Abstract: A semiconductor device having a structure that can reduce stress due to difference in coefficients of thermal expansion and prevent or suppress generation of cracks, and a semiconductor device manufacturing method, are provided. The semiconductor device includes a single crystal silicon substrate having a main face on which semiconductor elements are formed and a side face intersecting with the main face, and a sealing resin provided covering at least a portion of the side face. The side face covered by the sealing resin is equipped with a first face with a plane direction forming an angle of ?5° to +5° to the plane direction of the main face.

Abstract: The various embodiments of the present invention provide a novel chip-last embedded structure, wherein an IC is embedded within a one to two metal layer substrate. The various embodiments of the present invention are comparable to other two-dimensional and three-dimensional WLFO packages of the prior art as the embodiments have similar package thicknesses and X-Y form factors, short interconnect lengths, fine-pitch interconnects to chip I/Os, a reduced layer count for re-distribution of chip I/O pads to ball grid arrays (BGA) or land grid arrays (LGA), and improved thermal management options.

Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Abstract: A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to a substrate. Electrically conductive structures of the die are electrically coupled to electrically conductive structures of the substrate.

Abstract: A semiconductor device includes an enclosure of insulating material having an introduction portion and a discharge portion for an insulating refrigerant and also having an opening, filters mounted on the introduction portion and the discharge portion, respectively, so as to prevent conductive foreign matter from entering the enclosure, a power semiconductor element provided on the outside of the enclosure, a heat sink bonded to the power semiconductor element and extending through the opening and within the enclosure, and an insulator covering the portions of the power semiconductor element and the heat sink lying outside of the enclosure.

Abstract: In a manufacturing process of a semiconductor device by forming a structure film on a substrate in a reaction chamber of a manufacturing apparatus, cleaning inside the reaction chamber is performed. That is, a precoat film made of a silicon nitride film containing boron is deposited on an inner wall of the reaction chamber, a silicon nitride film not containing boron is formed as the structure film on the substrate in the reaction chamber, and the inner wall of the reaction chamber is dry etched to be cleaned. At this time, the dry etching is terminated after boron is detected in a gas exhausted from the reaction chamber.

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

Abstract: An electronic device packaging structure is provided. The semiconductor device includes a semiconductor base, an emitter, a collector, and a gate. The emitter and the gate are disposed on a first surface of the semiconductor base. The collector is disposed on a second surface of the semiconductor base. A first passivation layer is located on the first surface of the semiconductor base surrounding the gate. A first conductive pad is disposed on the first passivation layer. A second conductive pad is disposed on the collector on the second surface. At least one conductive through via structure penetrates the first passivation layer, the first and second surfaces of the semiconductor base, and the collector to electrically connect the first and second conductive pads.

Abstract: Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

Abstract: A semiconductor device and an electronic system are provided. The semiconductor device includes a lower conductive pattern, and an intermediate conductive pattern on the lower conductive pattern. An upper conductive pattern is provided on the intermediate conductive pattern and is electrically connected to the intermediate conductive pattern. The intermediate conductive pattern includes a first portion and a second portion that extends from a part of the first portion and that is disposed at a higher level from the lower conductive pattern than the first portion. The upper conductive pattern is disposed on the first portion of the intermediate conductive pattern and has a top surface that is disposed at a higher level from the lower conductive pattern than the second portion of the intermediate conductive pattern.

Abstract: An interlayer insulating film containing oxygen and carbon is formed on a semiconductor substrate. A groove is formed in the interlayer insulating film. An auxiliary film containing predetermined first and second metallic elements is formed on a bottom surface and a sidewall of the formed groove. Then, an interconnect body layer containing copper is formed to fill the groove. By performing a thermal treatment, a first barrier film containing a compound of the first metallic element and an oxygen element of the interlayer insulating film, and a second barrier film containing a compound of the second metallic element and carbon element of the interlayer insulating film are formed on the interlayer insulating film on the bottom surface and the sidewall of the groove.

Abstract: A method of manufacture of an integrated circuit system includes: providing a substrate including an active device; forming a through-silicon-via into the substrate; forming an insulation layer over the through-silicon-via to protect the through-silicon-via; forming a contact to the active device after forming the insulation layer; and removing the insulation layer.

