Abstract: The present invention relates to electrical insulation enamels which contain a polymer comprising a base polymer and modifying units which are incompatible with the base polymer after the polymer has cured and lead to the formation of separate phases at the surface, and to processes for the production thereof. The electrical insulation enamels have a low coefficient of friction and frictional resistance and are preferably suitable for the coating of wires.

Abstract: Provided are a varnish mainly containing a polyester imide and capable of forming a low-permittivity insulating layer, as well as an insulated electronic wire achieving low permittivity by using the varnish. The varnish mainly contains a polyester imide resin obtained by reacting a carboxylic acid including a dicarboxylic acid, or an anhydride or alkyl ester thereof (carboxylic acid or derivative thereof), an alcohol, and a diamine compound with one another. In the varnish, adjustment is made such that a molar ratio (OH/COOH) of hydroxyl groups of the alcohol to carboxyl groups of the carboxylic acid or derivative thereof becomes 1.9 or less or such that a content of highly polarized imide groups per unit amount of polyester imide chain is reduced by increasing molecular weights of the raw material monomers.

Abstract: The present disclosure relates to a silane-containing inorganic nanofiller, a varnish including the silane-containing inorganic nanofiller, an enameled wire including the silane-containing inorganic nanofiller, and a method for preparing the enameled wire.

Abstract: A woven electrical connection structure including a first conductive yarn, a conductor and a fastening string is provided. The conductor is directly stacked on and electrically connected to the first conductive yarn. The fastening string can be further applied to sew the conductor on the first conductive yarn. Additionally, the conductor can also be replaced by a second conductive yarn. Similarly, the second conductive yarn can be stacked on or wound around the first conductive yarn to make an electrical connection. The fastening wire can be applied to sew the first conductive yarn and the second conductive yarn together.

Abstract: An insulative wire-clipping bushing includes a main body, support frames and a pair of clip bodies. The main body has a first surface and a second surface, and the support frames are installed and extended from symmetric edges of the first surface, and ends of the support frames are bent inwardly to form a half-hood structure, and the pair of clip bodies are installed and extended from the first surface and disposed between the support frames, and the pair of clip bodies are installed symmetrically, and ends of the pair of clip bodies are bent inwardly to form a tapered hook structure, and a wiring space is formed between the ends of the clip bodies, so that the bushing can be passed into a through hole of an electricity distribution box to pass and install at least one wire and provide a clipping force required for clamping the wire.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. D ? T ? ? 2 T ? ? 1 × 200 1.2 [ Equation ? ? 1 ] (Where D represents a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns, T1 represents a thickness of the circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the circuit pattern or the dummy pattern.

Abstract: A device for controlling an electric field at a high voltage component including a resistive layer for field control, an insulating layer arranged on the resistive layer and a semi-conducting or conducting layer arranged on the insulating layer. The three layers meet at a triple point where the insulating layer ends. An interface between the resistive layer and the insulating layer makes in the triple point an angle to the semi-conducting or conducting layer of 60°-120°.

Abstract: A fastening apparatus for fastening a heat sink having a base to a circuit board includes two fasteners, two nuts, and two springs. Each fastener includes a head, a threaded pole extending down from a bottom of the head, and two spaced latching arms extending down from a bottom end of the threaded pole, for extending through the base and the circuit board to engage with a bottom surface of the circuit board. The nuts are respectively placed around and are engaged with the threaded poles, and movable up and down relative to the threaded pole. The springs are respectively placed around the threaded poles between the base and the corresponding nuts.

Abstract: A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

Abstract: A flexible display including a flexible substrate, an array circuit layer, a protection film, and an adhesive layer is provided. The flexible substrate has a first surface and a second surface, disposed opposite to each other. The array circuit layer is disposed on the second surface of the flexible substrate. The protection film is disposed on the first surface of the flexible substrate. The adhesive layer is disposed between the protection film and the flexible substrate, and has a thickness, substantially greater than or equal to 30 micrometers.

Abstract: A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

Abstract: A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.

Abstract: Disclosed herein are a stiffener and a method for manufacturing the same. The method includes: forming a metal film on an upper surface or a lower surface of a base layer; forming a plurality of via holes penetrating the base layer and the metal film; and forming a first plating film covering an external surface including an inner surface of each of the via holes. The double-sided conductive stiffener according to the present invention can support the device by being disposed on the lower surface of the FPCB, and provide a ground structure of the device through the metal film without using the conductive bond or the conductive tape.

Abstract: A circuit board includes a substrate whereon a sunken portion is formed. The circuit board further includes a gold finger structure disposed inside the sunken portion. A height difference is formed between a top surface of the gold finger structure and a surface of the substrate substantially.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.

