall of the fan housing; and, (iii) first and second backflow prevention dampers respectively associated with the first and second chamber outlets. The first and second dampers respectively include first and second damper plates that selectively pivot from their closed positions toward their opened positions against the closing force of respective first and second counterweights in response to exhaust air flow pressure exerted thereon.

Abstract: A portable electronic device has a cover, a base and a heat-dissipating hinge. The heat-dissipating hinge has a cam and a foot. The cam is attached to the cover. The foot abuts the cam and protrudes out of the base. When the cover is opened, the cam is rotated to push the foot protruding out of the base and standing on the table. Therefore the base is elevated to easily dissipate heat so heat dissipation efficiency of the portable electronic device is increased.

Abstract: An electronic device includes a fan including a frame, an enclosure, and many fixing members engaged with the enclosure to fix the fan in the enclosure. The frame includes many mounting holes positioned in corners of the frame, respectively. The enclosure includes many sidewalls and many fixing members corresponding to the mounting holes. Each fixing member includes a base, a fixing portion extending from a top surface of the base, an angle shaped clasping portion extending from a sidewall of the base. Each base includes a locating block received in a corresponding locating member, and at least one fixing arms abuts against the corresponding locating member. Each fixing portion extends through the locating member and is received in a corresponding mounting hole. Each clasping portion extends through the corresponding locating member and clasps an inner wall of the corresponding mounting hole.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.

Abstract: An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of the extending member.

Abstract: A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the first cooling element, and an insulating casing receiving the semiconductor modules to electrically isolate the semiconductor devices from each other.

Abstract: An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink. A method of manufacturing an electronic device includes connecting an IC package to a substrate, coupling a heat sink to the IC package and depositing a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink.

Abstract: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Abstract: A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.

Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A power module operable to sense current, such as but not limited to a power module operable within a vehicle to sense current while rectifying an AC input to a DC output. The power module may include a shunt disposed relative an output of the power module to facilitate the current measurement.

Abstract: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second matching counterpart in a second insertion direction (104), which second insertion direction is the direction of a curvilinear motion and different from said first insertion direction (103). The apparatus (102) comprises a hinge joint between said first connector and a body of the apparatus. The hinge joint has an axis of rotation, which is essentially perpendicular against said second insertion direction (104).

Abstract: An electronic component having electrically conductive contacts and a printed circuit board enclosed by a sheathing made from a first plastic, and a method for manufacturing the electronic component. Such electronic components are used in oil pans of a transmission. The electrically conductive contacts are enclosed by a frame made from a second plastic. The first plastic is a duroplastic, and the second one is a thermoplastic. The thermoplastic does not represent a barrier to transmission oil. It is used for shaping the duroplastic, prepositioning the electrically conductive contacts, and preventing mechanical reworking of the duroplastic. No projections such as tabs or flash layers are created.

Abstract: The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play.

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Abstract: The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern.

Abstract: Assemblies of structures such as electronic device assemblies may be connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light sources such as ultraviolet-light light-emitting diodes may be mounted to a substrate such as a printed circuit board substrate. The substrate may be mounted to an assembly formed from a plurality of structures. The structures may be connected to each other to form an interior cavity within which the substrate and light-emitting diodes are contained. A connector may be included in the assembly. The connector may have input-output pins. Conductive paths may couple the input-output pins to the light-emitting diodes in the cavity. A tool may be used to apply signals to the light-emitting diodes to activate the light-emitting diodes. The light-emitting diodes produce light that cures the adhesive. The light-emitting diodes may be disabled by blowing a fuse after the adhesive has been cured.

Abstract: An electronic control unit includes an electronic circuit board mounted with a plurality of electronic components disposed in a scattered manner on one or both surfaces of the board and at least one connector, and the electronic circuit board is housed in an enclosure made up of enclosure members including a cover and a base, wherein the electronic control unit is structured in such a way that intermediate members each are disposed on both top face of a part of or all of the electronic components and their projected area on the opposite mount surface of the board, portions of the enclosure members are made to closely contact the intermediate members so that both surfaces of the electronic circuit board are sandwiched by the enclosure members and the intermediate members, and edge portions in the periphery of the electronic circuit board are sandwiched by the enclosure members.

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract: In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.

Abstract: Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB.

Abstract: The invention provides an anti-UV electronic device and fabrication method thereof. The anti-ultraviolet (anti-UV) electronic device includes an integrated circuit die, wherein the integrated circuit die has an ultraviolet (UV) light erasable memory; and an anti-UV light layer is formed on and covers the ultraviolet (UV) light erasable memory.

Abstract: A receiving apparatus includes two electronic boards having flat surfaces that are disposed substantially-parallel to each other and that at least partially overlap each other, and an antenna that is mounted on the two electronic boards. The antenna includes a first metal line that is mounted along the flat surface of a first electronic board out of the two electronic boards, and a second metal line that is disposed substantially-perpendicular to the flat surfaces of the two electronic boards, a first end of the second metal line electrically connected to the first metal line and a second end of the second metal line electrically connected to a circuit on a second electronic board out of the two electronic boards. This enables the antenna to be integrated with the two electronic boards. As a result, it is possible to reduce the production cost while higher performance in receiving a radio wave is provided.