Abstract: A method for fabricating a semiconductor device, includes forming a dielectric film above a substrate; forming an opening in the dielectric film; forming a first film containing a metal whose energy for forming silicide thereof is lower than that of Cu silicide inside the opening; forming a second film that is conductive and contains copper (Cu) in the opening in which the first film containing the metal is formed; and forming a compound film containing Cu and silicon (Si) selectively on the second film in an atmosphere in which a temperature of the substrate is below 300° C.

Abstract: A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.

Abstract: A method of manufacturing a semiconductor device has forming, in a dielectric film, a first opening and a second opening located in the first opening, forming a first metal film containing a first metal over a whole surface, etching the first metal film at a bottom of the second opening using a sputtering process and forming a second metal film containing a second metal over the whole surface, and burying a conductive material in the second opening and the first opening.

Abstract: A wafer with a eutectic bonding carrier and a method of manufacturing the same are disclosed, wherein the wafer comprises a thinned wafer, a eutectic bonding layer formed on the backside of said thinned wafer, a eutectic bonding carrier attached on said eutectic bonding layer, and a plurality of openings formed at the active side of said thinned wafer and exposing said eutectic bonding layer on the backside of said thinned wafer.

Abstract: A semiconductor device includes: an insulating layer formed on a substrate; a plurality of interlayer insulating films which are formed on the insulating layer and comprise an opening window; a multilayer wiring which is formed with a plurality of wiring layers and a plurality of vias formed in the plurality of interlayer insulating films; a metal pad connected with the multilayer wiring, an upper surface part of the metal pad being a bottom part of the opening window, the metal pad formed closer to the substrate than a wiring layer of a lowermost layer of the plurality of wiring layers and is; and a pad ring provided on the metal pad, the pad ring penetrating the plurality of interlayer insulating films and the pad ring surrounding the opening window.

Abstract: A semiconductor device includes a through electrode that penetrates through a silicon substrate, an isolation trench provided to penetrate through the silicon substrate to surround the through electrode, a first silicon film in contact with an inner surface of the isolation trench, a second silicon film in contact with an outer surface of the isolation trench, and an insulation film provided between the first and second silicon films.

Abstract: A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip.

Abstract: Some embodiments of the invention provide a programmable system in package (“PSiP”). The PSiP includes a single IC housing, a substrate and several IC's that are arranged within the single IC housing. At least one of the IC's is a configurable IC. In some embodiments, the configurable IC is a reconfigurable IC that can reconfigure more than once during run time. In some of these embodiments, the reconfigurable IC can be reconfigured at a first clock rate that is faster (i.e., larger) than the clock rates of one or more of the other IC's in the PSiP. The first clock rate is faster than the clock rate of all of the other IC's in the PSiP in some embodiments.

Abstract: At least one embodiment provides an interposer including: a lower wiring substrate; an upper wiring substrate disposed over the lower wiring substrate via a gap; and through-electrodes which penetrate through the upper wiring substrate and the lower wiring substrate across the gap to thereby link the upper wiring substrate and the lower wiring substrate, portions of the through-electrodes being exposed in the gap.

Abstract: A method of manufacturing a semiconductor device, includes temporarily fixing a semiconductor chip to a supporting member to direct a connection electrode toward the supporting member side, forming an insulating layer for preventing resin-permeation covering the semiconductor chip, on the supporting member and the semiconductor chip, forming a resin substrate sealing a periphery and a back surface side of the semiconductor chip, on the insulating layer, and removing the supporting member to expose the connection electrode of the semiconductor chip. A build-up wiring is connected directly to the connection electrode of the semiconductor chip.

Abstract: Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.

Abstract: A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a material layer including grooves in a fillet region that are substantially parallel and adjacent an integrated circuit; and forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves.

Abstract: The invention concerns a tubular turbine generator unit including a turbine rotor disk; a drive shaft which is torsion-proof connected with the turbine rotor disk; an electrical generator with a generator rotor and a generator stator, wherein the generator rotor is driven at least via the drive shaft; a tubular turbine housing, which encloses the electrical generator; a bearing assembly, which is arranged inside the tubular turbine housing and enables to support the drive shaft; characterized in that at least one floodable space is provided inside the tubular turbine housing, which is flooded with water in the region of the tubular turbine generator unit, wherein the generator gap between the generator rotor and the generator stator and the bearing gap of the bearing assembly are part of the floodable space.