Abstract: A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.

Abstract: An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

Abstract: Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. A uniform amount of solder balls is included in the pad patterns having the same shape, and thus the BGA package according to the present invention can prevent a short or open from occurring due to a conventional problem of an excessive or small amount of solder balls.

Abstract: A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.

Abstract: Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region.

Abstract: A mount for a semiconductor device, the mount comprising: an insulating substrate having first and second parallel face surfaces, an edge surface that connects the parallel surfaces and having formed therein a recess having an opening on the first face surface; an electrically conductive plug seated in the recess and having a first exposed surface on or near the edge surface and a second exposed surface on or near the first face surface.

Abstract: A printed circuit board including a board, a plating layer and a solder mask layer is provided. The board has a plated through hole for inserting a termination into the board. The plated through hole passes through a surface of the board. An annual ring around the plated through hole covers the surface of the board. The plating layer is formed in the plated through hole and electrically connected to the annual ring. The solder mask layer covers the surface of the board and a portion of the outer circle of the annual ring. The plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer.

Abstract: A plurality of linear conductors arranged in parallel with each other are covered from the upper and lower sides thereof by first and second insulator layers. On the upper side of the first insulator layer, a first adjustment material layer is formed with forming a predetermined gap relative to an end of the flat cable. And, at this gap, a reinforcement plate is provided. A shield member is provided for covering the upper side of the reinforcement plate and a portion of the upper side of the first adjustment material layer. From the upper side of the shield member to the upper side of the first adjustment material layer, a first shield layer is provided in such a manner to expose the upper side of the portion of the shield member where the reinforcement plate is present. A second insulator layer is configured to expose the conductors at the end of the flat cable. The shield member includes an impedance adjusting arrangement.

Abstract: A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.

Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.

Abstract: A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB.

Abstract: An electronic device enclosure includes a first cover, a second cover located below the first cover, and a bracket for receiving a disk drive. The second cover defining a hole and comprising a shielding panel covering the hole. The shielding panel is deformable to expose the hole, for the disk drive inserting into or being removed out of the bracket.

Abstract: A junction box assembly includes a housing member and an electrical component. The housing member has a housing surface and a component receptacle having a pair of opposing sidewalls coupled to the housing surface. Each sidewall has a locking opening disposed therein and each locking opening defines a locking surface. A post is arranged within the component receptacle and extends from the housing surface for a predetermined distance to a post surface. The electrical component is received in the component receptacle and has a component surface adjacent the post surface and a barb received in each locking opening. The post applies a force to the electrical component for retaining the barb against the locking surface.

Abstract: A crystal and an ultrasonic welding method for a crystal. The crystal is used to close a top of a case of a portable object, the crystal being made of a transparent plastic material and being secured to the case of the portable object by ultrasonic welding. The crystal includes a top surface and a bottom surface that carry one or more conductive paths made of a transparent conductive material, and a peripheral rim that extends along at least one portion of the perimeter of the crystal. The peripheral rim provides at least one surface for the ultrasonic welding of the crystal to the case of the portable object.

Abstract: The invention relates to a cable screw connection (1, 100, 200, 300) for a plug-in connection housing, with a cable outlet socket (30, 120, 220) being formed at the housing body and with a tension relief element (40, 130, 230, 330) being provided, which mechanically stabilizes the cable to be connected as soon as a terminal screw head (2, 110, 210, 310) is screw connected, with the tension relief element (40, 130, 230, 330) can be fixated at a first end (40a, 130a, 230a, 330a) inside the cable screw connection (1, 100, 200, 300) in a torque-proof fashion, and with a second end (40b, 130b, 230b, 330b) of the tension relief element (40, 130, 230, 330) can be distorted in reference to the first end (40a, 130a, 230a, 330a) by a rotary motion of the screw head (2, 110, 210, 310).

Abstract: A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, a first covering member that covers the first conductive portion and the cut-off facilitating portion, and a second covering member that covers the second conductive portion and the cut-off facilitating portion. The second covering member covers the cut-off facilitating portion through the first covering member. The second covering member slidably covers the first covering member.

Abstract: A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and an insulation member that covers the cut-off facilitating portion directly or indirectly. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the insulation member is configured so as to cover the separated first conductive portion and the separated second conductive portion.