Abstract: A tire inside information acquiring device (100) attached inside a tire-wheel assembly, includes a housing body (10) configured to house a receiving antenna for receiving a radio signal and an electronic circuit unit connected to the receiving antenna, the electronic circuit unit constitutes the tire inside information acquiring device (100), and a substrate (40) on which the housing body (10) and a component constituting the tire inside information acquiring device (100) are disposed. The housing body (10) is formed of a nonmetallic inorganic material. The component is only formed of parts having water resistance.

Abstract: An electronic device is within a housing that has an aperture through an enclosure surface of the housing. A ferrite block is attached to an edge of the aperture, thus transforming electromagnetically-induced current next to the aperture into heat in order to reduce a voltage across the aperture, thereby suppressing aperture edge emissions.

Abstract: A semiconductor component and a method of manufacturing the semiconductor component that reduces parasitic elements. A semiconductor chip is coupled to a semiconductor chip receiving area of a support structure. The semiconductor chip has at least two power semiconductor devices. A drain contact of a first power semiconductor device is coupled to a source contact of a second power semiconductor device and the drain and source contacts of the first and second power semiconductor devices are joined to the semiconductor chip receiving area. Another semiconductor chip may be bonded to a second semiconductor chip receiving area of the support structure. An energy storage element may be coupled between the source contact of the first power semiconductor device and the drain contact of the second semiconductor device. A protective structure may be formed over the semiconductor chips and the energy storage element.

Abstract: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

Abstract: When placing a photographic subject close to a large light source equipped with a light control grid, the problem of occluded light channels is solved by variably converging the channels, such that the soft light is directed at a focal point that can be as close as one-half the diagonal dimension of the light source. The light channels are formed by generally planar intersection of strips, the strips preferably made of a flexible fabric material and having slots with corresponding slots on other strips. Optionally, a deployable frame may be provided to help support the grid.

Abstract: Disclosed is a simple lighting device for photographing, which makes it possible to take an artistic picture of a human, which is an object to be photographed, enhancing his or her facial expressions, without the need of troublesome light source adjustment. The lighting device comprises a reflecting plate (2) which has a concave shaped surface with respect to the object to be photographed and which has a transmission area (22) which permits light to pass therethrough, and a light emitter (1) which is provided on the convex surface side of the reflecting plate (2) and which emits light toward the transmission area (22). The light emitted from the light emitter (1) and transmitted through the transmission area (22) is irradiated onto the object to be photographed and is reflected by the reflecting plate (2) toward the object to be photographed.

Abstract: A light emitting device capable of improving light extraction efficiency is provided. The light emitting device includes: a laser generator which outputs linearly polarized laser light; a fluorescent body which is irradiated with the laser light from the laser generator; and a reflective polarization filter which is arranged in a region through which the laser light outputted from the laser generator passes. The reflective polarization filter is formed to transmit linearly polarized light of the laser light and reflect linearly polarized light having a polarization plane which is perpendicular to a polarization plane of the linearly polarized light of the laser light.

Abstract: The present invention discloses a moving head light included a light source group having a plurality of light sources, a reflector group slantwise arranged at a circumference of the light source group, and a rotary drive device for driving the reflector group to rotate relative to the light source group. Each reflector corresponds to each light source one by one, and the reflector group includes a plurality of reflectors. The reflectors are rotated around the light sources, so that the lights sent out from the light sources are projected to the space after being reflected by the reflectors, and the faculae are divided into two from one and jointed into one from two. Accordingly, the stage rendering effect is better and a sort of fantasy feel is produced for persons.

Abstract: A lighting apparatus includes a body having a bottom surface and a side surface, a poly-pyramid shaped reflector being placed on the bottom surface of the body and including at least three reflective surfaces, and a light source being placed on the side surface of the body, including at least one light emitting device and being placed in an area corresponding to at least one of the reflective surfaces of the reflector.

Abstract: A display apparatus includes a display panel, a plurality of spaced apart point light sources outputting light and each having an orientation angle greater than or equal to about 50° and less than about 90°, and an optical plate interposed between the display panel and the point light sources. The optical plate has a base comprising front and rear surfaces and a plurality of convex sections formed on the front surface of the base. Each convex section has a cross section perpendicular to the front surface in which the cross section has a form of a segment of an ellipse including an arc of an ellipse and a chord linking both ends of the arc while satisfying an equation, 1.0 < b a < 2.5 , when a minor axis of the ellipse has a length of 2a, and a major axis of the ellipse has a length of 2b.

Abstract: A modular lighting system for lighting a work area is disclosed. The system includes a power supply with power outlets for powering LED fixtures. The power supply preferably operates at or below a fixed power output level, such as to illuminate the work area using less than 0.2 Watts per square foot of energy. The lighting system also includes an occupancy sensor and/or a light level sensor for controlling lighting levels in the work area in response to detection of a person, ambient light levels and/or a combination thereof. The lighting system can also include computer unit with a micro-processor and a memory unit for running software or firmware the executes lighting programs, stores light usage histories and/or provides system reports to a remote computer by a wireless means and/or over a computer network.

Abstract: The invention provides a carpet back lighting system comprising a carpet back lighting unit having a lighting unit front face and a unit back face, wherein the lighting unit front face comprises a light source, arranged to generate light, and accompanying optics. The carpet back lighting system is suitable as back lighting at a carpet unit back side of a light transmissive carpet unit selected from the group consisting a carpet and a carpet tile. Further, the optics are suitable to be arranged to guide light into the light transmissive carpet unit, and wherein the optics are suitable to be arranged to penetrate into at least part of the light transmissive carpet unit.