Abstract: A wind energy apparatus is made up of a plurality of modular wind energy devices or units. Each unit has a housing and at least two turbines mounted on the housing. Each of the turbines has a blade set extending upward from the housing. Each blade set has a vertical axis extending upward in relation to the housing. Each of the turbines has a generator connected thereto, each generator being disposed in the housing, and having a rotor and a stator. Each turbine is rotatably mounted with respect to the housing, and mounted to the rotor so that they rotate together. Each housing has a positive connector and negative connector on each side of the respective unit. The units, when placed together, connect their respective poles, positive and negative, together completing a circuit. Therefore, one may connect multiple units together.

Abstract: In a wind turbine generator, the rotation of the rotor is speeded up by a hydraulic pump and a hydraulic motor and is transferred to a synchronous generator. In a state in which the wind turbine generator is interconnected to a utility grid, and the synchronous generator reaches a synchronous speed, if no mechanical power is transferred to the synchronous generator, a wind-turbine control system operates the synchronous generator as a synchronous condenser, thus controlling the magnitude of the field current of the synchronous generator. Thus, the wind turbine generator can supply reactive power to the utility grid without adding new equipment, such as a reactive power compensator using a semiconductor switch.

Abstract: A hydroelectric power-generating apparatus comprising: (1) a fluid inlet, (2) a diffuser having (a) at least one vane supporting a diffuser hub and (b) a rotor rotatably supported by the diffuser hub and having (i) impeller blades, (ii) an impeller hub, and (iii) a shroud at the periphery of the rotor, the shroud including at least one magnet, and (3) a housing surrounding the shroud and having a rigidly-attached stator including laminations and at least one electrical coil, whereby a flow of fluid through the diffuser and rotor causes the rotation of the rotor and the at least one magnet induces an electric current in the at least one coil.

Abstract: An ocean wave energy converter comprising a structure that is supported above the water and that has means to stabilize the structure, an array of guided independently operated elongate floats that operate from the structure above via two or more guidance arms, wherein each guidance arm is attached to the structure so that the floats pivot about the horizontal axis parallel the length of the floats, each float is attached to the guidance arms at the center of buoyancy of the float, and the floats are substantially parallel to the wave fronts.

Abstract: A fluid driven electrical generation system with most of the electrical generation components in an inner hollow of a housing that is driven to rotate by trapper structures that trap energy from the fluid.

Abstract: Electrical machines, wind turbines, and methods of operating an electrical machine. The electrical machine includes first and second rotatable members that are configured to convert mechanical energy received from the wind turbine rotor into electrical energy. The first rotatable member is coupled with the wind turbine rotor and the second rotatable member is coupled by a gear train with the wind turbine rotor. The gear train, which is driven by rotation of the wind turbine rotor, rotates the second rotatable member relative to the first rotatable member in a direction counter to a direction of rotation of the first rotatable member. The electrical machine may be a generator of the wind turbine.

Abstract: A wind energy generating system includes a driving unit driving a shaft and a power generating module is connected to the driving unit and includes a first stator and a first rotor which rotates relative to the first stator. A blade is fixed to the first rotor by a link. A solar power unit is fixed to the power generating module. A power storage unit is located in the driving unit and a control unit is connected to the driving unit. A detection unit is electrically connected to the control unit. The first rotor rotates relative to the first stator to generate electric power and the detection unit detects the speed of the blade and adjusts the speed of the shaft to increase the relative speed between the first rotor and the first stator, or to slow the speed of the relative speed to protect the blade.

Abstract: Disclosed is a mainframe for receiving a rotor-generator assembly of a gearless wind turbine, wherein the mainframe connects the rotor-generator assembly to the tower of the wind turbine; is rotatably mounted on the tower; and comprises pipe sections arranged at an angle to each other, one of which can be connected to the rotor-generator assembly and the other of which can be connected to the tower. The pipe section that can be connected to the rotor-generator assembly is connected to the lateral surface of the other pipe section by way of an end edge surface facing away from the rotor-generator assembly, and the lateral surface of the other pipe section extends into the region surrounded by the connection.

