Abstract: The Eph (erythropoietin-producing hepatocellular carcinoma) receptors and their cell surface anchored ligands, the Ephrins, comprise the largest of the receptor tyrosine kinases families with 14 receptors and 8 ligands. The receptors are subdivided into Eph-A and Eph-B categories and have known actions in the development of the vascular and nervous system. The present invention relates to an isolated mesenchymal stem cell selected from the group consisting of an isolated mesenchymal stem cell that expresses Ephrin-B2, an isolated mesenchymal stem cell that over-expresses Ephrin-B2, and an isolated mesenchymal stem cell that is genetically modified to increase Ephrin-B2 expression. The invention further relates to the various applications of the isolated mesenchymal stem cells of the present invention.

Abstract: The present invention relates generally to methods for stimulating T cells, and more particularly, to methods to eliminate undesired (e.g., autoreactive, alloreactive, pathogenic) subpopulations of T cells from a mixed population of T cells, thereby restoring the normal immune repertoire of said T cells. The present invention also relates to compositions of cells, including stimulated T cells having restored immune repertoire and uses thereof.

Abstract: Hematopoietic stem cells and methods for ex vivo expansion of hematopoietic stem cells are provided. The methods comprise culturing the cells in a media containing an effective amount insulin-like growth factor(IGF), fibroblast growth factor (FGF), thrombopoietin (TPO), and stem cell factor (SCF), under conditions sufficient for expansion of said cells. Methods for identifying expanded hematopoeitc stem cells and kits for ex vivo expansion of hematopoietic stem cells are also provided.

Abstract: Compositions and methods useful for inducing an increase in fatty acid oxidation or mitochondrial biogenesis, reducing weight gain, inducing weight loss, or increasing Sirt1, Sirt3, or AMPK activity are provided herein. Such compositions can contain synergizing amounts of a sirtuin-pathway activators, including but not limited to resveratrol, in combination with beta-hydroxymethylbutyrate (HMB), keto isocaproic acid (KIC), leucine, or combinations of HMB, KIC and leucine.

Abstract: The present invention is generally in the field of neurological diseases and disorders, particular in the field of neurodegenerative diseases in which the myelin cover of nerves is lost. IL6R/IL6 chimera is used to promote the formation of oligodendrocytes from embryonic stem cells for treatment of neurodegenerative diseases or posttraumatic nerve damage.

Abstract: A modified P. aeruginosa type III secretion system has been developed that efficiently delivers selected proteins into a host cell. In one example, a functional nuclear Cre Recombinase is injected into embryonic stem (ES) cells and can be used to induce pluripotent stem (iPS) cells. This method of in vitro lineage directed differentiation prevents insertional mutagenesis and provides a route to selected stem cell renewal and cell-based therapies.

Abstract: Methods, compositions, and kits for repairing damaged myocardium and/or myocardial cells including the administration of cytokines, variants of cytokines, cardiac stem cells, or combinations thereof are disclosed and claimed. In addition, methods, compositions, and kits for forming coronary vasculature including the administration of cytokines, variants of cytokines, cardiac stem cells, or combinations thereof are described. In particular, administration of variants of hepatocyte growth factor, such as NK1, 1K1, and HP11, are useful for the repair and/or regeneration of damaged myocardium or formation of coronary vasculature. Methods of activating cardiac stem cells in vitro are also disclosed.

Abstract: The invention provides a method of isolating dermal stem cells, having the steps of subjecting cells separated from the skin by enzyme treatment to suspension culture, and isolating cells positive for stem cell markers from the cultured cells.

Abstract: Systems and methods for the removal of contaminants from a liquid culture microalgae and/or cyanobacteria comprise an inlet tube, a pump, a gas injector, a vertical chamber, and/or a collection container that promotes the production of foam in the microalgae culture, wherein the foam contains the contaminants.

