Abstract: Disclosed herein are a printed circuit board including: an insulating layer; and a metal circuit layer formed on at least one surface of the insulating layer, wherein the metal circuit layer has surface roughness on only its one surface, and a method of manufacturing the same.

Abstract: A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. A process for the preparation of a printed wiring board, comprising a step of forming a curable resin layer and a non-curable resin layer sequentially on a surface of a substrate; a step of forming depressions in the non-curable resin layer and the curable resin layer from the non-curable resin layer side; a step of applying a catalyst for plating to a surface of the non-curable resin layer and surfaces of the depressions; a step of removing the non-curable resin layer and the catalyst for plating provided on the surface of the non-curable resin layer; and a step of electroless plating the surfaces of the depressions.

Abstract: A package substrate is disclosed. The package substrate includes a base layer and a dam structure or a dent structure on at least one side of the base layer. The base layer may be a CCL core, a molding compound, or an epoxy base.

Abstract: A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal layer includes at least nickel, palladium and gold formed on part of the surface of the circuit layer on the chip board. A copper-tin intermetallic compound is formed on joints of the second solder and the surface treatment metal layer, and the other part of the circuit layer is directly connected to the solder to form the copper-tin intermetallic compound. In addition to the lower package cost, with the shape feature of the copper-tin intermetallic compound, it is possible to increase the contact area with the solder, thereby improving the reliability of the soldering process and the yield.

Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.

Abstract: Circuit with flat electromagnetic band gap resonance structure, includes a plurality of flat units formed at a conductor layer; each flat unit spirally revolves inward from a first end to an internal point following a rotation direction, and spirally revolves outward from the internal point to a second end following an opposite rotation direction. Each flat unit is connected to a ground plane by a conductive stand (e.g., a via) at a connection point, for suppressing noise resonances at certain frequencies, and the frequencies are related to a stub length of each flat unit, and the stub length is related to a route length from the connection point to an end.

Abstract: A fixing member for mounting a heat sink to a circuit board without screws includes a connecting portion through the heat sink and the circuit board, and a blocking portion connected to a bottom end of the connecting portion to latch in a bottom surface of the circuit board. A resilient portion connected to a top end of the connecting portion and bearing down on a top surface of the heat sink is deformable to enable the initial latching of the hooked portion in the bottom surface of the circuit board.

Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.

Abstract: A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

Abstract: This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

Abstract: A printed circuit board and a preparation method thereof. The preparation method includes: making a first through hole in a core board including a metal layer; filling copper into the first through hole; forming a circuit pattern of the metal layer of the core board through an alkaline etching process; successively laminating a dielectric layer and a first copper foil on one side of the core board; making a second through hole opposite to and communicated with the first through hole, in the first copper foil; filling copper into the second through hole; and forming a circuit pattern of the first copper foil. The method for preparing the printed circuit board provided in the present invention can effectively reduce the preparation cost of the printed circuit board, greatly increase the yield of a product and further improve the universality of application.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a representative preferred embodiment of the present invention, it is possible to protect a line width of a circuit pattern and suppress an undercut by providing the printed circuit board in which etched grooves are formed at both sides of a seed layer of the circuit pattern.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed to at least one of the first and second side surfaces, and second internal electrodes each having a second lead part exposed to the at least one of the first and second side surfaces, thereby forming capacitance; an upper cover layer formed on an upper portion of the active layer in the thickness direction; a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater than that of the upper cover layer; a first external; and a second external electrode.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.

Abstract: An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.

Abstract: There is provided an embedded multilayer ceramic electronic component including a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.

Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers; first internal electrodes and second internal electrodes having first and second leads; first dummy electrodes and second dummy electrodes; and first and second external electrodes, wherein when a length from ends of the first and second external electrodes formed on first and second lateral surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is G, a length of the first and second external electrodes formed on the first and second lateral surfaces of the ceramic body up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is M, 30 ?m?G<BW?M is satisfied.

Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.

Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L?0.

Abstract: The invention relates to a soldering method and a corresponding soldering device for soldering a printed circuit board (2) to an electric component (8) using a solder (6, 7), said solder (6, 7) being melted by heat and then connecting the component (8) to the printed circuit board (2). The heat required to melt the solder (6, 7) is generated by electrically energizing the component (8), thereby generating an electric heat loss in the component (8), said heat loss being transferred from the component (8) to the solder (6, 7) and melting the solder (6, 7).