Abstract: An electric architecture for use on a vehicle has a collector bus for receiving power from a plurality of power sources. The collector bus distributes power to at least a pair of subsystems which are operable at different frequency levels. Each subsystem is provided with a global bus and a local bus, and is utilized to power at least one motor.

Abstract: A method for operating an electric power generating system (EPGS) includes, in one aspect, detecting current limiting conditions in the SSPC, wherein the SSPC includes a main solid state switch in series with an output filter that includes a first solid state switch, and wherein a decoupling filter comprises a second solid state switch. Another aspect includes, based on the detection of the current limiting conditions in the SSPC, opening the first solid state switch and the second solid state switch; detecting an absence of current limiting conditions in the SSPC; and, based on the detection of the absence of current limiting conditions in the SSPC, closing the first solid state switch and the second solid state switch, and powering a direct current (DC) load by a generator of the EPGS via the output filter and the SSPC.

Abstract: In at least some embodiments, an electrically controlled subsea production system includes a subsea electrical distributor that receives a high direct current (DC) voltage. The electrical distributor converts the high DC voltage to a lower DC voltage. The electrically controlled subsea production system also includes a plurality of subsea trees coupled to the subsea electrical distributor, wherein valves of the subsea trees selectively operate based on the lower DC voltage.

Abstract: A power supply system drives a plurality of loads, and includes a power stage circuit, a pulse width modulation controller, a first isolation transformer, at least two second transformers, and at least two rectifier circuits. The power supply system converts external power signals into first alternating current (AC) power signals, and converts the first AC power signals into second AC power signals. The second transformers either boost or buck the second AC power signals, and each has a primary winding connected to a secondary winding of the first isolation transformer in parallel and a center tap grounded. Each of the rectifier circuits is connected to two ends of a secondary winding of a corresponding one of the second transformers, and rectifies the boosted or bucked second AC power signals to output direct current (DC) power signals to a corresponding one of the plurality of loads.

Abstract: This invention provides a master and slave power outlet system with a master outlet and a slave outlet, wherein the master outlet includes a current detecting unit and a first wireless module, and the slave outlet includes a second wireless module. When an operating state of a master device connected to the master outlet changes, an output current may change accordingly. The current detecting unit of the master outlet detects the change in the output current and generates a detecting signal, and the master outlet emits a wireless signal through the wireless module according to the detecting signal. The slave outlet receives the wireless signal and provides a power supply or stops providing the power supply to the slave device connected to the slave outlet.

Abstract: An apparatus for inverting DC voltage to AC voltage by stacking of DC voltage sources from a series of DC voltage sources comprises a plurality of circuits. Each circuit includes a first power switch, a second power switch, and a third power switch. The first power switch allows selective connection of adjacent DC voltage sources in the series to provide stacking of DC voltage sources. The second power switch allows selective connection of a first bus to a corresponding location between adjacent DC voltage sources. The third power switch allows selective connection of a second bus to a corresponding location between adjacent DC voltage sources. Controlling the plurality of power switches produces an AC voltage output by coordinating stacking of DC voltage sources and associated connections to the first bus and the second bus.

Abstract: In one aspect of the present invention, a converter circuit with input voltage balance includes a plurality of modules having inputs electrically series-connected to each other and outputs electrically parallel-connected to each other and a plurality of switching circuits with each electrically connected to an input connection node of a corresponding module and its immediate next module, and configured such that when an input voltage of the corresponding module or its immediate next module is in a desired range from a first predetermine value to a second predetermined value greater than the first predetermined value, the switching circuit operates in an open state, while when the input voltage is out of the desired range, the switching circuit operates in a conductive state so as to regulate the input voltage of the corresponding module or its immediate next module in the desired range.

Abstract: A wireless power infrastructure for delivering wireless power from a wireless network to mobile devices. The infrastructure includes a plurality of power transmission hubs, each hub having: a first capacitor for transmitting a signature frequency for a defined range; and a set of second capacitors, each for transmitting resonant wireless power within the defined range at a selectable frequency. A mobile device for obtaining wireless resonant the plurality of power transmission hubs is also described, and includes: a first variable capacitor for detecting a signature frequency associated with a proximately located power transmission hub; a second variable capacitor for receiving wireless resonant capacitor from the proximately located power transmission hub; and a synchronization system for setting the second variable capacitor to a frequency that is synchronized with a wireless resonant power transmission of the proximately located power transmission hub.