Abstract: A hydrogel tissue engineering scaffold having microbubbles dispersed therein is disclosed. Also, a system for cell culturing including a controller and actuator to apply dynamic deformational loading to a hydrogel is disclosed. Also disclosed are methods for producing hydrogels with microbubbles and for culturing cells using hydrogels with microbubbles.

Abstract: The present invention discloses a composition that contains (1) an effective amount of an analgesically and/or anti-inflammatory active fraction separated from a mixture of plasma and/or serum, and (2) at least one metal, metal ion or metal salt, in which the mixture has been denatured. Also disclosed are methods of producing the composition for treating a subject afflicted with inflammation and/or pain.

Abstract: A protein scaffold based on a consensus sequence of the tenth fibronectin type III (FN3) repeat from human fibronectin, preferably human Tenascin, that binds to human TNF? including isolated nucleic acids that encode a protein scaffold, vectors, host cells, and methods of making and using thereof have applications in diagnostic and/or therapeutic compositions, methods and devices.

Abstract: The present invention is directed to a pre-coated substrate, such as a slide, that is useful for immobilizing a sample. The invention is further provides methods of preparing such pre-coated substrates and methods of analyzing biological samples immobilized on such pre-coated substrate. The substrate is coated with a polycationic polymeric coating material specifically selected such that that coated substrate exhibits increased stability and prolonged shelf-life. Preferred polymeric coating materials include allylic or vinylic polymers having cationic groups thereon and having no more than a small percentage of peptidic monomeric linkages, particularly polydiallyldimethylammonium (PDDA).

Abstract: Methods for analyzing mixtures of polysaccharides, for example heparin such as unfractionated heparin and enoxaparin are described. In some instances, the mixtures are analyzed using fast performance liquid chromatography (FPLC) and high liquid performance chromatography (HPLC), e.g., strong anion exchange HPLC.

Abstract: Methods and kits to detect and quantitate NOx compounds in a biological sample are provided. The methods include reacting a mixture that includes a nitrite compound and a chromogenic reagent to form a colored compound, contacting the mixture with a retention medium configured to retain the colored compound, and detecting the colored compound retained on the retention medium.

Abstract: Quantification of vitamin D2, vitamin D3, and the monohydroxy and diihydroxy metabolites of vitamin D2 and vitamin D3, can comprise labeling analytes with mass spectrometry (MS) tagging reagents and performing LC-MSMS analysis of the labeled analytes. The labeled analytes can include a labeled standard and can have distinct retention times on a reversed phase column, as well as distinct masses. Under high energy collisions, reporter groups can be generated. The intensity or the peak area detected for each reporter group can be used for quantitation. In some embodiments, a one-step tagging reagent is used that is a dienophile-containing, labeled Diels Alder reagent.

Abstract: A method and device for merging and mixing at least two separate and distinct fluid drops on a substrate, includes a drop merging area on the surface, where a first magnetic material is placed at a first location. A first drop of fluid is then placed at the first location on the surface, resulting in the first magnetic material being at least partially positioned within the first drop of fluid. A second drop of fluid is then placed at a second location on the surface of the drop merging area. A magnetic field is applied by a varying magnetic field generator to at least a portion of the drop merge area of the substrate, which includes at least the first location on the substrate. The varying magnetic field will act on the first magnetic material to move the first magnetic material within the first drop of fluid, causing a stirring of the fluid. A drop merging force from a drop merging mechanism is applied to at least one of the first drop of fluid and the second drop of fluid within the drop merge area.

Abstract: Co-topo-polymeric indicator compositions and methods for making and using the same are provided. Indicator compositions of the invention include a polymer and undergo a color change, which may be reversible or irreversible, in response to an applied stimulus, e.g., temperature. Aspects of methods of producing the compositions include setting a fluid co-topo-polymeric precursor composition into a solid product and then subjecting the solid product (either immediately or after a delay period) to polymerizing conditions to produce the desired indicator composition. Also provided are indicator devices that include the indicator compositions of the invention. The compositions of the invention find use in a variety of different applications.