Abstract: The present invention pertains to a submount for mechanically and electrically coupling an electronic component to a carrier. The submount has a mounting portion for mounting the submount to the carrier and has attachment portions for holding the electronic component. The submount further has primary electric contacts for cooperation with respective electrical conductors in the carrier, and secondary electric contacts for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

Abstract: A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on a second side surface of the composite body; and a ground terminal disposed on a first side surface of the composite body and connected to the internal electrodes of the capacitor.

Abstract: A pattern of micro-wires in a layer over which ink is to be coated to form micro-wires includes a substrate with first, second, and third regions. A plurality of connected first micro-channels, second micro-channels, and third micro-channels are formed in the first, second, and third regions having first, second, and third micro-channel densities, respectively. The first density is greater than the second density and the second density is greater than the third density. Thus, the density of the layer monotonically decreases from the first region to the second region and from the second region to the third region so that the ink coated over the layer is more effectively distributed.

Abstract: Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment includes a support member having first package bond sites electrically coupled to leadframe bond sites. A microelectronic die can be carried by the support member and electrically coupled to the first packaged bond sites. A leadframe can be attached to the leadframe bond sites so as to extend adjacent to the microelectronic die, with the die positioned between the leadframe and the support member. The leadframe can include second package bond sites facing away from the first package bond sites. An encapsulant can at least partially surround the leadframe and the microelectronic die, with the first and second package bond sites accessible from outside the encapsulant.

Abstract: A thin package structure with enhanced strength includes a support carrier plate and a thin circuit board. The thin circuit board is formed on the support carrier plate and includes a first circuit layer, a dielectric layer and a second circuit layer. The first circuit layer includes the first circuit patterns and the first connection pads. The dielectric layer covers the first circuit layer. The second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes the second circuit patterns and the second connection pads. Connection plugs are formed in the dielectric layer to connect the first and second connection pads. The support carrier plate provides mechanical strength to avoid warping or deforming. It is feasible to direct test the package structure without disassembling so as to improve the convenience in testing.

Abstract: Disclosed herein is a laminate for a printed circuit board, a printed circuit board using the same, and a method of manufacturing the same. A laminate according to a preferred embodiment includes a primer layer formed on a metal foil and a resin layer formed on the primer layer.

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract: Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

Abstract: A power transmission assembly includes a first main bus including a first large bus bar and a first small bus bar. The first large bus bar is defined by a cross-sectional area larger than the first small bus bar. The first main bus defines a first axis passing through the first large bus bar and the second small bus bar. The power transmission assembly includes a second main bus including a second large bus bar and a second small bus bar. The second main bus defines a second axis passing through the second large bus bar and the second small bus bar, the second axis being substantially parallel to the first axis. The first main bus is located along a third axis substantially perpendicular to the first axis and passing through each of the first main bus and the second main bus.

Abstract: A wire harness includes one or more electrically-conducting paths, and a tubular exterior member configured to cover the electrically-conducting paths. The exterior member is a resin member including a flexible tubular part having flexibility and a less-flexible tubular part having less flexibility than that of the flexible tubular part. The exterior member is integrally formed to have a linear shape as a whole in a state where the flexible tubular part is not deflected.

Abstract: A conductive insert which provides a low resistance bond between low conductive materials. The insert includes a first surface and an oppositely facing second surface. A plurality of openings extends between the first surface and the second surface. At least one first projection extends from the first surface proximate respective first openings, the at least one first projections extend from the first surface in a direction away from the second surface. At least one second projection extends from the second surface proximate respective second openings, the at least one second projections extend from the second surface in a direction away from the first surface. The insert provides a stable, low resistance electrically conductive path between the conductive materials.

Abstract: A solder tail extender connector and method are provided for implementing production of solder tail extender connectors from compliant pins. A forming fixture is provided to collapse compliant pins prior to soldering. The compliant pin is collapsed at or beyond the normal compliant pin low end dimensions and removed from the forming fixture. A solder tail extender optionally is added to the collapsed compliant pin, forming the solder tail extender connector.

Abstract: Injection of gas into a managed pressure drilling system to provide for operation of the drilling system in a downhole pressure window defined by the pore pressure of a formation being drilled and a fracture pressure of the formation. Gas injection being controlled so as to produce the desired downhole pressure without causing large oscillations in borehole pressure.