Abstract: Inductive power providing systems suitable for wet environments are disclosed. Water resistant inductive outlets include primary inductors incorporated into water resistant work-surfaces. Water resistant inductive power receivers include secondary inductors incorporated into water resistant casings. Secondary inductors are configured to couple with primary inductors thereby providing power to electrical loads connected thereto.

Abstract: There is disclosed a system for transferring energy wirelessly by an evanescent electromagnetic field. The system includes a housing including electrically conducting walls defining a space and an injector configured to inject electromagnetic waves into the space. A wall of the housing is configured to be placed adjacent to an electromagnetic energy reception device and includes one or more apertures. The frequency of the electromagnetic waves is lower than the cutoff frequency of the housing, and the one or more apertures have a size smaller than the waves wavelength so that an evanescent electromagnetic field is emitted from the one or more apertures of the wall and may reach the energy reception device.

Abstract: A power transfer system includes a power transmission device and a power reception device. A central conductor and a peripheral conductor are formed near the upper surface of a casing of the power transmission device. The peripheral conductor surrounds the central conductor in an insulated state from the central conductor. An alternating voltage generating circuit is provided for the power transmission device and applies an alternating voltage between the central conductor and the peripheral conductor. A central conductor and a peripheral conductor are formed near the lower surface of a casing of the power reception device. The peripheral conductor surrounds the central conductor in an insulated state from the central conductor. A load circuit is provided for the power reception device, and a voltage induced between the central conductor and the peripheral conductor is applied to the load circuit.

Abstract: A variable frequency drive system for controlling the frequency of a high-voltage power source supplied to a first electric motor includes a transformer section that includes a motorized loadbreak switch system, control power transformers, a controller programmed with control logic to ensure that the motorized loadbreak switch system opens contacts between the high-voltage power source and the variable frequency drive system once the power source is removed, and a tank containing a dielectric fluid, wherein the tank also contains, within the dielectric fluid, a manual isolation switch to supply or remove power to the transformer section, an impedance for use in soft-starting the variable frequency drive system, a primary winding, and a plurality of phase-shifted secondary windings.

Abstract: A system comprising a photovoltaic module and a terminal box. Two terminals of the box output voltage generated by the photovoltaic module. A thermal switch shorts the two terminals in response to temperature rise to a threshold temperature and is structured to prevent short-circuit due to the temperature rise of the normally operating photovoltaic module and bypass diodes in the terminal box.

Abstract: A stator core unit of a linear synchronous motor is divided into a plurality of divided cores. The divided cores each include a pair of connected portions. The pairs of connected portions are disposed along a first direct drive shaft and a second direct drive shaft to form a pair of connected portion arrays. A yoke is constituted from a pair of yoke elements which are formed of a magnetic conductive material and magnetically connect the connected portions of the pair of connected portion arrays. A first array of permanent magnets and a second array of permanent magnets are disposed to be shifted from each other by an electrical angle of 180°. A first array of windings and a second array of windings are excited with the first and second arrays of windings being shifted by an electrical angle of 180°.

Abstract: A rotating electrical machine configured with a rotor and stator. The rotor is rotatably supported radially inside of a stator that has coil end portions on both sides in an axial direction, and which is structured so that oil is supplied from an axial first direction side to the coil end portions on the both sides in the axial direction. A communication oil passage provided in at least one of the rotor and the rotor support member, is configured to communicate with a first opening and a second opening from an oil collecting portion. The first opening opens radially inside the coil end portion on the axial first direction side, and the second opening opens radially inside the coil end portion on an axial second direction side, which is the other side in the axial direction of the rotor.

Abstract: According to one embodiment, a traction motor includes a stator core, a rotor core, a first bearing, a second bearing, a rotor shaft, a first ventilation passage made at an outer circumference portion of the stator core, a first fan, and a second ventilation passage to introduce external air. And, in the motor, a first minute gap is provided between an end portion of a first fan main plate and an inner circumference portion of the first bracket, cooling wind is discharged to the motor outside via the second ventilation passage, an outer circumference portion of the first fan, a ventilation portion in the first bracket and the first ventilation passage, and the second ventilation passage is made so that the cooling wind entered from the first air intake port flows around the rotor shaft portion between the first ventilation fan and the first bearing.