Abstract: A comprehensive approach for interpretation of the multiple spiking isotope dilution results is described herein. It has now been found that a method of multiple spiking isotope dilution analysis for mass spectrometry is possible using an approach that permits precise and simultaneous characterization of m substances from a sample even if species inter-conversion (degradation and formation) has occurred prior to separation. Advantageously, initial and final amounts of involved analytes, conversion extent, conversion degree and rate constants from the results of a single quantitation experiment may be obtained with the present method. In a particularly advantageous embodiment, uncertainty in the characterization of the substances may be estimated more accurately by also estimating increase in the uncertainty due to inter-conversion of the analytes.

Abstract: The present disclosure relates to methods that may be used for the detection of allergens.

Abstract: A method of processing animal sperm cells that includes: collecting sperm cells from a male animal; sorting the sperm cells to obtain a quantity of sperm cells having a desired characteristic, the quantity of sorted sperm cells being contained in a first volume of fluid having a first concentration of sperm cells; and subjecting the sperm cells to concentration steps in which the concentration of the sperm cells is increased to a second concentration greater than the first concentration.

Abstract: The movement and mixing of microdroplets through microchannels is described employing silicon-based microscale devices, comprising microdroplet transport channels, reaction regions, electrophoresis modules, and radiation detectors. The discrete droplets are differentially heated and propelled through etched channels. Electronic components are fabricated on the same substrate material, allowing sensors and controlling circuitry to be incorporated in the same device.

Abstract: The identification of triptolide target molecules is described. Also described are methods of screening triptolide-related compounds for binding to these molecules, including screening for enhanced and/or selective binding, and expression analysis of the target molecules in normal and in diseased tissue.

Abstract: A method for determining the presence or amount of a metal-labelled species in a sample may include causing the metal of the metal-labelled species in the sample to form a soluble electrochemically-active complex which is stable relative to moieties present or potentially present in the sample which will form an insoluble and/or electrochemically-inactive complex with the metal, and electrochemically measuring the formed complex to provide an indication of the presence or amount of the metal-labelled species.

Abstract: A method for producing a substrate, the method including: forming a porous zone in an inner layer of the substrate; progressively thinning a thickness of the substrate towards the inner layer including the porous zone; completing the progressively thinning by polishing; and controlled stopping of the polishing by detecting the porous zone during the polishing, the detecting including measuring at least one measurable physical parameter admitting a significant variation during a transition between two layers.

Abstract: The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.

Abstract: A display device includes an array substrate, a driving film and an adhesive member. The array substrate includes a first base substrate, a plurality of first signal pads formed on the first base substrate and a first dummy pad formed adjacent to the first signal pads. The driving film includes a base film, a plurality of output terminals formed on the base film and a first alignment mark formed adjacent to the output terminals. The adhesive member adheres the first signal pads to the output terminals, and adheres the first dummy pad to the first alignment mark.

Abstract: The method includes the steps of preparing an epitaxial wafer by forming a multilayer semiconductor structure on a main surface of a substrate; forming stripe electrodes and bonding pads on the multilayer semiconductor structure with the bonding pads being respectively electrically connected to the stripe electrodes; forming a projection portion on the multilayer semiconductor structure; forming laser diode (LD) bars by cutting the epitaxial wafer; arranging the LD bars on a support surface such that a side surface thereof is oriented normal to the support surface, and disposing spacers between the LD bars; and forming a coating film on the side surface. The projection portion has a height, measured from the main surface of the substrate, greater than a height of the stripe electrodes. Furthermore, the laser diode bar has at least one projection portion.