Abstract: An apparatus for communicating a signal to or from a downhole tool includes a drill pipe configured to be rotated to drill a borehole, a tubular under axial tension and secured in the drill pipe, and a retention device secured to the tubular and configured to maintain the tubular under the axial tension. The retention device includes a portion extending from a body of the device in a direction that is non-inward-radial with respect to a longitudinal axis of the drill pipe. The apparatus further includes a transmission line disposed in the tubular and in an opening of the retention device and in communication with the downhole tool.

Abstract: An apparatus for communicating a signal downhole includes a drill pipe configured to be rotated to drill the borehole and a tube under axial tension and secured in the drill pipe, wherein the axial tension occurs at least with the drill pipe not under axial tension. The apparatus further includes a connector sleeve sealed to an end of the tube and configured to secure the tube under the axial tension to the drill pipe and to provide a sealing surface for a connector to seal to. The apparatus further includes a transmission line configured to communicate the signal. The transmission line is disposed in the tube and has a length greater than the length of the tube and extending past the connector sleeve.

Abstract: A drill pipe (1), particularly for a drill string, has at least one electrical conductor (4, 7, 8, 9) and an inner pipe (2) which is arranged inside the drill pipe (1). The drill pipe (1) and the inner pipe (2) are spaced at a distance to one another in sections, wherein the drill pipe (1) and inner pipe (2) bound a hollow space (3). At least one electrical conductor (4, 7, 8, 9) is arranged on one outer side of the inner pipe.

Abstract: A pressure pulse generating method and apparatus for use with a drill string includes a top and bottom subs for attaching the apparatus within the drill string; a power section comprising a rotor/stator; a drive assembly; and a nozzle sub which includes a nozzle assembly comprising a nozzle holder and a replaceable nozzle; and a nozzle housing having pulse openings. The nozzle holder has fluid ports which periodically align with the pulse openings as the nozzle holder rotates within the nozzle housing to achieve a desired pulse amplitude, frequency and waveform.

Abstract: An off-axis “cam” drilling tool is provided. The off-axis “cam” drilling tool includes an outer tubing having a throughbore therein, an inner tubing having a throughbore therein, the inner tubing being configured to be inserted within the throughbore of the outer tubing. An annulus is defined between the inner tubing and the throughbore of the outer tubing through which a medium may pass. A cam section can be configured on a portion of the exterior surface of the outer tubing. The outer tubing can be coupled to drill rods of a drill string. The cam section has an axis that is offset to an axis of the outer tubing, and the tool is configured to rotate about cam section axis to lift the drill rods coupled to the outer tubing above a centerline of a drill bore to beneficially orient the drill bit drilling the drill bore.

Abstract: A housing, mandrel and bearing assembly positionable in a wellbore includes a torque transmission member adapted to connect to a source of rotational torque (e.g. a downhole motor power output) and a tubular mandrel adapted to connect to a drill bit. A lower tubular housing is adapted to contain a lower bearing and catch sleeve assembly. The catch assembly is adapted to retain the mandrel in the lower housing if the mandrel breaks. An upper tubular housing contains an upper bearing and is adapted to connect to a housing of the downhole motor. A method of assembling the downhole housing, mandrel and bearing assembly is disclosed.

Abstract: A manifold directs the flow of drilling mud from a drilling rig. A longitudinal tubular body has a first end and a second end, such that the longitudinal tubular body is supported by at least two supports of a platform. The platform can support a monorail that is parallel to the longitudinal tubular body, so that it is five feet of the longitudinal tubular body. The longitudinal tubular body can have at least three side directed input ports so that the ports are adapted to receive a mud pipe for attachment. Each of the three side-directed input ports can face substantially towards and above the monorail to provide unobstructed lateral attachment of a mud pipe to the longitudinal tubular body.

Abstract: Collection device for connecting a drilling tool, such as a bit, to the end of a drilling column, in which the connection device comprises a first element, with a first end, intended to be connected to the end of the drilling column, and a second element, with a second end, intended to be connected to the drilling tool, in which the second element is fixed to the first element so as to allow a translational movement in a longitudinal direction in order to make it possible to change the distance between the first end and this second end, characterized in that the connection device comprises a “pusher” structure for transmitting a thrust force from this first element towards the second element, comprising a set of “Belleville” washers making it possible to ensure that said thrust force, from the first element toward the second element, is substantially constant in any position of the second element with respect to the first element.