Abstract: A wire insulator apparatus includes an insulator/separator member, a cap portion, a tube and potting material. The insulator/separator member has apertures formed therein for receiving a plurality of wires. By threading the wires through the insulator/separator member, the wires are spaced apart so that a potting material can be molded to provide a complete seal from the environment, particularly conductive liquids such as ammonia, which may cause short-circuiting between the wires. Individual wires are terminated in the cap portion, and the cap portion, the insulator/separator member and the wire ends are positioned within a tube or a mold portion depending on the application, and a potting epoxy is fluidly inserted within the tube. The epoxy surrounds or encases the wire ends within the tube or mold to insulate the wire ends in an airtight seal.

Abstract: A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

Abstract: A method of mitigating perforating effects produced by well perforating can include causing a shock model to predict perforating effects for a proposed perforating string, optimizing a compliance curve of at least one proposed coupler, thereby mitigating the perforating effects for the proposed perforating string, and providing at least one actual coupler having substantially the same compliance curve as the proposed coupler. A well system can comprise a perforating string including at least one perforating gun and multiple couplers, each of the couplers having a compliance curve, and at least two of the compliance curves being different from each other. A method of mitigating perforating effects produced by well perforating can include interconnecting multiple couplers spaced apart in a perforating string, each of the couplers having a compliance curve, and selecting the compliance curves based on predictions by a shock model of shock generated by the perforating string.

Abstract: Systems and methods to inhibit packoff during drilling assembly removal from a wellbore, utilizing a drilling assembly that includes a transition region between a first section having a first cross-sectional area and a second section having a second cross-sectional area, wherein the second cross-sectional area is greater than the first cross-sectional area. The transition region includes a fluidizing assembly configured to partially fluidize a portion of the cuttings bed that is proximal to the transition region, and/or be in fluid communication with a flow control assembly configured to control flow rate of a fluidizing stream from the fluidizing assembly and to the portion of cuttings bed.

Abstract: An adjustable bent drilling tool capable of changing in situ drilling direction to facilitate horizontal drilling. The drilling tool may be controlled from the surface and eliminates the need to bring the tool to the surface for reconfiguration. In one embodiment, the drilling tool utilizes a communications module to communicate with upstream sections of the tool. The communications module is connected to a programmable electronic control module which controls an electric motor. A hydraulic valve assembly follows the control module, which receives input signals and controls a pilot piston between two fixed points of a mid-assembly typically located adjacent to and downstream of the hydraulic valve assembly on the drill tool. A lower assembly is attached to the drill tool immediately following the mid-assembly, and provides both a safety release sub-assembly as well as a bendable sub-assembly which directs the adjustable drill tool to change drilling angle and direction.

Abstract: A wireless communication network and method are described for enhancing cell-edge performance of a wireless transmit/receive unit (WTRU). The WTRU may establish a connection with a plurality of sites via respective downlinks (DLs). Each DL may include at least one DL component carrier (CC) that operates on a frequency that is the same or different than one or more of the other CCs. The sites may manipulate their transmit power for a particular CC operating frequency such that the distance from a particular one of the sites to its cell boundary may become larger by increasing its transmit power on the particular frequency, and the distance from at least one of the other sites to its respective cell boundary may become smaller by decreasing its transmit power on the particular frequency. Thus, a coverage overlap between different CC frequencies may be created while maintaining a frequency reuse pattern of one.

Abstract: Specific apparatus and associated methods are described for use in establishing the positions of locating field detectors and for path mapping within a region for the purpose of tracking and/or guiding the movement of an underground boring tool. In one aspect, an improvement is provided forming part of an arrangement for tracking the position and/or guiding the boring tool using an electromagnetic locating signal which is transmitted from the boring tool as the boring tool moves through the ground. At least two detectors are located at fixed positions within the region, each being operable in a transmit mode and in a receive mode such that each one of the detectors in the transmit mode is able to transmit a relative locating signal to the other detector for use in determining the relative position of one detector in relation to the other and such that both detectors receive the electromagnetic locating signal in the receive mode for use in determining the position of the boring tool within the region.

Abstract: Expandable reamers are configured to operate in a first, retracted state in which a plurality of blades is in a retracted position when a sliding sleeve is in a first sleeve position and a seat is in a first seat position, to operate in a second, extended state in which the plurality of blades is movable to an extended position when the sliding sleeve is in at least a second sleeve position and the seat is in the first seat position, and to operate in a third, retracted state in which the plurality of blades is returned to the retracted position when the sliding sleeve is in the at least a second position and the seat is in a second seat position.

Abstract: The present invention provides a lubrication system for a drilling apparatus. The drilling apparatus includes a drill string and a drill bit, and it is driven by a working fluid circulated through a working fluid circuit. The lubrication system uses a reservoir of a lubricating fluid for supply to a drilling apparatus during a drilling operation; and a pump for supplying lubricating fluid from said reservoir to the drilling apparatus during the drilling operation. The pump is controlled to supply lubricating fluid from the reservoir at a determined rate to a lubrication circuit formed by the working fluid circuit of the drilling apparatus.