Abstract: A method for manufacturing a semiconductor laser includes the steps of preparing a mold with a pattern surface having recesses, forming a stacked semiconductor layer including a grating layer, forming a resin part on the grating layer, forming a resin pattern portion on the resin part, forming a diffraction grating by etching the grating layer using the resin part as a mask, and forming a mesa-structure on the stacked semiconductor layer. Each of the recesses includes two end portions and a middle portion between the two end portions. A depth of at least one of the two end portions from the pattern surface is greater than that of the middle portion. The step of forming the mesa-structure includes the step of etching the stacked semiconductor layer so as to remove end portions of the diffraction grating in a direction orthogonal to a periodic direction thereof.

Abstract: A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Abstract: A method of producing a semiconductor device includes forming, on a first insulating film formed on a substrate, a first groove in an element-forming region to form one of a via and a wiring therein, and a first seal ring groove in a seal ring part, forming one of a via and a wiring in the first groove and a first metal layer in the first seal ring groove, and then removing the metal material in a part exposed to an outside of the first groove and the first seal ring groove, forming a second insulating film on the first insulating film, forming, on the second insulating film, a second groove, and a second seal ring groove in the seal ring part on the first seal ring groove, and forming one of a via and a wiring in the second groove and a second metal layer.

Abstract: In an annealing process, a Kesterite film is provided on a substrate. The Kesterite film and the substrate are generally planar, have an interface, and have a substrate exterior side and a Kesterite exterior side. An additional step includes locating the cap adjacent the Kesterite exterior side. A further step includes applying sufficient heat to the Kesterite film and the substrate for a sufficient time to anneal the Kesterite film. The annealing is carried out with the cap adjacent the Kesterite exterior side. In another aspect, the film is not limited to Kesterite, and the cap is employed without any precursor layer thereon. Solar cell manufacturing techniques employing the annealing techniques are also disclosed.

Abstract: A chemical bath deposition method is presented to prepare different thin films on plane substrates. In particular, they are useful to deposit CdS or ZnS buffer layers in manufacture of thin film solar cells. This method and the deposition apparatus deposit thin films onto vertically travelling plane workpieces delivered by a conveyor belt. The thin films are deposited by continuously spraying the reaction solutions from their freshly mixed styles to gradually aged forms until the designed thickness is obtained. The substrates and the solutions are heated to a reaction temperature. During the deposition processes, the front surfaces of the substrates are totally covered with the sprayed solutions but the substrate backsides are remained dry. The reaction ambience inside the reactor can be isolated from the outside atmosphere. The method is designed to generate a minimum amount of waste solutions for chemical treatments.

Abstract: A method for forming a thin film photovoltaic device may include providing a transparent substrate and forming a multi layered structure including at least a thin layer of indium material, copper material, and another layer of indium. A heat treatment may be performed that consumes substantially all of the thin layer of indium material into a portion of a copper indium disulfide alloy material. The method causes formation of a copper sulfide material overlying the copper indium disulfide alloy material during at least the thermal treatment process.

Abstract: A thermoelectric converter is made of a first thermoelectric conversion material in which at least one type of second thermoelectric conversion material particles having an average size of 1 to 100 nm is dispersed. At least a part of the second thermoelectric conversion material particles is dispersed at a distance not more than the mean free path of the phonons of the first thermoelectric conversion material.

Abstract: A manufacturing method of an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a thin film transistor panel; forming a deposition mask on the thin film transistor panel by a photolithography process; obliquely spraying an organic material to the deposition mask from a linear deposition source to form an organic emission layer on the thin film transistor panel; and removing the deposition mask by using an adhering film, wherein the deposition mask includes a plurality of deposition walls configured to block the organic material sprayed at an angle that is less than a blocking angle. Accordingly, the deposition mask is formed by the photolithography process such that alignment of the deposition mask is straightforward when manufacturing the organic light emitting diode (OLED) display of a large size.

Abstract: It is an object to provide a semiconductor device having excellent electric characteristics or high reliability, or a manufacturing method thereof. A semiconductor device including a gate electrode, an oxide semiconductor layer overlapping with the gate electrode, a source electrode and a drain electrode in contact with the oxide semiconductor layer, and a gate insulating layer provided between the gate electrode and the oxide semiconductor layer is provided. The oxide semiconductor layer is formed by a facing target sputtering method. The carrier concentration of the oxide semiconductor is less than 1×1012/cm3.