Abstract: Methods of fabricating earth-boring tools include forming an outer portion of an earth-boring tool from a powder mixture comprising hard particles and matrix particles comprising a metal matrix material, disposing a molten material at least partially within the outer portion of the earth-boring tool, and forming the molten material into another portion of the earth-boring tool. Methods of fabricating a bit body of an earth-boring rotary drill bit include forming an outer portion comprising a plurality of hard particles and a plurality of matrix particles comprising a metal matrix material and casting a molten material at least partially within the outer portion of the bit body to form another portion of the bit body. Earth-boring tools include a body for engaging a subterranean borehole having an outer portion and an inner portion comprising at least one material solidified within a cavity formed within the outer portion.

Abstract: A drill bit for use in percussive drilling includes a body having a front face, at least one face button on the front face, and a plurality of gauge buttons. Each of the buttons has a working face. At least a portion of at least one gauge button working face has a curvature which deviates further from being flat by comparison to a curvature of any curved portion of at least one face button working face, so that the portion of at least one gauge button working face projects further than the portion of at least one face button working face.

Abstract: A polycrystalline compact comprises a plurality of grains of hard material and a plurality of nanoparticles disposed in interstitial spaces between the plurality of grains of hard material. The nanoparticles have cores of a first material and at least one oxide material on the cores. An earth-boring tool comprises such a polycrystalline compact. A method of forming a polycrystalline compact comprises combining a plurality of hard particles with a plurality of nanoparticles to form a mixture and sintering the mixture to form a polycrystalline hard material comprising a plurality of interbonded grains of hard material. A method of forming a cutting element comprises infiltrating interstitial spaces between interbonded grains of hard material in a polycrystalline material with a plurality of nanoparticles.

Abstract: A method of making a body of polycrystalline superhard material comprising placing an aggregated mass of grains of superhard material into a canister, placing a ceramic layer either in direct contact with the aggregated mass of grains of superhard material or in indirect contact therewith, the ceramic layer being spaced from the grains by an interlayer of material when present, the ceramic layer having a surface with surface topology, the surface topology imprinting a pattern in the aggregated mass of grains of superhard material complementary to the surface topology, the ceramic material and the material of the interlayer being such that they do not react chemically with the superhard material and/or a sinter catalyst material for the grains of superhard material. The aggregated mass of grains of superhard material and ceramic layer are subjected to a pressure of greater than 5.

Abstract: This invention relates to a weighing platform and a weighing system including such a weighing platform for dynamically weighing a flow of items while being conveyed over the weighing platform. The weighing platform includes one or more load sensors used in conjunction with two or more flat weighing sections adapted to be placed on the load sensors. A first support connects the adjacent ends of the two or more flat weighing sections so as to form a continuous 2-dimensional planar surface there between. A second support maintains the distal ends of the two or more weighing sections, when connected together via the first support, at fixed height so as to create a zero weighing sensitivity at the distal ends.

Abstract: Disclosed is a hexapod walking robot having a robot arm combined with a leg and a plurality of joints. The hexapod walking robot having a robot arm combined with a leg and a plurality of joints includes a robot body; a plurality of legs installed to the robot body such that the legs have various degrees of freedom; and at least one grip unit installed to at least one of the legs such that at least one grip unit is foldable.

Abstract: An agricultural tractor seeks to simplify a shaft support structure in a lower portion side of an elevating hydraulic cylinder which is externally installed to a rear side of a transmission case. The agricultural tractor of the present invention is provided with a travel machine body to which an engine and the transmission case are mounted, a lift arm which is provided in a rear portion side of an upper surface of the transmission case so as to freely oscillate up and down, the elevating hydraulic cylinder which oscillates up and down the lift arm, and rear axle cases which protrude laterally outward from the transmission case. An upper portion side of the elevating hydraulic cylinder is connected to the lift arm, and a lower portion side of the elevating hydraulic cylinder is supported to the travel machine body.

Abstract: A front end arrangement and airflow control method for a vehicle includes a radiator disposed in an engine compartment of the vehicle and a damper disposed below the radiator for selectively controlling recirculation through the radiator. The damper is movable between an open position wherein airflow from behind the radiator recirculates by passing forwardly under the radiator and again through the radiator, and a closed position wherein the airflow from behind the radiator is substantially prevented from passing forwardly under the radiator and recirculating through the radiator.