Abstract: The present disclosure relates to an apparatus and method to wipe a tubular member. The apparatus includes a first wiper section and a second wiper section, in which the first wiper section and the second wiper section are movable with respect to each other towards a point of convergence. The apparatus may further include a base having an aperture formed therein to receive the tubular member such that the first wiper section and the second wiper section are connected to the base and movable with respect to the base between an open position and a closed position.

Abstract: A system to clean a tubular member includes an apparatus to support a tubular member having a bore with a longitudinal axis extending therethrough, and a fluid dispensing system disposed adjacent to an opening of the apparatus, the fluid dispensing system having a nozzle to dispense fluid therefrom.

Abstract: A drill bit of the type used to drill a wellbore in the earth can comprise a bore formed in the drill bit, and a plug sealingly and reciprocably disposed in the bore, whereby the plug prevents fluid communication between sections of the bore in the drill bit. The plug can comprise a spherically-shaped member. The plug can comprise a floating plug sealingly and reciprocably disposed in the bore, whereby pressure in the different sections of the bore on respective opposite sides of the plug is substantially equalized.

Abstract: A drill bit that provides enhanced stability and a method for manufacturing such bit. In a preferred embodiment, the hybrid drill bit includes a single short driven blade in the shoulder region of the bit having each of its primary cutters plural set, sharing a common radial/elevational position with a primary cutter in an adjacent blade. All other primary cutters of the drill bit are single set at unique radial/elevational positions. The trailing plural-set cutters do less work than the other cutters and disrupt resonance and the feedback mechanism that leads to vibration, instability and whirling. In alternate embodiments, multiple blade pairs or groups may have primary cutters in the shoulder region that are plural set, sharing common radial/elevational positions with other primary cutters.

Abstract: A method of manufacturing a fixed cutter drill bit may include loading a first matrix material of controlled thickness to at least a portion of a mold cavity corresponding to a heel surface of at least one blade; loading a second matrix material into the remaining portions of the mold cavity; heating the mold contents to form a matrix body of the fixed cutter drill bit; and disposing at least one back reaming element in at least one back reaming cutter pocket.

Abstract: Weighing module includes a main frame, an auxiliary frame, and a force sensor therebetween for measuring forces exerted on the force sensor, an elastic force transmission between the sensor and the auxiliary frame for transmitting forces from the auxiliary frame to the main frame, along vertical and horizontal directions, the force transmission including a first elastic compressible element held in the vertical direction between a first and a second housing part located there below and movable with respect to the first housing part, the force transmission resting on the sensor for a direct vertical force transmission via the first elastic element, whereby at rest an open play is left between the two housing parts, at least along two horizontal directions orthogonal to one another, to enable, when there are limited horizontal forces on the auxiliary frame, a limited horizontal freedom of movement up to the play between the two housing parts.

Abstract: A tracked mobility device includes: a) a frame supporting a seat; b) a pair of track drives connected to the frame, with each track drive including a powered center drive wheel, a front roller, a rear roller, and a flexible track, with the center drive wheel having a diameter that is at least 50% greater than the diameter of either the front roller or the rear roller, and c) a rear wheel assembly connected to the frame, with the rear wheel assembly having three wheels sharing a common axle, with the diameter of the center rear wheel being at least 10% larger than the diameter of the two outer rear wheels; d) a source of power to power said center drive wheels; and e) a controller effective for controlling the speed and direction of rotation of each of the track drives.

Abstract: Embodiments of the present invention are directed to a load transporting apparatus that automatically centers a support foot of the apparatus about a roller assembly during a recovery phase of an incremental walking movement. In particular, the load transporting apparatus includes guide devices positioned adjacent to a roller assembly that deflect a biasing device during non-linear load transporting movements, where the biasing device acts to automatically return the support foot to a centered position relative to the roller assembly after a non-linear movement has been completed and the support foot is raised above a ground surface.

Abstract: A suspension system for cold planer with four tracks is disclosed. The suspension system includes a hydraulic cylinder for each track, an additional bypass valve for each hydraulic cylinder and an additional bypass valve that bypasses the operation of the front control valves that control the elevation of the front tracks during a cutting operation. During transport or roading of the cold planer, the bypass valves are energized by a controller and the energized bypass valves provide communication between the head ends of the left side cylinders and the head ends of the right side cylinders. During roading, the energized bypass valves also provide communication between the rod ends of the front cylinders and between the rod ends of the rear cylinders.