Abstract: Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Abstract: A method of manufacturing a semiconductor device includes the steps of forming a plurality of first integrated circuits on the surface side of a first semiconductor substrate; forming a plurality of second integrated circuits in a semiconductor layer that is formed on a release layer provided on a second semiconductor substrate; bonding the two semiconductor substrates so that electrically bonding portions are bonded to each other to form a bonded structure; separating the second semiconductor substrate from the bonded structure at the release layer to transfer, to the first semiconductor substrate, the semiconductor layer in which the plurality of second integrated circuits are formed; and dicing the first semiconductor substrate to obtain stacked chips each including the first integrated circuit and the second integrated circuit.

Abstract: A semiconductor device manufacturing method is provided. First and second semiconductor chips are prepared, including first and second electrodes on first and second surfaces respectively. The second semiconductor chip includes a third electrode on a third surface opposite to the second surface. The third electrode overlaps the second electrode. The second surface includes an electrode-free region that is free of any electrode. A sealing resin is applied on the first surface of the first semiconductor chip. A second surface of the first semiconductor chip is held by a bonding tool including a pressing surface and a supporting-portion projected from the pressing surface. The pressing surface is made into contact with the second electrode. The supporting-portion is arranged at a position facing the electrode-free region. The second semiconductor chip is stacked over the first semiconductor chip by the bonding tool to electrically connect the third electrode to the first electrode.

Abstract: A method of manufacture of a stacked integrated circuit package-in-package system includes forming a substrate with a top contact, mounting a first device having a first terminal over the substrate, stacking a second device having a second terminal over the first device in an offset configuration, connecting the first terminal to the top contact below the first terminal, and connecting the second terminal to the top contact below the second terminal.

Abstract: Methods of forming bonded semiconductor structures include forming through wafer interconnects through a layer of material of a first substrate structure, bonding one or more semiconductor structures over the layer of material, and electrically coupling the semiconductor structures with the through wafer interconnects. A second substrate structure may be bonded over the processed semiconductor structures on a side thereof opposite the first substrate structure. A portion of the first substrate structure then may be removed, leaving the layer of material with the through wafer interconnects therein attached to the processed semiconductor structures. At least one through wafer interconnects then may be electrically coupled to a conductive feature of another structure, after which the second substrate structure may be removed. Bonded semiconductor structures are formed using such methods.

Abstract: A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.

Abstract: A method and apparatus for mounting microelectronic chips to a thermal heat sink. The chips are arranged in a desired configuration with their active faces all facing a common direction and with their active faces defining a common planar surface for all of said chips. A metallic material is applied to the chip, preferably by electroplating to backsides of the chips, the metallic material being electro-formed thereon and making void-free contact with the backsides of the chips.

Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A display device includes a display unit, a sealing substrate, a first metal layer, a second metal layer, and a conductive wire member. The display unit is formed over a substrate. A sealing substrate is secured to the substrate by a bonding layer, and comprising a composite member and an insulating member. A first metal layer is formed over the inner surface of the sealing substrate facing the substrate, and a second metal layer is formed over the outer surface of the sealing substrate. A conductive wire member successively passes through at least two points of each of the first metal layer, the insulating member, and the second metal layer, and is secured to the sealing substrate to provide conduction of the first metal layer and the second metal layer.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead overhang at an obtuse angle to a lead top side and having a lead ridge protruding from a lead non-horizontal side, the lead overhang having a lead overhang-undercut side at an acute angle to a lead overhang non-horizontal side; forming a lead conductive cap completely covering the lead overhang non-horizontal side and the lead top side; forming a package paddle adjacent the lead; mounting an integrated circuit over the package paddle; and forming an encapsulation over the integrated circuit, the package paddle, and the lead.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.